Inventor · disambiguated record
Naoyuki Koizumi
Also filed as: KOIZUMI NAOYUKI
41 granted patents·13 pending applications·509 citations·filing 1999–2022
98Inventor score
Top patents by PatentIndex Score
54 records- 0196US8120166B2Semiconductor package and method of manufacturing the same, and semiconductor device and method of manufacturing the sameKOIZUMI NAOYUKI·Filed 2009·Granted Feb 21, 2012·68 cites·9 claims
- 0293US6380061B1Process for fabricating bump electrodeSHINKO ELECTRIC IND CO·Filed 2000·Granted Apr 30, 2002·89 cites·13 claims
- 0390US9159648B2Wiring substrate and manufacturing method thereofSHINKO ELECTRIC IND CO·Filed 2013·Granted Oct 13, 2015·11 cites·16 claims
- 0489US9412687B2Wiring substrate and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2015·Granted Aug 9, 2016·6 cites·6 claims
- 0589US7825423B2Semiconductor device and method of manufacturing semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2007·Granted Nov 2, 2010·17 cites·12 claims
- 0688US6198169B1Semiconductor device and process for producing sameSHINKO ELECTRIC IND CO·Filed 1999·Granted Mar 6, 2001·88 cites·14 claims
- 0787US7838897B2Light-emitting device and method for manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2007·Granted Nov 23, 2010·14 cites·6 claims
- 0887US7605080B2Semiconductor device and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2006·Granted Oct 20, 2009·15 cites·5 claims
- 0987US7052975B2Semiconductor chip and fabrication method thereofSHINKO ELECTRIC IND CO·Filed 2003·Granted May 30, 2006·32 cites·6 claims
- 1084US7488094B2Semiconductor device and manufacturing method of semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2006·Granted Feb 10, 2009·12 cites·11 claims
- 1183US7494898B2Method for manufacturing semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2006·Granted Feb 24, 2009·11 cites·6 claims
- 1282US8907489B2Wiring substrate, method of manufacturing the same, and semiconductor deviceKUNIMOTO YUJI·Filed 2012·Granted Dec 9, 2014·5 cites·3 claims
- 1380US8692363B2Electric part package and manufacturing method thereofKOIZUMI NAOYUKI·Filed 2011·Granted Apr 8, 2014·6 cites·7 claims
- 1478US8148738B2Semiconductor device having an element mounted on a substrate and an electrical component connected to the elementMURAYAMA KEI·Filed 2007·Granted Apr 3, 2012·8 cites·12 claims
- 1576US7005747B2Semiconductor device having additional functional element and method of manufacturing thereofSHINKO ELECTRIC IND CO·Filed 2003·Granted Feb 28, 2006·24 cites·4 claims
- 1673US8111954B2Module substrate including optical transmission mechanism and method of producing the sameKOIZUMI NAOYUKI·Filed 2009·Granted Feb 7, 2012·6 cites·12 claims
- 1773US7834438B2Sealed structure and method of fabricating sealed structure and semiconductor device and method of fabricating semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2007·Granted Nov 16, 2010·5 cites·8 claims
- 1873US7655956B2Semiconductor device and method for manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2006·Granted Feb 2, 2010·5 cites·10 claims
- 1973US6974721B2Method for manufacturing thin semiconductor chipSHINKO ELECTRIC IND CO·Filed 2003·Granted Dec 13, 2005·19 cites·2 claims
- 2069US7067353B2Method for manufacturing semiconductor package having electrodes penetrating through semiconductor waferSHINKO ELECTRIC IND CO·Filed 2004·Granted Jun 27, 2006·12 cites·11 claims
- 2168US6872634B2Method of manufacturing micro-semiconductor elementSHINKO ELECTRIC IND CO·Filed 2003·Granted Mar 29, 2005·11 cites·4 claims
- 2266US6259038B1Semiconductor chip mounting board and method of inspecting the same mounting boardSHINKO ELECTRIC IND CO·Filed 1999·Granted Jul 10, 2001·30 cites·22 claims
- 2364US9078384B2Wiring substrate and method of manufacturing the sameFURUICHI JUN·Filed 2012·Granted Jul 7, 2015·2 cites·8 claims
- 2464US7786597B2Multilayer wiring board and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2008·Granted Aug 31, 2010·2 cites·13 claims
- 2564US7705451B2Semiconductor device and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2007·Granted Apr 27, 2010·1 cites·9 claims
- 2663US7622747B2Light emitting device and manufacturing method thereofSHINKO ELECTRIC IND CO·Filed 2006·Granted Nov 24, 2009·2 cites·2 claims
- 2762US8044429B2Light-emitting device and method for manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2010·Granted Oct 25, 2011·1 cites·4 claims
- 2862US7876036B2Light emitting apparatus and manufacturing method thereforSHINKO ELECTRIC IND CO·Filed 2006·Granted Jan 25, 2011·2 cites·4 claims
- 2960US11848224B2Electrostatic chuck and substrate fixing deviceSHINKO ELECTRIC IND CO·Filed 2022·Granted Dec 19, 2023·0 cites·10 claims
- 3059US11881794B2Electrostatic adsorption member and substrate fixing deviceSHINKO ELECTRIC IND CO·Filed 2022·Granted Jan 23, 2024·0 cites·11 claims
- 3159US8481863B2Substrate and method for manufacturing the sameSHIRAISHI AKINORI·Filed 2008·Granted Jul 9, 2013·2 cites·12 claims
- 3258US7708613B2Method of producing light emitting apparatusSHINKO ELECTRIC IND CO·Filed 2007·Granted May 4, 2010·1 cites·4 claims
- 3354US9198290B2Wiring substrate, method of manufacturing the same, and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2014·Granted Nov 24, 2015·0 cites·8 claims
- 3453US2009145648A1Multilayer wiring board, manufacturing method thereof, and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2008·Application pending·0 cites
- 3552US7470891B2Optical deviceSHINKO ELECTRIC IND CO·Filed 2007·Granted Dec 30, 2008·0 cites·8 claims
- 3650US8053680B2Wiring board having efficiently arranged padsSHINKO ELECTRIC IND CO·Filed 2009·Granted Nov 8, 2011·0 cites·5 claims
- 3749US9386695B2Wiring substrate having multiple core substratesSHINKO ELECTRIC IND CO·Filed 2013·Granted Jul 5, 2016·0 cites·6 claims
- 3848US9646926B2Wiring substrate and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2016·Granted May 9, 2017·0 cites·16 claims
- 3948US2005200004A1Semiconductor chip and fabrication method thereofFiled 2005·Application pending·0 cites
- 4047US7963031B2Package for semiconductor device and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2008·Granted Jun 21, 2011·0 cites·5 claims
- 4147US7897510B2Semiconductor device package, semiconductor apparatus, and methods for manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2007·Granted Mar 1, 2011·0 cites·8 claims
- 4246US2009133917A1Multilayered Circuit Board for Connection to BumpsSHINKO ELECTRIC IND CO·Filed 2008·Application pending·0 cites
- 4345US2006073701A1Method of manufacturing a substrate with through electrodesSHINKO ELECTRIC IND CO·Filed 2005·Application pending·0 cites
- 4445US2008150162A1Semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2007·Application pending·0 cites
- 4545US2008150109A1Electronic componentSHINKO ELECTRIC IND CO·Filed 2007·Application pending·0 cites
- 4644US7330037B2Electrical characteristic measuring probe and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2004·Granted Feb 12, 2008·2 cites·13 claims
- 4744US2007176197A1Semiconductor device and method of manufacturing semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2007·Application pending·0 cites
- 4844US2009145649A1Multi-layered wiring substrate, method for producing the same, and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2008·Application pending·0 cites
- 4944US2007241451A1Electronic component deviceSHINKO ELECTRIC IND CO·Filed 2007·Application pending·0 cites
- 5044US2007161316A1Method of manufacturing light emitting apparatusTAGUCHI YUICHI·Filed 2006·Application pending·0 cites
Showing the top 50 of 54 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Naoyuki Koizumi files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →