Inventor · disambiguated record
Nobuo Owada
Also filed as: OWADA NOBUO
47 granted patents·4 pending applications·1,461 citations·filing 1989–2011
99Inventor score
Files withHITACHI LTD33RENESAS TECH CORP10HITACHI INT ELECTRIC INC1HITACHI KOSKUSAI ELECTRIC INC1HITACHI VLSI ENG1
Top patents by PatentIndex Score
51 records- 0198US6184143B1Semiconductor integrated circuit device and fabrication process thereofHITACHI LTD·Filed 1998·Granted Feb 6, 2001·342 cites·25 claims
- 0296US6731007B1Semiconductor integrated circuit device with vertically stacked conductor interconnectionsHITACHI LTD·Filed 2000·Granted May 4, 2004·85 cites·50 claims
- 0392US5060045ASemiconductor integrated circuit device and method of manufacturing the sameHITACHI LTD·Filed 1989·Granted Oct 22, 1991·80 cites·51 claims
- 0491US7659201B2Process for manufacturing semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2008·Granted Feb 9, 2010·10 cites·26 claims
- 0590US6326299B1Method for manufacturing a semiconductor deviceHITACHI LTD·Filed 1999·Granted Dec 4, 2001·88 cites·45 claims
- 0688US7387957B2Fabrication process for a semiconductor integrated circuit deviceHITACHI LTD·Filed 2005·Granted Jun 17, 2008·12 cites·3 claims
- 0788US5027188ASemiconductor integrated circuit device in which a semiconductor chip is mounted with solder bumps for mounting to a wiring substrateHITACHI LTD·Filed 1989·Granted Jun 25, 1991·91 cites·20 claims
- 0886US8384220B2Semiconductor integrated circuit device and fabrication process thereofHITACHI LTD·Filed 2008·Granted Feb 26, 2013·10 cites·6 claims
- 0985US6376345B1Process for manufacturing semiconductor integrated circuit deviceHITACHI LTD·Filed 1999·Granted Apr 23, 2002·46 cites·107 claims
- 1084US7510970B2Process for manufacturing semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2006·Granted Mar 31, 2009·5 cites·8 claims
- 1184US5244820ASemiconductor integrated circuit device, method for producing the same, and ion implanter for use in the methodKAMATA TADASHI·Filed 1992·Granted Sep 14, 1993·113 cites·37 claims
- 1283US6730590B2Semiconductor integrated circuit device and fabrication process thereofRENESAS TECH CORP·Filed 2002·Granted May 4, 2004·23 cites·32 claims
- 1383US5220199ASemiconductor integrated circuit device in which a semiconductor chip is mounted with solder bumps for mounting to a wiring substrateHITACHI LTD·Filed 1991·Granted Jun 15, 1993·85 cites·34 claims
- 1483US5202275ASemiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the sameHITACHI LTD·Filed 1990·Granted Apr 13, 1993·43 cites·23 claims
- 1582US6458674B1Process for manufacturing semiconductor integrated circuit deviceHITACHI LTD·Filed 2002·Granted Oct 1, 2002·16 cites·101 claims
- 1682US6403459B1Fabrication process of semiconductor integrated circuit deviceHITACHI LTD·Filed 2000·Granted Jun 11, 2002·22 cites·36 claims
- 1781US6716749B2Semiconductor integrated circuit device and manufacturing method of semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2002·Granted Apr 6, 2004·14 cites·6 claims
- 1881US6638854B2Semiconductor device and method for manufacturing the sameHITACHI LTD·Filed 2002·Granted Oct 28, 2003·25 cites·16 claims
- 1980US6861756B2Semiconductor integrated circuit device and fabrication process thereofHITACHI LTD·Filed 2004·Granted Mar 1, 2005·20 cites·21 claims
- 2079US5780882ASemiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the sameHITACHI LTD·Filed 1995·Granted Jul 14, 1998·33 cites·8 claims
- 2178US6531400B2Process for manufacturing semiconductor integrated circuit deviceHITACHI LTD·Filed 2002·Granted Mar 11, 2003·12 cites·30 claims
- 2277US6864169B2Semiconductor integrated circuit device and manufacturing method of semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2002·Granted Mar 8, 2005·12 cites·14 claims
- 2377US5229643ASemiconductor apparatus and semiconductor packageHITACHI LTD·Filed 1991·Granted Jul 20, 1993·54 cites·26 claims
- 2476US6548847B2Semiconductor integrated circuit device having a first wiring strip exposed through a connecting hole, a transition-metal film in the connecting hole and an aluminum wiring strip thereover, and a transition-metal nitride film between the aluminum wiring strip and the transition-metal filmHITACHI LTD·Filed 2001·Granted Apr 15, 2003·12 cites·33 claims
- 2574US6849535B2Semiconductor integrated circuit device and manufacturing method of semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2002·Granted Feb 1, 2005·9 cites·3 claims
- 2673US6797609B2Semiconductor integrated circuit device and manufacturing method of semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2002·Granted Sep 28, 2004·9 cites·10 claims
- 2773US5331191ASemiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the sameHITACHI LTD·Filed 1992·Granted Jul 19, 1994·24 cites·11 claims
- 2872US6756679B2Semiconductor integrated circuit device and manufacturing method of semiconductor integrated circuit deviceHITACHI LTD·Filed 2002·Granted Jun 29, 2004·8 cites·10 claims
- 2971US6800557B2Process for manufacturing semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2003·Granted Oct 5, 2004·8 cites·5 claims
- 3070US7955948B2Manufacturing method of semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2009·Granted Jun 7, 2011·2 cites·12 claims
- 3165US5607866AMethod of fabricating a semiconductor device having silicide layers for electrodesHITACHI LTD·Filed 1995·Granted Mar 4, 1997·26 cites·15 claims
- 3262US6894334B2Semiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the sameHITACHI VLSI ENG·Filed 2003·Granted May 17, 2005·5 cites·33 claims
- 3362US5073810ASemiconductor integrated circuit device and manufacturing method thereofHITACHI LTD·Filed 1990·Granted Dec 17, 1991·28 cites·7 claims
- 3461US8394726B2Method for manufacturing semiconductor device, and substrate processing apparatusMAEDA TAKAHIRO·Filed 2009·Granted Mar 12, 2013·1 cites·11 claims
- 3561US6169324B1Semiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the sameHITACHI LTD·Filed 1999·Granted Jan 2, 2001·13 cites·19 claims
- 3661US5739589ASemiconductor integrated circuit device process for fabricating the same and apparatus for fabricating the sameHITACHI LTD·Filed 1996·Granted Apr 14, 1998·13 cites·21 claims
- 3758US6815330B2Semiconductor integrated circuit device and manufacturing method of semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2002·Granted Nov 9, 2004·3 cites·11 claims
- 3858US6797606B2Semiconductor integrated circuit device and manufacturing method of semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2002·Granted Sep 28, 2004·3 cites·10 claims
- 3957US2008138979A1Semiconductor integrated circuit device and manufacturing method of semiconductor integrated circuit deviceNOGUCHI JUNJI·Filed 2008·Application pending·0 cites
- 4051US6342412B1Semiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the sameHITACHI LTD·Filed 1999·Granted Jan 29, 2002·8 cites·19 claims
- 4150US6127255ASemiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the sameHITACHI LTD·Filed 1997·Granted Oct 3, 2000·8 cites·12 claims
- 4250US5811316AMethod of forming teos oxide and silicon nitride passivation layer on aluminum wiringHITACHI LTD·Filed 1995·Granted Sep 22, 1998·8 cites·13 claims
- 4349US8129275B2Process for manufacturing semiconductor integrated circuit deviceOHASHI NAOFUMI·Filed 2010·Granted Mar 6, 2012·0 cites·15 claims
- 4448US2011230061A1Manufacturing method of semiconductor deviceHITACHI KOSKUSAI ELECTRIC INC·Filed 2011·Application pending·0 cites
- 4547US5557147ASemiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the sameHITACHI LTD·Filed 1994·Granted Sep 17, 1996·7 cites·18 claims
- 4646US5234845AMethod of manufacturing semiconductor IC using selective poly and EPI silicon growthHITACHI LTD·Filed 1992·Granted Aug 10, 1993·11 cites·5 claims
- 4745US2004152298A1Process for manufacturing semiconductor integrated circuit deviceFiled 2004·Application pending·0 cites
- 4840US2002025605A1Semiconductor device and method for manufacturing the sameHITACHI LTD·Filed 2001·Application pending·0 cites
- 4933US5089430AMethod of manufacturing semiconductor integrated circuit bipolar transistor deviceHITACHI LTD·Filed 1990·Granted Feb 18, 1992·6 cites·41 claims
- 5031US5227317AMethod of manufacturing semiconductor integrated circuit bipolar transistor deviceHITACHI LTD·Filed 1991·Granted Jul 13, 1993·4 cites·13 claims
Showing the top 50 of 51 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →