Assignee
MUTHUKUMAR SRIRAM
US·4 granted patents·3 pending applications·19 citations·filing 2004–2013
Top patents by PatentIndex Score
7 records- 0186US10186480B2Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing sameMUTHUKUMAR SRIRAM·Filed 2013·Granted Jan 22, 2019·7 cites·20 claims
- 0266US8860205B2Method of stiffening coreless package substrateMUTHUKUMAR SRIRAM·Filed 2010·Granted Oct 14, 2014·1 cites·20 claims
- 0361US7400041B2Compliant multi-composition interconnectsMUTHUKUMAR SRIRAM·Filed 2004·Granted Jul 15, 2008·10 cites·11 claims
- 0460US8387240B2Methods for making multi-chip packaging using an interposerMUTHUKUMAR SRIRAM·Filed 2010·Granted Mar 5, 2013·1 cites·20 claims
- 0553US2010327419A1Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing sameMUTHUKUMAR SRIRAM·Filed 2009·Application pending·0 cites
- 0648US2008023791A1High performance integrated inductorMUTHUKUMAR SRIRAM·Filed 2007·Application pending·0 cites
- 0741US2008217183A1Electropolishing metal features on a semiconductor waferMUTHUKUMAR SRIRAM·Filed 2007·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →