Inventor · disambiguated record
Nai-Wei Liu
Also filed as: LIU NAI-WEI
45 granted patents·16 pending applications·3,266 citations·filing 2010–2024
98Inventor score
Files withMEDIATEK INC40TAIWAN SEMICONDUCTOR MFG CO LTD12TAIWAN SEMICONDUCTOR MFG5HUNG JUI-PIN1LIN JING-CHENG1
Top patents by PatentIndex Score
61 records- 0199US8829676B2Interconnect structure for wafer level packageYU CHEN-HUA·Filed 2011·Granted Sep 9, 2014·610 cites·20 claims
- 0298US11410936B2Semiconductor package structureMEDIATEK INC·Filed 2020·Granted Aug 9, 2022·7 cites·10 claims
- 0398US9064879B2Packaging methods and structures using a die attach filmHUNG JUI-PIN·Filed 2011·Granted Jun 23, 2015·836 cites·20 claims
- 0498US9000584B2Packaged semiconductor device with a molding compound and a method of forming the sameLIN JING-CHENG·Filed 2011·Granted Apr 7, 2015·1k cites·20 claims
- 0597US9461018B1Fan-out PoP structure with inconsecutive polymer layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 4, 2016·671 cites·20 claims
- 0696US12136597B2Semiconductor package having an interposer in which one or more dies are formed and method of forming the sameMEDIATEK INC·Filed 2021·Granted Nov 5, 2024·4 cites·31 claims
- 0796US9553000B2Interconnect structure for wafer level packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jan 24, 2017·13 cites·20 claims
- 0895US9824989B2Fan-out package and methods of forming thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 21, 2017·16 cites·20 claims
- 0993US11742564B2Fan-out package structure with integrated antennaMEDIATEK INC·Filed 2021·Granted Aug 29, 2023·2 cites·5 claims
- 1093US11574881B2Semiconductor package structure with antennaMEDIATEK INC·Filed 2021·Granted Feb 7, 2023·2 cites·13 claims
- 1193US10083913B2Fan-out POP structure with inconsecutive polymer layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 25, 2018·10 cites·20 claims
- 1293US9978657B2Semiconductor package device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 22, 2018·7 cites·19 claims
- 1392US11948895B2Semiconductor package structureMEDIATEK INC·Filed 2022·Granted Apr 2, 2024·1 cites·9 claims
- 1491US11081453B2Semiconductor package structure with antennaMEDIATEK INC·Filed 2019·Granted Aug 3, 2021·6 cites·16 claims
- 1591US10784211B2Semiconductor package structureMEDIATEK INC·Filed 2018·Granted Sep 22, 2020·5 cites·20 claims
- 1691US10483211B2Fan-out package structure and method for forming the sameMEDIATEK INC·Filed 2017·Granted Nov 19, 2019·8 cites·28 claims
- 1789US11043730B2Fan-out package structure with integrated antennaMEDIATEK INC·Filed 2019·Granted Jun 22, 2021·5 cites·19 claims
- 1889US10692789B2Stacked fan-out package structureMEDIATEK INC·Filed 2018·Granted Jun 23, 2020·5 cites·15 claims
- 1988US11652273B2Innovative air gap for antenna fan out packageMEDIATEK INC·Filed 2022·Granted May 16, 2023·1 cites·17 claims
- 2087US11024954B2Semiconductor package with antenna and fabrication method thereofMEDIATEK INC·Filed 2019·Granted Jun 1, 2021·5 cites·25 claims
- 2185US9230902B2Interconnect structure for wafer level packageTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jan 5, 2016·5 cites·20 claims
- 2284US11450606B2Chip scale package structure and method of forming the sameMEDIATEK INC·Filed 2019·Granted Sep 20, 2022·3 cites·11 claims
- 2383US9312148B2Method of packaging a semiconductor deviceTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Apr 12, 2016·3 cites·20 claims
- 2483US8975749B2Method of making a semiconductor device including barrier layers for copper interconnectTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Mar 10, 2015·5 cites·20 claims
- 2581US11508678B2Semiconductor package structure including antennaMEDIATEK INC·Filed 2020·Granted Nov 22, 2022·1 cites·20 claims
- 2680US11728292B2Semiconductor package assembly having a conductive electromagnetic shield layerMEDIATEK INC·Filed 2020·Granted Aug 15, 2023·1 cites·18 claims
- 2779US8653664B2Barrier layers for copper interconnectLIU NAI-WEI·Filed 2010·Granted Feb 18, 2014·6 cites·20 claims
- 2876US9466581B2Semiconductor package device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Oct 11, 2016·2 cites·19 claims
- 2973US11824020B2Semiconductor package structure including antennaMEDIATEK INC·Filed 2022·Granted Nov 21, 2023·0 cites·20 claims
- 3071US11532577B2Fan-out package and methods of forming thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 20, 2022·0 cites·20 claims
- 3171US10957611B2Semiconductor package including lid structure with opening and recessMEDIATEK INC·Filed 2018·Granted Mar 23, 2021·1 cites·24 claims
- 3269US11854784B2Chip scale package structure and method of forming the sameMEDIATEK INC·Filed 2022·Granted Dec 26, 2023·0 cites·12 claims
- 3369US10199318B2Semiconductor package assemblyMEDIATEK INC·Filed 2017·Granted Feb 5, 2019·1 cites·28 claims
- 3469US9953907B2PoP deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Apr 24, 2018·2 cites·19 claims
- 3568US11791266B2Chip scale package structure and method of forming the sameMEDIATEK INC·Filed 2022·Granted Oct 17, 2023·0 cites·16 claims
- 3665US11688655B2Semiconductor package including lid structure with opening and recessMEDIATEK INC·Filed 2021·Granted Jun 27, 2023·0 cites·19 claims
- 3765US9941260B2Fan-out package structure having embedded package substrateMEDIATEK INC·Filed 2016·Granted Apr 10, 2018·1 cites·26 claims
- 3863US10741511B2Fan-out package and methods of forming thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 11, 2020·0 cites·20 claims
- 3962US10522439B2Semiconductor package deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 31, 2019·0 cites·20 claims
- 4061US2024297120A1Semiconductor package structureMEDIATEK INC·Filed 2024·Application pending·0 cites
- 4159US2020312732A1Chip scale package structure and method of forming the sameMEDIATEK INC·Filed 2020·Application pending·0 cites
- 4258US10366960B2Fan-out package and methods of forming thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 30, 2019·0 cites·20 claims
- 4358US2024038614A1Semiconductor package structureMEDIATEK INC·Filed 2023·Application pending·0 cites
- 4457US10468341B2Semiconductor package assemblyMEDIATEK INC·Filed 2018·Granted Nov 5, 2019·0 cites·28 claims
- 4557US2023387075A1Semiconductor packageMEDIATEK INC·Filed 2023·Application pending·0 cites
- 4657US2024290737A1Bump structure and fabrication method thereofMEDIATEK INC·Filed 2024·Application pending·0 cites
- 4756US2024274517A1Semiconductor package structure, method of forming the same and semiconductor package assembly having the sameMEDIATEK INC·Filed 2024·Application pending·0 cites
- 4856US2019348747A1Innovative air gap for antenna fan out packageMEDIATEK INC·Filed 2019·Application pending·0 cites
- 4956US2024178112A1Semiconductor package structure and method of forming the sameMEDIATEK INC·Filed 2023·Application pending·0 cites
- 5053US8994171B2Method and apparatus for a conductive pillar structureTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 31, 2015·0 cites·20 claims
Showing the top 50 of 61 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →