Inventor · disambiguated record
Naomichi Ohashi
Also filed as: OHASHI NAOMICHI
14 granted patents·9 pending applications·21 citations·filing 2008–2023
86Inventor score
Top patents by PatentIndex Score
23 records- 0184US9331047B2Mounting method and mounting structure for semiconductor package componentOHASHI NAOMICHI·Filed 2013·Granted May 3, 2016·9 cites·3 claims
- 0274US11970631B2Conductive paste and conductive film formed using the samePANASONIC IP MAN CO LTD·Filed 2022·Granted Apr 30, 2024·0 cites·5 claims
- 0371US12508677B2Solder paste and bonded structurePANASONIC IP MAN CO LTD·Filed 2023·Granted Dec 30, 2025·0 cites·7 claims
- 0471US9603295B2Mounted structure and manufacturing method of mounted structureYAMAGUCHI ATSUSHI·Filed 2012·Granted Mar 21, 2017·3 cites·13 claims
- 0570US8450859B2Semiconductor device mounted structure and its manufacturing methodOHASHI NAOMICHI·Filed 2009·Granted May 28, 2013·5 cites·12 claims
- 0663US11618110B2Solder paste and mounting structurePANASONIC IP MAN CO LTD·Filed 2020·Granted Apr 4, 2023·0 cites·6 claims
- 0762US8540903B2Electrically conductive paste, and electrical and electronic device comprising the sameHIGUCHI TAKAYUKI·Filed 2008·Granted Sep 24, 2013·3 cites·6 claims
- 0857US8182923B2Conductive paste and mounting structure using the sameOHASHI NAOMICHI·Filed 2009·Granted May 22, 2012·1 cites·17 claims
- 0954US2015187977A1Solar cell modulePANASONIC IP MAN CO LTD·Filed 2013·Application pending·0 cites
- 1054US2021121992A1Solder paste and joining structurePANASONIC IP MAN CO LTD·Filed 2020·Application pending·0 cites
- 1153US12028986B2Mounting method and mounting structure formed by the samePANASONIC IP MAN CO LTD·Filed 2021·Granted Jul 2, 2024·0 cites·6 claims
- 1253US10407604B2Heat-dissipating resin composition, and component and electronic device including the samePANASONIC IP MAN CO LTD·Filed 2015·Granted Sep 10, 2019·0 cites·16 claims
- 1346US2021309829A1Curable resin composition and mounting structurePANASONIC IP MAN CO LTD·Filed 2019·Application pending·0 cites
- 1445US10440834B2Resin fluxed solder paste, and mount structurePANASONIC IP MAN CO LTD·Filed 2016·Granted Oct 8, 2019·0 cites·1 claims
- 1541US2011108997A1Mounting method and mounting structure for semiconductor package componentPANASONIC CORP·Filed 2010·Application pending·0 cites
- 1640US2019232438A1Solder paste and mount structurePANASONIC IP MAN CO LTD·Filed 2018·Application pending·0 cites
- 1740US2018229333A1Solder paste and mount structure obtained by using samePANASONIC IP MAN CO LTD·Filed 2018·Application pending·0 cites
- 1838US8664773B2Mounting structure of semiconductor package component and manufacturing method thereforYAMAGUCHI ATSUSHI·Filed 2012·Granted Mar 4, 2014·0 cites·4 claims
- 1937US2010101845A1Electronic Device and Manufacturing Method for Electronic DeviceKISHI ARATA·Filed 2009·Application pending·0 cites
- 2037US2017345960A1Solar cell module and method of manufacture thereofPANASONIC IP MAN CO LTD·Filed 2017·Application pending·0 cites
- 2136US9881813B2Mounting structure and method for producing mounting structurePANASONIC IP MAN CO LTD·Filed 2016·Granted Jan 30, 2018·0 cites·6 claims
- 2235US2017120396A1Solder paste and soldering flux, and mounted structure using samePANASONIC IP MAN CO LTD·Filed 2016·Application pending·0 cites
- 2333US8940198B2Conductive adhesive, and circuit board and electronic component module using the sameKISHI ARATA·Filed 2011·Granted Jan 27, 2015·0 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →