Inventor · disambiguated record
Naoaki Ogure
Also filed as: OGURE NAOAKI
34 granted patents·7 pending applications·1,011 citations·filing 1985–2006
98Inventor score
Top patents by PatentIndex Score
41 records- 0196US6387182B1Apparatus and method for processing substrateEBARA CORP·Filed 2000·Granted May 14, 2002·113 cites·19 claims
- 0291US6921722B2Coating, modification and etching of substrate surface with particle beam irradiation of the sameEBARA CORP·Filed 2001·Granted Jul 26, 2005·56 cites·24 claims
- 0390US6294059B1Substrate plating apparatusEBARA CORP·Filed 1998·Granted Sep 25, 2001·83 cites·72 claims
- 0487US6005183ADevice containing solar cell panel and storage batteryEBARA CORP·Filed 1996·Granted Dec 21, 1999·96 cites·13 claims
- 0586US6651871B2Substrate coated with a conductive layer and manufacturing method thereofEBARA CORP·Filed 2002·Granted Nov 25, 2003·31 cites·7 claims
- 0685US6036783ALiquid material vaporizer apparatus and gas ejection deviceEBARA CORP·Filed 1997·Granted Mar 14, 2000·63 cites·20 claims
- 0784US6558518B1Method and apparatus for plating substrate and plating facilityEBARA CORP·Filed 2000·Granted May 6, 2003·36 cites·17 claims
- 0884US5862605AVaporizer apparatusEBARA CORP·Filed 1997·Granted Jan 26, 1999·62 cites·38 claims
- 0981US7799425B2Composite nanoparticles method for producing the sameEBARA CORP·Filed 2005·Granted Sep 21, 2010·12 cites·13 claims
- 1081US6730596B1Method of and apparatus for forming interconnectionEBARA CORP·Filed 2000·Granted May 4, 2004·19 cites·9 claims
- 1179US5630881AThin-film forming apparatus with magnetic bearings and a non-contact seal and driveEBARA CORP·Filed 1994·Granted May 20, 1997·65 cites·18 claims
- 1278US6365017B1Substrate plating deviceEBARA CORP·Filed 1999·Granted Apr 2, 2002·31 cites·34 claims
- 1377US6486413B1Substrate coated with a conductive layer and manufacturing method thereofEBARA CORP·Filed 2000·Granted Nov 26, 2002·17 cites·13 claims
- 1474US5225000AMethod for cleaning closed spaces with ultraviolet raysEBARA RES CO LTD·Filed 1991·Granted Jul 6, 1993·33 cites·1 claims
- 1573US6972256B2Method and apparatus for forming thin film of metalEBARA CORP·Filed 2000·Granted Dec 6, 2005·17 cites·8 claims
- 1673US6147408AMethod of forming embedded copper interconnections and embedded copper interconnection structureEBARA CORP·Filed 1998·Granted Nov 14, 2000·31 cites·9 claims
- 1772US6793794B2Substrate plating apparatus and methodEBARA CORP·Filed 2002·Granted Sep 21, 2004·7 cites·8 claims
- 1870US5829156ASpin dryer apparatusEBARA CORP·Filed 1997·Granted Nov 3, 1998·40 cites·31 claims
- 1969US6709555B1Plating method, interconnection forming method, and apparatus for carrying out those methodsEBARA CORP·Filed 2000·Granted Mar 23, 2004·12 cites·13 claims
- 2069US5705230AMethod for filling small holes or covering small recesses in the surface of substratesEBARA CORP·Filed 1994·Granted Jan 6, 1998·43 cites·3 claims
- 2167US5820649AMethod of and apparatus for continuously producing a solid materialEBARA CORP·Filed 1997·Granted Oct 13, 1998·27 cites·5 claims
- 2266US6787467B2Method of forming embedded copper interconnections and embedded copper interconnection structureEBARA CORP·Filed 2002·Granted Sep 7, 2004·7 cites·11 claims
- 2364US6455475B1Sliding member and process for producing the sameEBARA CORP·Filed 2000·Granted Sep 24, 2002·8 cites·6 claims
- 2464US6054714AElectron-beam irradiation apparatusEBARA CORP·Filed 1997·Granted Apr 25, 2000·16 cites·20 claims
- 2561US6458694B2High energy sputtering method for forming interconnectsEBARA CORP·Filed 2001·Granted Oct 1, 2002·7 cites·8 claims
- 2658US5656542AMethod for manufacturing wiring in grooveTOSHIBA KK·Filed 1995·Granted Aug 12, 1997·25 cites·10 claims
- 2752US6929722B2Substrate plating apparatusEBARA CORP·Filed 2001·Granted Aug 16, 2005·2 cites·49 claims
- 2848US2006144714A1Substrate plating method and apparatusHONGO AKIHISA·Filed 2006·Application pending·0 cites
- 2946US6573201B1Method and apparatus for protection of substrate surfaceEBARA CORP·Filed 1999·Granted Jun 3, 2003·11 cites·4 claims
- 3045US7033463B1Substrate plating method and apparatusEBARA CORP·Filed 1999·Granted Apr 25, 2006·10 cites·14 claims
- 3145US2008271911A1Submerged Electrode and Material ThereofEBARA CORP·Filed 2004·Application pending·0 cites
- 3244US2006118598A1Bonding apparatus and bonding methodEBARA CORP·Filed 2005·Application pending·0 cites
- 3343US6495004B1Substrate plating apparatusEBARA CORP·Filed 1999·Granted Dec 17, 2002·9 cites·16 claims
- 3443US2004163947A1Substrate plating apparatusFiled 2004·Application pending·0 cites
- 3542US2005254998A1Reactive detection chip and spotter suitable for manufacturing the chipEBARA CORP·Filed 2005·Application pending·0 cites
- 3641US6391775B1Method of forming embedded copper interconnections and embedded copper interconnection structureEBARA CORP·Filed 2000·Granted May 21, 2002·0 cites·4 claims
- 3741US5500559ASemiconductor device and method for manufacturing the sameTOSHIBA KK·Filed 1994·Granted Mar 19, 1996·11 cites·5 claims
- 3836US2004245648A1Bonding material and bonding methodFiled 2003·Application pending·0 cites
- 3934US6432257B1Dresser for polishing cloth and method for manufacturing such dresser and polishing apparatusEBARA CORP·Filed 1998·Granted Aug 13, 2002·6 cites·26 claims
- 4032US4861395AMethod of using machine parts made of austenitic cast iron having resistance to stress corrosion cracking in contact with salt waterEBARA CORP·Filed 1985·Granted Aug 29, 1989·5 cites·3 claims
- 4132US2006076387A1Joining method and apparatusOGURE NAOAKI·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →