Inventor · disambiguated record
Nan-Chun Lin
Also filed as: LIN NAN · LIN NAN-CHUN · LIN NAN-CHUN LIN
58 granted patents·20 pending applications·145 citations·filing 2008–2024
98Inventor score
Top patents by PatentIndex Score
78 records- 0198US10157828B2Chip package structure with conductive pillar and a manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2017·Granted Dec 18, 2018·53 cites·14 claims
- 0296US11127699B2Chip package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2020·Granted Sep 21, 2021·4 cites·18 claims
- 0395US11569210B2Package structure having a first connection circuit and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2021·Granted Jan 31, 2023·4 cites·19 claims
- 0492US10515936B1Package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2018·Granted Dec 24, 2019·10 cites·8 claims
- 0589US11309283B2Packaging structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2020·Granted Apr 19, 2022·2 cites·14 claims
- 0689US10079218B1Test method for a redistribution layerPOWERTECH TECHNOLOGY INC·Filed 2017·Granted Sep 18, 2018·7 cites·20 claims
- 0786US10593647B2Package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2018·Granted Mar 17, 2020·4 cites·9 claims
- 0886US8541877B2Electronic device package and method for fabricating the sameTSAI CHIA-LUN·Filed 2010·Granted Sep 24, 2013·9 cites·26 claims
- 0985US11309296B2Semiconductor package and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2019·Granted Apr 19, 2022·4 cites·13 claims
- 1084US10141276B2Semiconductor package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2017·Granted Nov 27, 2018·3 cites·9 claims
- 1183US10796931B2Manufacturing method of package structurePOWERTECH TECHNOLOGY INC·Filed 2019·Granted Oct 6, 2020·3 cites·15 claims
- 1282US11009748B2Display deviceINNOLUX CORP·Filed 2019·Granted May 18, 2021·2 cites·17 claims
- 1382US10950593B2Package structure including at least one connecting module and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2018·Granted Mar 16, 2021·3 cites·13 claims
- 1482US8619431B2Three-dimensional system-in-package package-on-package structureLIN NAN-CHUN·Filed 2010·Granted Dec 31, 2013·10 cites·16 claims
- 1580US10978408B2Semiconductor package and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2018·Granted Apr 13, 2021·3 cites·13 claims
- 1680US10269671B2Package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2017·Granted Apr 23, 2019·3 cites·20 claims
- 1779US10304716B1Package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2017·Granted May 28, 2019·4 cites·19 claims
- 1878US11088100B2Semiconductor package and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2019·Granted Aug 10, 2021·2 cites·20 claims
- 1978US10332844B2Manufacturing method of package structurePOWERTECH TECHNOLOGY INC·Filed 2017·Granted Jun 25, 2019·2 cites·10 claims
- 2076US10629559B2Semiconductor package and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2018·Granted Apr 21, 2020·2 cites·10 claims
- 2174US10276526B2Semiconductor package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2018·Granted Apr 30, 2019·1 cites·11 claims
- 2273US11557533B2Package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2020·Granted Jan 17, 2023·0 cites·16 claims
- 2373US11456243B2Semiconductor package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2020·Granted Sep 27, 2022·0 cites·19 claims
- 2473US11211321B2Package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2020·Granted Dec 28, 2021·0 cites·17 claims
- 2572US11545424B2Package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2020·Granted Jan 3, 2023·0 cites·14 claims
- 2672US11532575B2Integrated antenna package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2019·Granted Dec 20, 2022·1 cites·19 claims
- 2772US11367678B2Package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2020·Granted Jun 21, 2022·0 cites·16 claims
- 2870US10840200B2Manufacturing method of chip package structure comprising encapsulant having concave surfacePOWERTECH TECHNOLOGY INC·Filed 2018·Granted Nov 17, 2020·1 cites·15 claims
- 2970US10002848B1Test method for a redistribution layerPOWERTECH TECHNOLOGY INC·Filed 2017·Granted Jun 19, 2018·1 cites·22 claims
- 3069US10629554B2Package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2018·Granted Apr 21, 2020·1 cites·7 claims
- 3168US11088080B2Chip package structure using silicon interposer as interconnection bridgePOWERTECH TECHNOLOGY INC·Filed 2019·Granted Aug 10, 2021·1 cites·10 claims
- 3266US10438931B2Package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2018·Granted Oct 8, 2019·1 cites·13 claims
- 3364US9082943B2Optoelectronic package and method of manufacturing the sameAPTOS TECHNOLOGY INC·Filed 2013·Granted Jul 14, 2015·2 cites·22 claims
- 3464US8293572B2Injection molding system and method of chip packageCHEN WEN-CHUAN·Filed 2011·Granted Oct 23, 2012·2 cites·24 claims
- 3562US11296041B2Integrated antenna package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2019·Granted Apr 5, 2022·0 cites·8 claims
- 3660US2024339443A1Package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 3759US10756065B2Method thereof of package structurePOWERTECH TECHNOLOGY INC·Filed 2020·Granted Aug 25, 2020·0 cites·16 claims
- 3859US9799588B2Chip package and manufacturing method thereofXINTEC INC·Filed 2014·Granted Oct 24, 2017·0 cites·13 claims
- 3958US12400979B2Integrated antenna package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2022·Granted Aug 26, 2025·0 cites·17 claims
- 4058US12171624B1Automatic grinding drill device for oral cariesUNIV SICHUAN·Filed 2024·Granted Dec 24, 2024·0 cites·6 claims
- 4157US8822325B2Chip package and fabrication method thereofXINTEC INC·Filed 2013·Granted Sep 2, 2014·0 cites·11 claims
- 4255US11211350B2Semiconductor package and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2019·Granted Dec 28, 2021·0 cites·18 claims
- 4355US2023290730A1Package device and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 4454US11670611B2Semiconductor package comprising plurality of bumps and fabricating methodPOWERTECH TECHNOLOGY INC·Filed 2021·Granted Jun 6, 2023·0 cites·11 claims
- 4554US11637071B2Package structure including multiple dies surrounded by conductive element and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2021·Granted Apr 25, 2023·0 cites·17 claims
- 4653US11916035B2Package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2021·Granted Feb 27, 2024·0 cites·18 claims
- 4753US11769763B2Package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2021·Granted Sep 26, 2023·0 cites·14 claims
- 4852US12154863B2Fan-out semiconductor package and method for manufacturing the samePOWERTECH TECHNOLOGY INC·Filed 2021·Granted Nov 26, 2024·0 cites·12 claims
- 4952US11251170B2Package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2019·Granted Feb 15, 2022·0 cites·20 claims
- 5052US2019043806A1Method of manufacturing chip package structure with conductive pillarPOWERTECH TECHNOLOGY INC·Filed 2018·Application pending·0 cites
Showing the top 50 of 78 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →