Inventor · disambiguated record
Oh Han Kim
Also filed as: KIM OH HAN
11 granted patents·75 citations·filing 2007–2013
88Inventor score
Top patents by PatentIndex Score
11 records- 0191US8409923B2Integrated circuit packaging system with underfill and method of manufacture thereofKIM OH HAN·Filed 2011·Granted Apr 2, 2013·15 cites·20 claims
- 0290US8536718B2Integrated circuit packaging system with trenches and method of manufacture thereofKO WONJUN·Filed 2010·Granted Sep 17, 2013·16 cites·28 claims
- 0389US7956449B2Stacked integrated circuit package systemSTATS CHIPPAC LTD·Filed 2008·Granted Jun 7, 2011·15 cites·17 claims
- 0486US8466567B2Integrated circuit packaging system with stack interconnect and method of manufacture thereofCHOI DAESIK·Filed 2010·Granted Jun 18, 2013·9 cites·14 claims
- 0579US8604624B2Flip chip interconnection system having solder position control mechanismKIM OH HAN·Filed 2008·Granted Dec 10, 2013·9 cites·5 claims
- 0668US8633586B2Mock bump system for flip chip integrated circuitsKIM OH HAN·Filed 2008·Granted Jan 21, 2014·5 cites·20 claims
- 0761US8513057B2Integrated circuit packaging system with routable underlayer and method of manufacture thereofKIM OH HAN·Filed 2011·Granted Aug 20, 2013·1 cites·20 claims
- 0860US9093415B2Integrated circuit packaging system with heat spreader and method of manufacture thereofKIM OH HAN·Filed 2013·Granted Jul 28, 2015·1 cites·20 claims
- 0959US8859342B2Integrated circuit packaging system with substrate mold gate and method of manufacture thereofKIM OH HAN·Filed 2011·Granted Oct 14, 2014·1 cites·10 claims
- 1055US8748233B2Integrated circuit packaging system with underfill and method of manufacture thereofCHOI DAESIK·Filed 2011·Granted Jun 10, 2014·1 cites·5 claims
- 1152US8709934B2Electronic system with vertical intermetallic compoundKIM BAEYONG·Filed 2007·Granted Apr 29, 2014·2 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →