Inventor · disambiguated record
O-Seob Jeon
Also filed as: JEON O-SEOB
20 granted patents·6 pending applications·750 citations·filing 2001–2015
96Inventor score
Files withFAIRCHILD KR SEMICONDUCTOR LTD18LIM SEUNG-WON2SON JOON-SEO2EOM JOO-YANG1FAIRCHILD KOREA SEMICONDUCTOR LTD1
Top patents by PatentIndex Score
26 records- 0196US7675148B2Power module having stacked flip-chip and method of fabricating the power moduleFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2008·Granted Mar 9, 2010·42 cites·21 claims
- 0296US7061080B2Power module package having improved heat dissipating capabilityFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2002·Granted Jun 13, 2006·127 cites·15 claims
- 0395US7315077B2Molded leadless package having a partially exposed lead frame padFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2004·Granted Jan 1, 2008·107 cites·27 claims
- 0494US6774465B2Semiconductor power package moduleFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2002·Granted Aug 10, 2004·123 cites·14 claims
- 0593US7199461B2Semiconductor package suitable for high voltage applicationsFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2004·Granted Apr 3, 2007·78 cites·21 claims
- 0692US7208819B2Power module package having improved heat dissipating capabilityFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2004·Granted Apr 24, 2007·69 cites·11 claims
- 0791US7687903B2Power module and method of fabricating the sameFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2008·Granted Mar 30, 2010·24 cites·21 claims
- 0891US6574107B2Stacked intelligent power module packageFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2001·Granted Jun 3, 2003·99 cites·18 claims
- 0989US9130065B2Power module having stacked flip-chip and method for fabricating the power moduleFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2014·Granted Sep 8, 2015·8 cites·20 claims
- 1079US6710439B2Three-dimensional power semiconductor module and method of manufacturing the sameFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2002·Granted Mar 23, 2004·28 cites·21 claims
- 1178US7800224B2Power device packageFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2007·Granted Sep 21, 2010·11 cites·38 claims
- 1278US7786570B2Heat sink packageFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2009·Granted Aug 31, 2010·6 cites·7 claims
- 1374US8067826B2Power device package comprising metal tab die attach paddle (DAP) and method of fabricating the packageSON JOON-SEO·Filed 2008·Granted Nov 29, 2011·5 cites·10 claims
- 1474US7701048B2Power module for low thermal resistance and method of fabricating the sameFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2007·Granted Apr 20, 2010·5 cites·21 claims
- 1572US9666512B2Semiconductor packageFAIRCHILD KOREA SEMICONDUCTOR LTD·Filed 2015·Granted May 30, 2017·3 cites·21 claims
- 1672US8766419B2Power module having stacked flip-chip and method of fabricating the power moduleLIM SEUNG-WON·Filed 2009·Granted Jul 1, 2014·6 cites·9 claims
- 1767US8723304B2Semiconductor package and methods of fabricating the sameKANG IN-GOO·Filed 2009·Granted May 13, 2014·6 cites·22 claims
- 1867US8604606B2Heat sink packageEOM JOO-YANG·Filed 2010·Granted Dec 10, 2013·2 cites·16 claims
- 1962US7951645B2Power module for low thermal resistance and method of fabricating the sameFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2010·Granted May 31, 2011·1 cites·8 claims
- 2051US2014217572A1Heat Sink PackageFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2013·Application pending·0 cites
- 2148US8945992B2Power device package comprising metal tab die attach paddle (DAP) and method of fabricating the packageSON JOON-SEO·Filed 2011·Granted Feb 3, 2015·0 cites·9 claims
- 2248US2007181984A1Semiconductor package suitable for high voltage applicationsFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2007·Application pending·0 cites
- 2346US2009127681A1Semiconductor package and method of fabricating the sameFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2008·Application pending·0 cites
- 2440US2009243079A1Semiconductor device packageLIM SEUNG-WON·Filed 2009·Application pending·0 cites
- 2538US2013307145A1Semiconductor package and method of fabricating the sameFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2013·Application pending·0 cites
- 2634US2001045634A1Semiconductor packageFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →