Inventor · disambiguated record
Olaf Hohlfeld
Also filed as: HOHLFELD OLAF · HOHLFELD OLAF RÜDIGER
40 granted patents·6 pending applications·216 citations·filing 2008–2025
97Inventor score
Files withINFINEON TECHNOLOGIES AG35HOHLFELD OLAF3BAYERER REINHOLD2INFINEON TECHNOLOGIES AUSTRIA AG2INFINEONTECHNOLOGIES AG1
Top patents by PatentIndex Score
46 records- 0196US8963321B2Semiconductor device including cladded base plateINFINEON TECHNOLOGIES AG·Filed 2013·Granted Feb 24, 2015·88 cites·35 claims
- 0293US8514579B2Power semiconductor module including substrates spaced from each otherSTOLZE THILO·Filed 2010·Granted Aug 20, 2013·19 cites·24 claims
- 0393US8159822B2Power semiconductor module featuring resiliently supported substrates and method for fabricating a power semiconductor moduleKANSCHAT PETER·Filed 2010·Granted Apr 17, 2012·20 cites·25 claims
- 0492US11437311B2Semiconductor module and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2020·Granted Sep 6, 2022·2 cites·20 claims
- 0591US8319335B2Power semiconductor module, power semiconductor module assembly and method for fabricating a power semiconductor module assemblyBAYERER REINHOLD·Filed 2010·Granted Nov 27, 2012·14 cites·25 claims
- 0689US10242969B2Semiconductor package comprising a transistor chip module and a driver chip module and a method for fabricating the sameINFINEON TECHNOLOGIES AG·Filed 2013·Granted Mar 26, 2019·12 cites·13 claims
- 0788US12002724B2Power module with metal substrateINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2022·Granted Jun 4, 2024·1 cites·7 claims
- 0887US10043782B2Electronic device package having a dielectric layer and an encapsulantINFINEON TECHNOLOGIES AG·Filed 2017·Granted Aug 7, 2018·5 cites·12 claims
- 0986US10867902B2Semiconductor module and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2018·Granted Dec 15, 2020·3 cites·15 claims
- 1084US9688060B2Method for producing a composite and a power semiconductor moduleBAYERER REINHOLD·Filed 2012·Granted Jun 27, 2017·4 cites·29 claims
- 1184US8587116B2Semiconductor module comprising an insertHOHLFELD OLAF·Filed 2010·Granted Nov 19, 2013·8 cites·14 claims
- 1282US8134837B2Twist-secured assembly of a power semiconductor module mountable on a heat sinkHOHLFELD OLAF·Filed 2010·Granted Mar 13, 2012·7 cites·21 claims
- 1380US8519532B2Semiconductor device including cladded base plateLENNIGER ANDREAS·Filed 2011·Granted Aug 27, 2013·9 cites·14 claims
- 1479US11404336B2Power module with metal substrateINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2020·Granted Aug 2, 2022·1 cites·11 claims
- 1578US7821130B2Module including a rough solder jointINFINEON TECHNOLOGIES AG·Filed 2008·Granted Oct 26, 2010·7 cites·19 claims
- 1677US9196510B2Semiconductor package comprising two semiconductor modules and laterally extending connectorsINFINEON TECHNOLOGIES AG·Filed 2013·Granted Nov 24, 2015·4 cites·17 claims
- 1776US11978700B2Power semiconductor module arrangementINFINEON TECHNOLOGIES AG·Filed 2022·Granted May 7, 2024·0 cites·15 claims
- 1876US11955450B2Method for producing a semiconductor arrangementINFINEON TECHNOLOGIES AG·Filed 2023·Granted Apr 9, 2024·0 cites·20 claims
- 1975US10211158B2Power semiconductor module having a direct copper bonded substrate and an integrated passive component, and an integrated power moduleINFINEON TECHNOLOGIES AG·Filed 2014·Granted Feb 19, 2019·3 cites·13 claims
- 2073US9589859B2Semiconductor arrangement, method for producing a number of chip assemblies and method for producing a semiconductor arrangementINFINEON TECHNOLOGIES AG·Filed 2014·Granted Mar 7, 2017·2 cites·12 claims
- 2171US8981545B2Explosion-protected semiconductor moduleINFINEON TECHNOLOGIES AG·Filed 2013·Granted Mar 17, 2015·3 cites·29 claims
- 2268US11557522B2Method for producing power semiconductor module arrangementINFINEON TECHNOLOGIES AG·Filed 2021·Granted Jan 17, 2023·0 cites·19 claims
- 2366US9640511B2Method for producing a circuit carrier arrangement having a carrier which has a surface formed by an aluminum/silicon carbide metal matrix composite materialINFINEON TECHNOLOGIES AG·Filed 2016·Granted May 2, 2017·1 cites·14 claims
- 2464US9627356B2Semiconductor module, semiconductor module arrangement and method for operating a semiconductor moduleINFINEON TECHNOLOGIES AG·Filed 2016·Granted Apr 18, 2017·1 cites·16 claims
- 2563US11688712B2Semiconductor arrangement and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2020·Granted Jun 27, 2023·0 cites·13 claims
- 2663US9064869B2Semiconductor module and a method for fabrication thereof by extended embedding technologiesINFINEON TECHNOLOGIES AG·Filed 2013·Granted Jun 23, 2015·1 cites·19 claims
- 2760US2025349619A1Method for Attaching Metallic Bodies to Thin Semiconductor Dies at Wafer LevelINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 2856US11322451B2Power semiconductor module having a direct copper bonded substrate and an integrated passive component, and an integrated power moduleINFINEON TECHNOLOGIES AG·Filed 2019·Granted May 3, 2022·0 cites·9 claims
- 2956US11081414B2Power semiconductor module arrangementINFINEON TECHNOLOGIES AG·Filed 2019·Granted Aug 3, 2021·0 cites·16 claims
- 3054US8298867B2Method for fabricating a circuit substrate assembly and a power electronics module comprising an anchoring structure for producing a changing temperature-stable solder bondHOHLFELD OLAF·Filed 2010·Granted Oct 30, 2012·1 cites·24 claims
- 3153US11610830B2Power semiconductor module and method for fabricating the sameINFINEON TECHNOLOGIES AG·Filed 2020·Granted Mar 21, 2023·0 cites·18 claims
- 3252US9984928B2Method for producing a number of chip assemblies and method for producing a semiconductor arrangementINFINEON TECHNOLOGIES AG·Filed 2016·Granted May 29, 2018·0 cites·18 claims
- 3350US9609748B2Semiconductor module comprising printed circuit board and method for producing a semiconductor module comprising a printed circuit boardINFINEON TECHNOLOGIES AG·Filed 2014·Granted Mar 28, 2017·0 cites·21 claims
- 3450US2024266260A1Method for forming a terminal element, terminal element, and power semiconductor module arrangement having a terminal elementINFINEONTECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 3549US11715647B2Method for producing a substrateINFINEON TECHNOLOGIES AG·Filed 2021·Granted Aug 1, 2023·0 cites·14 claims
- 3649US2018350780A1An Electronic Device PackageINFINEON TECHNOLOGIES AG·Filed 2018·Application pending·0 cites
- 3747US9214432B2Explosion-protected semiconductor moduleINFINEON TECHNOLOGIES AG·Filed 2014·Granted Dec 15, 2015·0 cites·23 claims
- 3846US9818730B2Semiconductor arrangement, method for producing a number of chip assemblies, method for producing a semiconductor arrangement and method for operating a semiconductor arrangementINFINEON TECHNOLOGIES AG·Filed 2014·Granted Nov 14, 2017·0 cites·28 claims
- 3946US9620459B2Semiconductor arrangement, method for producing a semiconductor module, method for producing a semiconductor arrangement and method for operating a semiconductor arrangementINFINEON TECHNOLOGIES AG·Filed 2014·Granted Apr 11, 2017·0 cites·21 claims
- 4045US10096584B2Method for producing a power semiconductor moduleINFINEON TECHNOLOGIES AG·Filed 2016·Granted Oct 9, 2018·0 cites·29 claims
- 4144US2020083138A1Power Semiconductor Module Arrangement, Substrate Arrangement, and Method for Producing the SameINFINEON TECHNOLOGIES AG·Filed 2019·Application pending·0 cites
- 4243US2010068552A1Module including a stable solder jointINFINEON TECHNOLOGIES AG·Filed 2009·Application pending·0 cites
- 4342US9595502B2Spring contact for semiconductor chipINFINEON TECHNOLOGIES AG·Filed 2015·Granted Mar 14, 2017·0 cites·19 claims
- 4441US2025273633A1Semiconductor module arrangementINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
- 4540US9524951B2Semiconductor assembly comprising chip arraysINFINEON TECHNOLOGIES AG·Filed 2015·Granted Dec 20, 2016·0 cites·15 claims
- 4639US9972596B2Chip assemblage, press pack cell and method for operating a press pack cellINFINEON TECHNOLOGIES AG·Filed 2015·Granted May 15, 2018·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →