Inventor · disambiguated record
Nicholas R. Watts
Also filed as: WATTS NICHOLAS R · WATTS NICHOLAS RANDOLPH
18 granted patents·4 pending applications·405 citations·filing 2000–2024
94Inventor score
Files withINTEL CORP16GUZEK JOHN STEPHEN1MORTENSEN RUSSELL K1MURATA MANUFACTURING CO1MUTHUKUMAR SRIRAM1
Top patents by PatentIndex Score
22 records- 0196US12107082B2Offset interposers for large-bottom packages and large-die package-on-package structuresINTEL CORP·Filed 2023·Granted Oct 1, 2024·2 cites·16 claims
- 0296US6606237B1Multilayer capacitor, wiring board, decoupling circuit, and high frequency circuit incorporating the sameMURATA MANUFACTURING CO·Filed 2002·Granted Aug 12, 2003·231 cites·43 claims
- 0392US11798932B2Offset interposers for large-bottom packages and large-die package-on-package structuresINTEL CORP·Filed 2022·Granted Oct 24, 2023·1 cites·10 claims
- 0491US8901724B2Semiconductor package with embedded die and its methods of fabricationGUZEK JOHN STEPHEN·Filed 2009·Granted Dec 2, 2014·28 cites·7 claims
- 0591US7851269B2Method of stiffening coreless package substrateINTEL CORP·Filed 2009·Granted Dec 14, 2010·16 cites·17 claims
- 0690US11978730B2Offset interposers for large-bottom packages and large-die package-on-package structuresINTEL CORP·Filed 2022·Granted May 7, 2024·1 cites·9 claims
- 0790US10607976B2Offset interposers for large-bottom packages and large-die package-on-package structuresINTEL CORP·Filed 2016·Granted Mar 31, 2020·6 cites·11 claims
- 0889US7183653B2Via including multiple electrical pathsINTEL CORP·Filed 2003·Granted Feb 27, 2007·62 cites·28 claims
- 0986US2024222350A1Offset interposers for large-bottom packages and large-die package-on- package structuresINTEL CORP·Filed 2024·Application pending·0 cites
- 1082US10446530B2Offset interposers for large-bottom packages and large-die package-on-package structuresMORTENSEN RUSSELL K·Filed 2011·Granted Oct 15, 2019·5 cites·24 claims
- 1180US6556453B2Electronic circuit housing with trench vias and method of fabrication thereforINTEL CORP·Filed 2000·Granted Apr 29, 2003·26 cites·29 claims
- 1278US7952182B2Semiconductor device with package to package connectionINTEL CORP·Filed 2008·Granted May 31, 2011·8 cites·18 claims
- 1372US7952202B2Method of embedding passive component within viaINTEL CORP·Filed 2007·Granted May 31, 2011·4 cites·11 claims
- 1470US9780054B2Semiconductor package with embedded die and its methods of fabricationINTEL CORP·Filed 2014·Granted Oct 3, 2017·2 cites·13 claims
- 1566US8860205B2Method of stiffening coreless package substrateMUTHUKUMAR SRIRAM·Filed 2010·Granted Oct 14, 2014·1 cites·20 claims
- 1665US9960079B2Passive within viaINTEL CORP·Filed 2013·Granted May 1, 2018·1 cites·11 claims
- 1765US7275316B2Method of embedding passive component within viaINTEL CORP·Filed 2004·Granted Oct 2, 2007·9 cites·13 claims
- 1864US2020251462A1Offset interposers for large-bottom packages and large-die package-on-package structuresINTEL CORP·Filed 2019·Application pending·0 cites
- 1961US7737025B2Via including multiple electrical pathsINTEL CORP·Filed 2007·Granted Jun 15, 2010·2 cites·14 claims
- 2056US2016133557A1Offset interposers for large-bottom packages and large-die package-on-package structuresINTEL CORP·Filed 2015·Application pending·0 cites
- 2137US9607937B2Pin grid interposerWATTS NICHOLAS R·Filed 2011·Granted Mar 28, 2017·0 cites·22 claims
- 2235US2005121769A1Stacked integrated circuit packages and methods of making the packagesFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →