Inventor · disambiguated record
Nils Johansson
Also filed as: JOHANSSON NILS · JOHANSSON NILS G
32 granted patents·6 pending applications·1,028 citations·filing 1977–2013
98Inventor score
Top patents by PatentIndex Score
38 records- 0198US6537133B1Method for in-situ endpoint detection for chemical mechanical polishing operationsAPPLIED MATERIALS INC·Filed 2000·Granted Mar 25, 2003·161 cites·5 claims
- 0297US7097537B1Determination of position of sensor measurements during polishingAPPLIED MATERIALS INC·Filed 2004·Granted Aug 29, 2006·81 cites·35 claims
- 0397US6924641B1Method and apparatus for monitoring a metal layer during chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2000·Granted Aug 2, 2005·63 cites·28 claims
- 0495US7229340B2Monitoring a metal layer during chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2006·Granted Jun 12, 2007·15 cites·23 claims
- 0595US6975107B2Eddy current sensing of metal removal for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2003·Granted Dec 13, 2005·35 cites·14 claims
- 0693US6878038B2Combined eddy current sensing and optical monitoring for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2001·Granted Apr 12, 2005·40 cites·7 claims
- 0792US7513818B2Polishing endpoint detection system and method using friction sensorAPPLIED MATERIALS INC·Filed 2004·Granted Apr 7, 2009·41 cites·24 claims
- 0891US6966816B2Integrated endpoint detection system with optical and eddy current monitoringAPPLIED MATERIALS INC·Filed 2001·Granted Nov 22, 2005·45 cites·12 claims
- 0990US7682221B2Integrated endpoint detection system with optical and eddy current monitoringAPPLIED MATERIALS INC·Filed 2007·Granted Mar 23, 2010·12 cites·6 claims
- 1090US7500901B2Data processing for monitoring chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2005·Granted Mar 10, 2009·13 cites·14 claims
- 1190US7001246B2Method and apparatus for monitoring a metal layer during chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2003·Granted Feb 21, 2006·20 cites·18 claims
- 1290US6813534B2Endpoint detection in substrate fabrication processesFiled 2002·Granted Nov 2, 2004·54 cites·30 claims
- 1390US6719818B1Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operationsAPPLIED MATERIALS INC·Filed 1998·Granted Apr 13, 2004·92 cites·3 claims
- 1488US7195536B2Integrated endpoint detection system with optical and eddy current monitoringAPPLIED MATERIALS INC·Filed 2005·Granted Mar 27, 2007·10 cites·6 claims
- 1588US6399501B2Method and apparatus for detecting polishing endpoint with optical monitoringAPPLIED MATERIALS INC·Filed 1999·Granted Jun 4, 2002·93 cites·27 claims
- 1685US7008296B2Data processing for monitoring chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2003·Granted Mar 7, 2006·27 cites·9 claims
- 1784US8342906B2Friction sensor for polishing systemAPPLIED MATERIALS INC·Filed 2009·Granted Jan 1, 2013·6 cites·25 claims
- 1883US6811466B1System and method for in-line metal profile measurementAPPLIED MATERIALS INC·Filed 2002·Granted Nov 2, 2004·21 cites·10 claims
- 1982US6876454B1Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operationsAPPLIED MATERIALS INC·Filed 1999·Granted Apr 5, 2005·44 cites·76 claims
- 2080US8758086B2Friction sensor for polishing systemAPPLIED MATERIALS INC·Filed 2012·Granted Jun 24, 2014·2 cites·22 claims
- 2180US6945845B2Chemical mechanical polishing apparatus with non-conductive elementsAPPLIED MATERIALS INC·Filed 2003·Granted Sep 20, 2005·20 cites·16 claims
- 2277US8795029B2Apparatus and method for in-situ endpoint detection for semiconductor processing operationsAPPLIED MATERIALS INC·Filed 2013·Granted Aug 5, 2014·2 cites·12 claims
- 2377US6831742B1Monitoring substrate processing using reflected radiationAPPLIED MATERIALS INC·Filed 2000·Granted Dec 14, 2004·17 cites·99 claims
- 2475US7008297B2Combined eddy current sensing and optical monitoring for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2004·Granted Mar 7, 2006·13 cites·16 claims
- 2573US6878036B2Apparatus for monitoring a metal layer during chemical mechanical polishing using a phase difference signalAPPLIED MATERIALS INC·Filed 2003·Granted Apr 12, 2005·11 cites·16 claims
- 2672US6930478B2Method for monitoring a metal layer during chemical mechanical polishing using a phase difference signalAPPLIED MATERIALS INC·Filed 2003·Granted Aug 16, 2005·7 cites·21 claims
- 2768US8506356B2Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operationsBIRANG MANOOCHER·Filed 2010·Granted Aug 13, 2013·1 cites·12 claims
- 2867US6535779B1Apparatus and method for endpoint control and plasma monitoringAPPLIED MATERIALS INC·Filed 1998·Granted Mar 18, 2003·41 cites·40 claims
- 2966US7775852B2Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operationsAPPLIED MATERIALS INC·Filed 2005·Granted Aug 17, 2010·1 cites·11 claims
- 3063US4123030ARear view mirrorJOHANSSON NILS G·Filed 1977·Granted Oct 31, 1978·19 cites·2 claims
- 3161US7101254B2System and method for in-line metal profile measurementAPPLIED MATERIALS INC·Filed 2004·Granted Sep 5, 2006·5 cites·3 claims
- 3254US2007015441A1Apparatus and Method for In-Situ Endpoint Detection for Chemical Mechanical Polishing OperationsAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 3353US2007212987A1Monitoring a metal layer during chemical mechanical polishingHANAWA HIROJI·Filed 2007·Application pending·0 cites
- 3452US2006246822A1System and method for in-line metal profile measurementAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 3548US5673449AFlow compensation device for bridge pillarsVATTENFALL UTVECKLING AB·Filed 1994·Granted Oct 7, 1997·16 cites·12 claims
- 3644US2006009128A1Eddy current sensing of metal removal for chemical mechanical polishingHANAWA HIROJI·Filed 2005·Application pending·0 cites
- 3742US2007077671A1In-situ substrate imagingAPPLIED MATERIALS INC·Filed 2005·Application pending·0 cites
- 3842US2006009132A1Chemical mechanical polishing apparatus with non-conductive elementsBENNETT DOYLE E·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →