Inventor · disambiguated record
Pao-Hung Chou
Also filed as: CHOU PAO-HUNG
31 granted patents·15 pending applications·34 citations·filing 2006–2025
94Inventor score
Files withPHOENIX PIONEER TECHNOLOGY CO LTD35CHOU PAO-HUNG4PHOENIX PREC TECHNOLOGY CORP4UNIMICRON TECHNOLOGY CORP2ADVANCED SEMICONDUCTOR ENG1
Top patents by PatentIndex Score
46 records- 0183US10117340B2Manufacturing method of package substrate with metal on conductive portionsPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2018·Granted Oct 30, 2018·3 cites·5 claims
- 0281US11183447B2Flip-chip package substrate and method for fabricating the samePHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2020·Granted Nov 23, 2021·1 cites·10 claims
- 0381US9093459B2Package structure having a semiconductor component embedded therein and method of fabricating the sameCHOU PAO-HUNG·Filed 2011·Granted Jul 28, 2015·5 cites·10 claims
- 0477US9806050B2Method of fabricating package structureUNIMICRON TECHNOLOGY CORP·Filed 2015·Granted Oct 31, 2017·2 cites·9 claims
- 0576US11476204B2Flip-chip packaging substrate and method for fabricating the samePHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2019·Granted Oct 18, 2022·2 cites·3 claims
- 0676US2025372299A1Manufacturing method of composite-type micro-inductorPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2025·Application pending·0 cites
- 0774US12476378B2Antenna module, antenna supporting substrate and manufacturing method thereofPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2023·Granted Nov 18, 2025·0 cites·11 claims
- 0873US2025316415A1Inductor structure and manufacturing method thereofPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2025·Application pending·0 cites
- 0971US9342772B2Substrate structure and method of manufacturing the samePHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2014·Granted May 17, 2016·2 cites·9 claims
- 1071US7786571B2Heat-conductive package structureUNIMICRON TECHNOLOGY CORP·Filed 2008·Granted Aug 31, 2010·7 cites·20 claims
- 1169US2025140467A1Inductive structurePHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2024·Application pending·0 cites
- 1267US11069540B2Package on package and a method of fabricating the samePHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2014·Granted Jul 20, 2021·2 cites·6 claims
- 1367US7627946B2Method for fabricating a metal protection layer on electrically connecting pad of circuit boardPHOENIX PREC TECHNOLOGY CORP·Filed 2007·Granted Dec 8, 2009·3 cites·10 claims
- 1466US12154866B2Method of fabricating a flip-chip package core substrate with build-up layersPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2022·Granted Nov 26, 2024·0 cites·2 claims
- 1566US2024221999A1Inductor structure and manufacturing method thereofPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2023·Application pending·0 cites
- 1665US2025174874A1Hollow Antenna Substrate and Its Manufacturing Method for Antenna Packaging ApplicationsPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2024·Application pending·0 cites
- 1764US10014242B2Interposer substrate and method of fabricating the samePHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2015·Granted Jul 3, 2018·1 cites·3 claims
- 1863US9338900B2Interposer substrate and method of fabricating the samePHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2014·Granted May 10, 2016·1 cites·13 claims
- 1962US7378345B2Metal electroplating process of an electrically connecting pad structure of circuit board and structure thereofPHOENIX PREC TECHNOLOGY CORP·Filed 2006·Granted May 27, 2008·2 cites·8 claims
- 2060US12094922B2Inductance traces protected through shielding layersPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2022·Granted Sep 17, 2024·0 cites·16 claims
- 2160US2024145155A1Core structure of inductor element and method of manufacturing the samePHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2023·Application pending·0 cites
- 2260US2024194386A1Inductor structure, magnetically permeable body and manufacturing method thereofPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2023·Application pending·0 cites
- 2360US2024222140A1Package carrier board integrated with inductive circuit structure and manufacturing method thereofPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2023·Application pending·0 cites
- 2459US2024161957A1Inductor structure and manufacturing method thereofPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2023·Application pending·0 cites
- 2559US2020332429A1Method of fabricating package substratesPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2020·Application pending·0 cites
- 2658US8222528B2Circuit board structure for electrical testing and fabrication method thereofCHOU PAO-HUNG·Filed 2008·Granted Jul 17, 2012·1 cites·8 claims
- 2758US2025203293A1Planar voice coil, planar voice coil substrate, and manufacturing method for planar voice coil substratePHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2024·Application pending·0 cites
- 2858US2024055274A1Semiconductor package carrier board structure and manufacturing method thereofPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2023·Application pending·0 cites
- 2956US11404348B2Semiconductor package carrier board, method for fabricating the same, and electronic package having the samePHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2020·Granted Aug 2, 2022·0 cites·16 claims
- 3055US9230895B2Package substrate and fabrication method thereofCHOU PAO-HUNG·Filed 2011·Granted Jan 5, 2016·2 cites·3 claims
- 3154US11335630B2Semiconductor package substrate, electronic package and methods for fabricating the samePHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2020·Granted May 17, 2022·0 cites·10 claims
- 3253US11658104B2Intermediate substrate and fabrication method thereofPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2022·Granted May 23, 2023·0 cites·21 claims
- 3353US10483194B2Interposer substrate and method of fabricating the samePHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2018·Granted Nov 19, 2019·0 cites·5 claims
- 3451US11508673B2Semiconductor packaging substrate, fabrication method and packaging process thereofPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2021·Granted Nov 22, 2022·0 cites·8 claims
- 3551US10745818B2Method of fabricating package substratesPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2016·Granted Aug 18, 2020·0 cites·5 claims
- 3650US11791281B2Package substrate and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Oct 17, 2023·0 cites·13 claims
- 3750US11450597B2Semiconductor package substrate having heat dissipating metal sheet on solder pads, method for fabricating the same, and electronic package having the samePHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2020·Granted Sep 20, 2022·0 cites·8 claims
- 3849US9911626B2Interposer substrate and method for fabricating the samePHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2014·Granted Mar 6, 2018·0 cites·5 claims
- 3948US9992879B2Package substrate with metal on conductive portions and manufacturing method thereofPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2016·Granted Jun 5, 2018·0 cites·7 claims
- 4046US9852977B2Package substratePHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2016·Granted Dec 26, 2017·0 cites·16 claims
- 4144US11139230B2Flip-chip package substrate and method for preparing the samePHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2019·Granted Oct 5, 2021·0 cites·15 claims
- 4244US2009039493A1Packaging substrate and application thereofPHOENIX PREC TECHNOLOGY CORP·Filed 2008·Application pending·0 cites
- 4342US9780022B2Substrate structurePHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2016·Granted Oct 3, 2017·0 cites·6 claims
- 4440US2008245551A1Circuit board structure for embedding semiconductor chip therein and method for fabricating the samePHOENIX PREC TECHNOLOGY CORP·Filed 2008·Application pending·0 cites
- 4535US10347575B2Package substrate and its fabrication methodPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2016·Granted Jul 9, 2019·0 cites·6 claims
- 4629US2012097430A1Packaging substrate and method of fabricating the sameCHOU PAO-HUNG·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →