Inventor · disambiguated record
Naotaka Tanaka
Also filed as: TANAKA NAOTAKA
46 granted patents·13 pending applications·1,630 citations·filing 1993–2016
99Inventor score
Files withHITACHI LTD26RENESAS TECH CORP11RENESAS ELECTRONICS CORP5KAWASHITA MICHIHIRO4TESSERA ADVANCED TECHNOLOGIES INC2
Top patents by PatentIndex Score
59 records- 0199US5608265AEncapsulated semiconductor device package having holes for electrically conductive materialHITACHI LTD·Filed 1994·Granted Mar 4, 1997·567 cites·54 claims
- 0298US9691739B2Semiconductor device and method of manufacturing sameTESSERA ADVANCED TECH INC·Filed 2016·Granted Jun 27, 2017·35 cites·18 claims
- 0397US9318418B2Semiconductor device and method of manufacturing sameTESSERA ADVANCED TECHNOLOGIES INC·Filed 2015·Granted Apr 19, 2016·35 cites·15 claims
- 0497US9076700B2Semiconductor device and method of manufacturing sameTESSERA ADVANCED TECHNOLOGIES INC·Filed 2014·Granted Jul 7, 2015·35 cites·17 claims
- 0597US8816506B2Semiconductor device and method of manufacturing the sameKAWASHITA MICHIHIRO·Filed 2011·Granted Aug 26, 2014·41 cites·19 claims
- 0697US7291929B2Semiconductor device and method of manufacturing thereofRENESAS TECH CORP·Filed 2006·Granted Nov 6, 2007·61 cites·12 claims
- 0794US7973415B2Manufacturing process and structure of through silicon viaRENESAS ELECTRONICS CORP·Filed 2008·Granted Jul 5, 2011·34 cites·20 claims
- 0894US7253527B2Semiconductor chip production method, semiconductor device production method, semiconductor chip, and semiconductor deviceRENESAS TECH CORP·Filed 2006·Granted Aug 7, 2007·34 cites·7 claims
- 0994US6028364ASemiconductor device having a stress relieving mechanismHITACHI LTD·Filed 1995·Granted Feb 22, 2000·167 cites·19 claims
- 1093US8324736B2Manufacturing process and structure of through silicon viaKAWASHITA MICHIHIRO·Filed 2011·Granted Dec 4, 2012·19 cites·8 claims
- 1193US5569960AElectronic component, electronic component assembly and electronic component unitHITACHI LTD·Filed 1995·Granted Oct 29, 1996·105 cites·38 claims
- 1291US7656030B2Semiconductor deviceRENESAS TECH CORP·Filed 2007·Granted Feb 2, 2010·28 cites·6 claims
- 1389US7759161B2Semiconductor device and method of manufacturing thereofRENESAS TECH CORP·Filed 2006·Granted Jul 20, 2010·19 cites·1 claims
- 1488US6897570B2Semiconductor device and method of manufacturing sameRENESAS TECH CORP·Filed 2003·Granted May 24, 2005·54 cites·19 claims
- 1587US7432594B2Semiconductor chip, electrically connections thereforRENESAS TECH CORP·Filed 2005·Granted Oct 7, 2008·17 cites·18 claims
- 1687US7365426B2Semiconductor deviceRENESAS TECH CORP·Filed 2006·Granted Apr 29, 2008·12 cites·24 claims
- 1783US8110900B2Manufacturing process of semiconductor device and semiconductor deviceYOSHIMURA YASUHIRO·Filed 2009·Granted Feb 7, 2012·11 cites·5 claims
- 1883US6423571B2Method of making a semiconductor device having a stress relieving mechanismHITACHI LTD·Filed 2001·Granted Jul 23, 2002·35 cites·19 claims
- 1982US7122457B2Semiconductor chip production method, semiconductor device production method, semiconductor chip, and semiconductor deviceROHM CO LTD·Filed 2004·Granted Oct 17, 2006·30 cites·8 claims
- 2079US5895965ASemiconductor deviceHITACHI LTD·Filed 1997·Granted Apr 20, 1999·58 cites·3 claims
- 2178US8106518B2Semiconductor device and method of manufacturing the sameKAWASHITA MICHIHIRO·Filed 2009·Granted Jan 31, 2012·5 cites·20 claims
- 2278US7906848B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2009·Granted Mar 15, 2011·8 cites·16 claims
- 2375US6314819B1Method for measuring adhesion strength of resin materialHITACHI LTD·Filed 2000·Granted Nov 13, 2001·7 cites·8 claims
- 2471US7897509B2Semiconductor wafer and method of manufacturing the same and method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2010·Granted Mar 1, 2011·3 cites·6 claims
- 2571US6911733B2Semiconductor device and electronic deviceHITACHI LTD·Filed 2003·Granted Jun 28, 2005·15 cites·16 claims
- 2671US6727583B2Semiconductor deviceHITACHI LTD·Filed 2002·Granted Apr 27, 2004·13 cites·33 claims
- 2766US5537884AMethod for measuring adhesion strength of resin materialHITACHI LTD·Filed 1994·Granted Jul 23, 1996·18 cites·21 claims
- 2865US8178977B2Semiconductor device and method of manufacturing the sameKAWASHITA MICHIHIRO·Filed 2009·Granted May 15, 2012·3 cites·10 claims
- 2965US7057278B2Semiconductor deviceHITACHI LTD·Filed 2003·Granted Jun 6, 2006·9 cites·21 claims
- 3064US6911734B2Semiconductor device and electronic deviceHITACHI LTD·Filed 2003·Granted Jun 28, 2005·10 cites·6 claims
- 3162US6646350B2Semiconductor deviceHITACHI LTD·Filed 2001·Granted Nov 11, 2003·11 cites·12 claims
- 3262US6049128ASemiconductor deviceHITACHI LTD·Filed 1997·Granted Apr 11, 2000·21 cites·10 claims
- 3362US5359899AMethod for measuring adhesion strength of resin materialHITACHI LTD·Filed 1993·Granted Nov 1, 1994·15 cites·5 claims
- 3461US6800945B2Multi-chip semiconductor device with specific chip arrangementHITACHI LTD·Filed 2002·Granted Oct 5, 2004·8 cites·18 claims
- 3561US6130112ASemiconductor deviceHITACHI LTD·Filed 1998·Granted Oct 10, 2000·20 cites·7 claims
- 3661US5637914ALead frame and semiconductor device encapsulated by resinHITACHI LTD·Filed 1995·Granted Jun 10, 1997·24 cites·38 claims
- 3760US7692296B2Semiconductor device and multilayer substrate thereforHITACHI CHEMICAL CO LTD·Filed 2005·Granted Apr 6, 2010·2 cites·13 claims
- 3853US6465876B1Semiconductor device and lead frame thereforHITACHI LTD·Filed 1997·Granted Oct 15, 2002·16 cites·5 claims
- 3948US2007176266A1Semiconductor deviceRENESAS TECH CORP·Filed 2006·Application pending·0 cites
- 4048US2007187823A1Semiconductor deviceTANAKA NAOTAKA·Filed 2007·Application pending·0 cites
- 4147US6844219B2Semiconductor device and lead frame thereforRENESAS TECH CORP·Filed 2002·Granted Jan 18, 2005·2 cites·7 claims
- 4247US6070473AMethod for measuring adhesion strength of resin materialHITACHI LTD·Filed 1997·Granted Jun 6, 2000·7 cites·5 claims
- 4347US2008079152A1Semiconductor wafer and method of manufacturing the same and method of manufacturing semiconductor deviceRENESAS TECH CORP·Filed 2007·Application pending·0 cites
- 4446US6297073B1Semiconductor deviceHITACHI LTD·Filed 2000·Granted Oct 2, 2001·1 cites·8 claims
- 4546US2012108055A1Manufacturing process of semiconductor device and semiconductor deviceYOSHIMURA YASUHIRO·Filed 2012·Application pending·0 cites
- 4646US2012048332A1Adhesive film for solar cell electrode and method for manufacturing solar cell module using the sameSHIMIZU SHIGENORI·Filed 2011·Application pending·0 cites
- 4746US2011156274A1Semiconductor deviceRENESAS TECH CORP·Filed 2011·Application pending·0 cites
- 4844US2008248611A1Manufacturing method of semiconductor deviceHANADA KENJI·Filed 2008·Application pending·0 cites
- 4944US2011133336A1Semiconductor Wafer and Method of Manufacturing the Same and Method of Manufacturing Semiconductor DeviceRENESAS ELECTRONICS CORP·Filed 2011·Application pending·0 cites
- 5042US2005029673A1Multi-chip semiconductor device with specific chip arrangementHITACHI LTD·Filed 2004·Application pending·0 cites
Showing the top 50 of 59 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →