Inventor · disambiguated record
Nobuo Hayasaka
Also filed as: HAYASAKA NOBUO
71 granted patents·10 pending applications·4,698 citations·filing 1986–2011
99Inventor score
Top patents by PatentIndex Score
81 records- 0199US6809421B1Multichip semiconductor device, chip therefor and method of formation thereofTOSHIBA KK·Filed 1999·Granted Oct 26, 2004·496 cites·16 claims
- 0298US7032307B2Method for fabricating a probe pin for testing electrical characteristics of an apparatusTOSHIBA KK·Filed 2004·Granted Apr 25, 2006·110 cites·15 claims
- 0398US5030319AMethod of oxide etching with condensed plasma reaction productTOSHIBA KK·Filed 1989·Granted Jul 9, 1991·390 cites·6 claims
- 0497US6632335B2Plating apparatusEBARA CORP·Filed 2000·Granted Oct 14, 2003·114 cites·77 claims
- 0597US6375545B1Chemical mechanical method of polishing wafer surfacesTOSHIBA KK·Filed 2000·Granted Apr 23, 2002·131 cites·17 claims
- 0697US6239495B1Multichip semiconductor device and memory cardTOSHIBA KK·Filed 1999·Granted May 29, 2001·209 cites·16 claims
- 0797US5770095APolishing agent and polishing method using the sameTOSHIBA KK·Filed 1995·Granted Jun 23, 1998·413 cites·15 claims
- 0896US5429995AMethod of manufacturing silicon oxide film containing fluorineTOSHIBA KK·Filed 1993·Granted Jul 4, 1995·421 cites·10 claims
- 0995US5312519AMethod of cleaning a charged beam apparatusTOSHIBA KK·Filed 1992·Granted May 17, 1994·104 cites·9 claims
- 1094US7829975B2Multichip semiconductor device, chip therefor and method of formation thereofTOSHIBA KK·Filed 2007·Granted Nov 9, 2010·23 cites·5 claims
- 1194US6717251B2Stacked type semiconductor deviceTOSHIBA KK·Filed 2001·Granted Apr 6, 2004·103 cites·26 claims
- 1293US8283755B2Multichip semiconductor device, chip therefor and method of formation thereofHAYASAKA NOBUO·Filed 2011·Granted Oct 9, 2012·15 cites·8 claims
- 1393US6720522B2Apparatus and method for laser beam machining, and method for manufacturing semiconductor devices using laser beam machiningTOKYO SHIBAURA ELECTRIC CO·Filed 2001·Granted Apr 13, 2004·66 cites·16 claims
- 1493US6071810AMethod of filling contact holes and wiring grooves of a semiconductor deviceTOSHIBA KK·Filed 1997·Granted Jun 6, 2000·101 cites·2 claims
- 1593US5731634ASemiconductor device having a metal film formed in a groove in an insulating filmTOSHIBA KK·Filed 1996·Granted Mar 24, 1998·102 cites·14 claims
- 1692US6673704B2Semiconductor device and method of manufacturing the sameTOSHIBA KK·Filed 2002·Granted Jan 6, 2004·42 cites·26 claims
- 1792US6566632B1Hot plate and semiconductor device manufacturing method using the sameTOSHIBA KK·Filed 2000·Granted May 20, 2003·59 cites·18 claims
- 1892US6504227B1Passive semiconductor device mounted as daughter chip on active semiconductor deviceTOSHIBA KK·Filed 2000·Granted Jan 7, 2003·91 cites·12 claims
- 1992US5775980APolishing method and polishing apparatusTOSHIBA KK·Filed 1996·Granted Jul 7, 1998·105 cites·8 claims
- 2091US6334928B1Semiconductor processing system and method of using the sameTOSHIBA KK·Filed 1999·Granted Jan 1, 2002·97 cites·28 claims
- 2191US6306756B1Method for production of semiconductor deviceTOSHIBA KK·Filed 2000·Granted Oct 23, 2001·62 cites·10 claims
- 2291US5607718APolishing method and polishing apparatusTOSHIBA KK·Filed 1994·Granted Mar 4, 1997·119 cites·29 claims
- 2391US5466942ACharged beam irradiating apparatus having a cleaning means and a method of cleaning a charged beam irradiating apparatusTOSHIBA KK·Filed 1993·Granted Nov 14, 1995·62 cites·16 claims
- 2490US8174093B2Multichip semiconductor device, chip therefor and method of formation thereofHAYASAKA NOBUO·Filed 2010·Granted May 8, 2012·10 cites·16 claims
- 2588US5298112AMethod for removing composite attached to material by dry etchingTOSHIBA KK·Filed 1992·Granted Mar 29, 1994·103 cites·36 claims
- 2687US5664989APolishing pad, polishing apparatus and polishing methodTOSHIBA KK·Filed 1996·Granted Sep 9, 1997·74 cites·30 claims
- 2786US7091733B2Reliability evaluation test apparatus, reliability evaluation test system, contactor, and reliability evaluation test methodIBIDEN CO LTD·Filed 2004·Granted Aug 15, 2006·30 cites·20 claims
- 2886US6709966B1Semiconductor device, its manufacturing process, position matching mark, pattern forming method and pattern forming deviceTOSHIBA KK·Filed 2000·Granted Mar 23, 2004·38 cites·8 claims
- 2986US6235624B1Paste connection plug, burying method, and semiconductor device manufacturing methodTOSHIBA KK·Filed 1999·Granted May 22, 2001·59 cites·8 claims
- 3086US6164295ACVD apparatus with high throughput and cleaning method thereforTOSHIBA KK·Filed 1997·Granted Dec 26, 2000·79 cites·13 claims
- 3186US5409862AMethod for making aluminum single crystal interconnections on insulatorsTOSHIBA KK·Filed 1993·Granted Apr 25, 1995·56 cites·15 claims
- 3285US6090701AMethod for production of semiconductor deviceTOSHIBA KK·Filed 1995·Granted Jul 18, 2000·74 cites·11 claims
- 3385US5851842AMeasurement system and measurement methodTOSHIBA KK·Filed 1997·Granted Dec 22, 1998·86 cites·22 claims
- 3482US7242206B2Reliability evaluation test apparatus, reliability evaluation test system, contactor, and reliability evaluation test methodIBIDEN CO LTD·Filed 2005·Granted Jul 10, 2007·7 cites·43 claims
- 3582US6746969B2Method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2001·Granted Jun 8, 2004·27 cites·27 claims
- 3682US5424246AMethod of manufacturing semiconductor metal wiring layer by reduction of metal oxideTOSHIBA KK·Filed 1993·Granted Jun 13, 1995·52 cites·8 claims
- 3781US6475285B2Deposition apparatusTOSHIBA KK·Filed 2001·Granted Nov 5, 2002·25 cites·19 claims
- 3881US5561082AMethod for forming an electrode and/or wiring layer by reducing copper oxide or silver oxideTOSHIBA KK·Filed 1995·Granted Oct 1, 1996·44 cites·26 claims
- 3979US5661345ASemiconductor device having a single-crystal metal wiringTOSHIBA KK·Filed 1994·Granted Aug 26, 1997·35 cites·3 claims
- 4078US7335517B2Multichip semiconductor device, chip therefor and method of formation thereofTOSHIBA KK·Filed 2004·Granted Feb 26, 2008·17 cites·13 claims
- 4178US6784680B2Contact probe with guide unit and fabrication method thereofSUMITOMO ELECTRIC INDUSTRIES·Filed 2003·Granted Aug 31, 2004·18 cites·15 claims
- 4278US6724208B2Probe pin for testing electrical characteristics of apparatus, probe card using probe pinsTOSHIBA KK·Filed 2000·Granted Apr 20, 2004·17 cites·16 claims
- 4375US6224464B1Polishing method and polisher used in the methodTOSHIBA KK·Filed 1996·Granted May 1, 2001·39 cites·19 claims
- 4474US6946387B2Semiconductor device and method for manufacturing the sameTOSHIBA KK·Filed 2003·Granted Sep 20, 2005·11 cites·2 claims
- 4574US6419557B2Polishing method and polisher used in the methodTOSHIBA KK·Filed 2001·Granted Jul 16, 2002·14 cites·3 claims
- 4671US6538323B1Semiconductor device having an electrode structure comprising a conductive fine particle filmTOSHIBA KK·Filed 1999·Granted Mar 25, 2003·30 cites·15 claims
- 4770US5629236AMethod of manufacture of semiconductor deviceTOSHIBA KK·Filed 1995·Granted May 13, 1997·40 cites·11 claims
- 4869US6614106B2Stacked circuit device and method for evaluating an integrated circuit substrate using the stacked circuit deviceTOSHIBA KK·Filed 2001·Granted Sep 2, 2003·15 cites·17 claims
- 4968US7387717B2Method of performing electrolytic treatment on a conductive layer of a substrateEBARA CORP·Filed 2003·Granted Jun 17, 2008·3 cites·13 claims
- 5068US6730447B2Manufacturing system in electronic devicesTOSHIBA KK·Filed 2002·Granted May 4, 2004·20 cites·29 claims
Showing the top 50 of 81 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →