Inventor · disambiguated record
Naoki Uchiyama
Also filed as: UCHIYAMA NAOKI
121 granted patents·29 pending applications·13,189 citations·filing 1983–2023
99Inventor score
Files withHAMAMATSU PHOTONICS KK34FUKUYO FUMITSUGU17OLYMPUS OPTICAL CO17UCHIYAMA NAOKI17ATSUMITEC CO LTD14
Top patents by PatentIndex Score
150 records- 0199US8283595B2Laser processing method and laser processing apparatusFUKUYO FUMITSUGU·Filed 2009·Granted Oct 9, 2012·68 cites·59 claims
- 0299US7825350B2Laser processing method and laser processing apparatusHAMAMATSU PHOTONICS KK·Filed 2005·Granted Nov 2, 2010·126 cites·44 claims
- 0399US7732730B2Laser processing method and laser processing apparatusHAMAMATSU PHOTONICS KK·Filed 2005·Granted Jun 8, 2010·139 cites·7 claims
- 0499US7626137B2Laser cutting by forming a modified region within an object and generating fracturesHAMAMATSU PHOTONICS KK·Filed 2005·Granted Dec 1, 2009·130 cites·24 claims
- 0599US7615721B2Laser processing method and laser processing apparatusHAMAMATSU PHOTONICS KK·Filed 2005·Granted Nov 10, 2009·118 cites·12 claims
- 0699US7592238B2Laser processing method and laser processing apparatusHAMAMATSU PHOTONICS KK·Filed 2005·Granted Sep 22, 2009·123 cites·42 claims
- 0799US7566635B2Substrate dividing methodHAMAMATSU PHOTONICS KK·Filed 2006·Granted Jul 28, 2009·172 cites·16 claims
- 0899US7547613B2Laser processing method and laser processing apparatusHAMAMATSU PHOTONICS KK·Filed 2005·Granted Jun 16, 2009·144 cites·12 claims
- 0999US7396742B2Laser processing method for cutting a wafer-like object by using a laser to form modified regions within the objectHAMAMATSU PHOTONICS KK·Filed 2005·Granted Jul 8, 2008·167 cites·62 claims
- 1099US6992026B2Laser processing method and laser processing apparatusHAMAMATSU PHOTONICS KK·Filed 2003·Granted Jan 31, 2006·447 cites·38 claims
- 1198US8227724B2Laser processing method and laser processing apparatusFUKUYO FUMITSUGU·Filed 2010·Granted Jul 24, 2012·31 cites·10 claims
- 1298US6099537AMedical treatment instrumentOLYMPUS OPTICAL CO·Filed 1997·Granted Aug 8, 2000·2.5k cites·69 claims
- 1398US5906625ATissue-fixing surgical instrument, tissue-fixing device, and method of fixing tissueOLYMPUS OPTICAL CO·Filed 1997·Granted May 25, 1999·2.5k cites·30 claims
- 1497US8314013B2Semiconductor chip manufacturing methodFUJII YOSHIMARO·Filed 2010·Granted Nov 20, 2012·23 cites·6 claims
- 1597US8304325B2Substrate dividing methodFUJII YOSHIMARO·Filed 2007·Granted Nov 6, 2012·25 cites·6 claims
- 1696US8927900B2Method of cutting a substrate, method of processing a wafer-like object, and method of manufacturing a semiconductor deviceFUKUYO FUMITSUGU·Filed 2010·Granted Jan 6, 2015·14 cites·5 claims
- 1796US8685838B2Laser beam machining methodFUKUYO FUMITSUGU·Filed 2003·Granted Apr 1, 2014·93 cites·9 claims
- 1896US8523636B2Working object grinding methodUCHIYAMA NAOKI·Filed 2008·Granted Sep 3, 2013·37 cites·4 claims
- 1996US8518800B2Substrate dividing methodFUJII YOSHIMARO·Filed 2012·Granted Aug 27, 2013·13 cites·7 claims
- 2096US8058103B2Semiconductor substrate cutting methodFUKUMITSU KENSHI·Filed 2009·Granted Nov 15, 2011·34 cites·8 claims
- 2196US5876325ASurgical manipulation systemOLYMPUS OPTICAL CO·Filed 1997·Granted Mar 2, 1999·1.7k cites·18 claims
- 2296US4722340AStone disintegrator apparatusOLYMPUS OPTICAL CO·Filed 1987·Granted Feb 2, 1988·748 cites·27 claims
- 2395US9837315B2Laser processing method and laser processing apparatusHAMAMATSU PHOTONICS KK·Filed 2014·Granted Dec 5, 2017·8 cites·7 claims
- 2495US9543207B2Substrate dividing methodHAMAMATSU PHOTONICS KK·Filed 2016·Granted Jan 10, 2017·6 cites·29 claims
- 2595US8969761B2Method of cutting a wafer-like object and semiconductor chipFUKUYO FUMITSUGU·Filed 2010·Granted Mar 3, 2015·10 cites·47 claims
- 2695US8828306B2Working object cutting methodUCHIYAMA NAOKI·Filed 2008·Granted Sep 9, 2014·32 cites·11 claims
- 2795US8541251B2Method for manufacturing light-emitting deviceUCHIYAMA NAOKI·Filed 2012·Granted Sep 24, 2013·15 cites·11 claims
- 2895US8519511B2Substrate dividing methodFUJII YOSHIMARO·Filed 2012·Granted Aug 27, 2013·10 cites·3 claims
- 2995US5643293ASuturing instrumentOLYMPUS OPTICAL CO·Filed 1994·Granted Jul 1, 1997·1k cites·14 claims
- 3094US10068801B2Substrate dividing methodHAMAMATSU PHOTONICS KK·Filed 2017·Granted Sep 4, 2018·4 cites·5 claims
- 3194US8518801B2Substrate dividing methodFUJII YOSHIMARO·Filed 2012·Granted Aug 27, 2013·8 cites·4 claims
- 3294US5755314ALubricating structure for wet multi-plate clutchHONDA MOTOR CO LTD·Filed 1996·Granted May 26, 1998·77 cites·9 claims
- 3393US9548246B2Substrate dividing methodHAMAMATSU PHOTONICS KK·Filed 2016·Granted Jan 17, 2017·4 cites·24 claims
- 3493US9302410B2Method for cutting object to be processedSHIMOI HIDEKI·Filed 2010·Granted Apr 5, 2016·15 cites·10 claims
- 3592US10796959B2Laser processing method and laser processing apparatusHAMAMATSU PHOTONICS KK·Filed 2017·Granted Oct 6, 2020·3 cites·7 claims
- 3692US4898574ALithotomic apparatusOLYMPUS OPTICAL CO·Filed 1989·Granted Feb 6, 1990·368 cites·7 claims
- 3791US11424162B2Substrate dividing methodHAMAMATSU PHOTONICS KK·Filed 2021·Granted Aug 23, 2022·1 cites·2 claims
- 3891US9553023B2Substrate dividing methodHAMAMATSU PHOTONICS KK·Filed 2016·Granted Jan 24, 2017·3 cites·20 claims
- 3991US8890026B2Method for cutting processing targetUCHIYAMA NAOKI·Filed 2010·Granted Nov 18, 2014·12 cites·11 claims
- 4091US8268704B2Method for dicing substrateFUJII YOSHIMARO·Filed 2003·Granted Sep 18, 2012·25 cites·56 claims
- 4190US8603351B2Working method for cuttingSAKAMOTO TAKESHI·Filed 2008·Granted Dec 10, 2013·15 cites·9 claims
- 4290US8263479B2Method for cutting semiconductor substrateFUKUYO FUMITSUGU·Filed 2003·Granted Sep 11, 2012·44 cites·39 claims
- 4388US9543256B2Substrate dividing methodHAMAMATSU PHOTONICS KK·Filed 2016·Granted Jan 10, 2017·2 cites·30 claims
- 4488US8716110B2Laser processing method and laser processing apparatusFUKUYO FUMITSUGU·Filed 2012·Granted May 6, 2014·3 cites·8 claims
- 4588US4955366AUltrasonic therapeutical apparatusOLYMPUS OPTICAL CO·Filed 1988·Granted Sep 11, 1990·60 cites·25 claims
- 4687US8946592B2Laser processing method and laser processing apparatusFUKUYO FUMITSUGU·Filed 2012·Granted Feb 3, 2015·3 cites·5 claims
- 4787US8946591B2Method of manufacturing a semiconductor device formed using a substrate cutting methodFUKUYO FUMITSUGU·Filed 2012·Granted Feb 3, 2015·3 cites·5 claims
- 4887US8450187B2Method of cutting semiconductor substrateFUKUYO FUMITSUGU·Filed 2012·Granted May 28, 2013·6 cites·12 claims
- 4987US5797931ATissue-fixing surgical instrument, tissue-fixing device, and method of fixing tissuesOLYMPUS OPTICAL CO·Filed 1996·Granted Aug 25, 1998·410 cites·30 claims
- 5086US8758691B2Hydrogen-absorbing alloy and hydrogen sensor using the alloyUCHIYAMA NAOKI·Filed 2011·Granted Jun 24, 2014·7 cites·5 claims
Showing the top 50 of 150 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →