Inventor · disambiguated record
Naoyuki Koyama
Also filed as: KOYAMA NAOYUKI
20 granted patents·7 pending applications·230 citations·filing 1987–2016
95Inventor score
Top patents by PatentIndex Score
27 records- 0192US6786945B2Polishing compound and method for polishing substrateHITACHI CHEMICAL CO LTD·Filed 2002·Granted Sep 7, 2004·83 cites·44 claims
- 0288US8002860B2CMP abrasive, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for CMP abrasiveHITACHI CHEMICAL CO LTD·Filed 2009·Granted Aug 23, 2011·12 cites·25 claims
- 0387US7837800B2CMP polishing slurry and polishing methodHITACHI CHEMICAL CO LTD·Filed 2008·Granted Nov 23, 2010·10 cites·8 claims
- 0484US8617275B2Polishing agent and method for polishing substrate using the polishing agentHOSHI YOUSUKE·Filed 2009·Granted Dec 31, 2013·8 cites·20 claims
- 0576US7838482B2CMP polishing compound and polishing methodHITACHI CHEMICAL CO LTD·Filed 2004·Granted Nov 23, 2010·15 cites·9 claims
- 0674US10040971B2Polishing agent and method for polishing substrate using the polishing agentHITACHI CHEMICAL CO LTD·Filed 2016·Granted Aug 7, 2018·1 cites·17 claims
- 0771US8168541B2CMP polishing slurry and polishing methodFUKASAWA MASATO·Filed 2010·Granted May 1, 2012·2 cites·16 claims
- 0869US8226849B2Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the sameUCHIDA TAKESHI·Filed 2006·Granted Jul 24, 2012·2 cites·18 claims
- 0969US6642917B1Sign perception system, game system, and computer-readable recording medium having game program recorded thereonNAMCO LTD·Filed 2000·Granted Nov 4, 2003·17 cites·7 claims
- 1066US7410409B1Abrasive compound for CMP, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for CMP abrasive compoundHITACHI CHEMICAL CO LTD·Filed 2000·Granted Aug 12, 2008·9 cites·19 claims
- 1165US8075800B2Polishing slurry and polishing methodKOYAMA NAOYUKI·Filed 2004·Granted Dec 13, 2011·13 cites·15 claims
- 1265US7799686B2Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the sameHITACHI LTD·Filed 2007·Granted Sep 21, 2010·1 cites·35 claims
- 1362US9293344B2Cmp polishing slurry and method of polishing substrateFUKASAWA MASATO·Filed 2005·Granted Mar 22, 2016·2 cites·16 claims
- 1462US4756284AIntake system for internal combustion engineMAZDA MOTOR·Filed 1987·Granted Jul 12, 1988·18 cites·23 claims
- 1559US8524111B2CMP abrasive slurry for polishing insulation film, polishing method, and semiconductor electronic part polished by the polishing methodFUKASAWA MASATO·Filed 2007·Granted Sep 3, 2013·1 cites·30 claims
- 1659US7250369B1Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the sameHITACHI CHEMICAL CO LTD·Filed 1999·Granted Jul 31, 2007·16 cites·13 claims
- 1756US9165777B2Polishing agent and method for polishing substrate using the polishing agentHITACHI CHEMICAL CO LTD·Filed 2013·Granted Oct 20, 2015·0 cites·18 claims
- 1855US8900477B2Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the sameUCHIDA TAKESHI·Filed 2008·Granted Dec 2, 2014·0 cites·36 claims
- 1954US4979181AVacuum laser irradiating apparatusNISSAN MOTOR·Filed 1990·Granted Dec 18, 1990·20 cites·10 claims
- 2054US2015135992A1Resin composition, molded body and composite molded bodyHITACHI CHEMICAL CO LTD·Filed 2015·Application pending·0 cites
- 2153US2015361303A1Polishing agent and method for polishing substrate using the polishing agentHITACHI CHEMICAL CO LTD·Filed 2015·Application pending·0 cites
- 2249US8900335B2CMP polishing slurry and method of polishing substrateFUKASAWA MASATO·Filed 2010·Granted Dec 2, 2014·0 cites·8 claims
- 2348US2008254717A1Cmp Polishing Slurry and Method of Polishing SubstrateHITACHI CHEMICAL CO LTD·Filed 2005·Application pending·0 cites
- 2447US2007169421A1CMP abrasive, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for CMP abrasiveKOYAMA NAOYUKI·Filed 2007·Application pending·0 cites
- 2543US2012302699A1Resin composition, molded body and composite molded bodyKOBUNE MIKA·Filed 2011·Application pending·0 cites
- 2641US2007270085A1Chemical mechanical polishing slurry, cmp process and electronic device processOTA RYO·Filed 2007·Application pending·0 cites
- 2741US2007218811A1Cmp polishing slurry and method of polishing substrateHITACHI CHEMICAL CO LTD·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →