Polishing method and polisher used in the method

Abstract

A polishing method including applying a polishing agent containing polishing grains and a surfactant onto an oxide film, which is formed on a substrate having a depressed portion and a protruding portion, wherein the surfactant is an organic compound including at least one hydrophilic group selected from the group consisting of COOH, COOM 1 , wherein M 1 represents an atom or a functional group which can form a salt when substituted for a hydrogen atom of a carboxyl group, SO 3 H and SO 3 M 2 , wherein M 2 represents an atom or a functional group which can form a salt when substituted for a hydrogen atom of a sulfo group; and polishing the film until the film is flattened without the occurrence of dishing.

What is claimed is:  
     
       1. A polishing method comprising: 
       applying a polishing agent containing polishing grains and a surfactant onto an oxide film, which is formed on a substrate having a depressed portion and a protruding portion, said polishing grains containing CeO 2  as a main component, wherein the surfactant is an organic compound including at least one hydrophilic group selected from the group consisting of COOH, COOM 1 , wherein M 1  represents an atom or a functional group which can form a salt when substituted for a hydrogen atom of a carboxyl group, SO 3 H and SO 3 M 2 , wherein M 2  represents an atom or a functional group which can form a salt when substituted for a hydrogen atom of a sulfo group; and  
       polishing the film until the film is flattened without the occurrence of dishing.  
     
     
       2. A polishing method comprising: 
       applying a polishing agent containing polishing grains and a surfactant onto an oxide film, which is formed on a substrate having a depressed portion and a protruding portion, wherein the surfactant is an organic compound including at least one hydrophilic group selected from the group consisting of COOH and COOM 1 , wherein M 1  represents an atom or a functional group which can form a salt when substituted for a hydrogen atom of a carboxyl group, and  
       polishing the film until the film is flattened without the occurrence of dishing.  
     
     
       3. A polishing method comprising: 
       applying a polishing agent containing polishing grains and a surfactant onto a metal film, which is formed on a substrate having a depressed portion and a protruding portion, wherein the surfactant is an organic compound including at least one hydrophilic group selected from the group consisting of SO 3 H and SO 3 M 2 , wherein M 2  represents an atom or a functional group which can form a salt when substituted for a hydrogen atom of a sulfo group; and  
       polishing the film until the film is flattened without the occurrence of dishing.