Inventor · disambiguated record
Paul M. Feeney
Also filed as: FEENEY PAUL · FEENEY PAUL M
17 granted patents·4 pending applications·630 citations·filing 1997–2009
95Inventor score
Top patents by PatentIndex Score
21 records- 0197US7998335B2Controlled electrochemical polishing methodCABOT MICROELECTRONICS CORP·Filed 2005·Granted Aug 16, 2011·77 cites·28 claims
- 0294US9343330B2Compositions for polishing aluminum/copper and titanium in damascene structuresBRUSIC VLASTA·Filed 2006·Granted May 17, 2016·41 cites·4 claims
- 0393US6348076B1Slurry for mechanical polishing (CMP) of metals and use thereofIBM·Filed 1999·Granted Feb 19, 2002·147 cites·26 claims
- 0492US7585340B2Polishing composition containing polyether amineCABOT MICROELECTRONICS CORP·Filed 2006·Granted Sep 8, 2009·19 cites·7 claims
- 0591US6495917B1Method and structure of column interconnectIBM·Filed 2000·Granted Dec 17, 2002·71 cites·13 claims
- 0687US7897061B2Compositions and methods for CMP of phase change alloysCABOT MICROELECTRONICS CORP·Filed 2007·Granted Mar 1, 2011·14 cites·6 claims
- 0784US6726534B1Preequilibrium polishing method and systemCABOT MICROELECTRONICS CORP·Filed 2002·Granted Apr 27, 2004·39 cites·45 claims
- 0884US6503827B1Method of reducing planarization defectsIBM·Filed 2000·Granted Jan 7, 2003·42 cites·24 claims
- 0982US6632377B1Chemical-mechanical planarization of metallurgyIBM·Filed 1999·Granted Oct 14, 2003·70 cites·10 claims
- 1080US6841479B2Method of reducing in-trench smearing during polishingCABOT MICROELECTRONICS CORP·Filed 2002·Granted Jan 11, 2005·24 cites·17 claims
- 1179US6426558B1Metallurgy for semiconductor devicesIBM·Filed 2001·Granted Jul 30, 2002·28 cites·8 claims
- 1266US8741009B2Polishing composition containing polyether amineDYSARD JEFFREY M·Filed 2009·Granted Jun 3, 2014·2 cites·11 claims
- 1362US6294105B1Chemical mechanical polishing slurry and method for polishing metal/oxide layersIBM·Filed 1997·Granted Sep 25, 2001·22 cites·7 claims
- 1459US6355565B2Chemical-mechanical-polishing slurry and method for polishing metal/oxide layersIBM·Filed 2001·Granted Mar 12, 2002·5 cites·8 claims
- 1549US6350393B2Use of CsOH in a dielectric CMP slurryCABOT MICROELECTRONICS CORP·Filed 1999·Granted Feb 26, 2002·16 cites·10 claims
- 1649US6007411AWafer carrier for chemical mechanical polishingIBM·Filed 1997·Granted Dec 28, 1999·13 cites·17 claims
- 1745US7837888B2Composition and method for damascene CMPCABOT MICROELECTRONICS CORP·Filed 2006·Granted Nov 23, 2010·0 cites·22 claims
- 1845US2008105652A1CMP of copper/ruthenium/tantalum substratesCABOT MICROELECTRONICS CORP·Filed 2006·Application pending·0 cites
- 1943US2009156006A1Compositions and methods for cmp of semiconductor materialsANJUR SRIRAM·Filed 2007·Application pending·0 cites
- 2042US2007077865A1Method for controlling polysilicon removalCABOT MICROELECTRONICS CORP·Filed 2005·Application pending·0 cites
- 2132US2001037821A1Integrated chemical-mechanical polishingFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →