Inventor · disambiguated record
Paul Lindquist
Also filed as: LINDQUIST PAUL · LINDQUIST PAUL G · LINDQUIST PAUL GEORGE
7 granted patents·4 pending applications·164 citations·filing 1996–2021
86Inventor score
Files withMELIOR INNOVATIONS INC2NUTOOL INC2ASM NUTOOL INC1NOVELLUS SYSTEMS INC1SCP GLOBAL TECHNOLOGIES1
Top patents by PatentIndex Score
11 records- 0198US6413403B1Method and apparatus employing pad designs and structures with improved fluid distributionNUTOOL INC·Filed 2000·Granted Jul 2, 2002·93 cites·22 claims
- 0282US6802946B2Apparatus for controlling thickness uniformity of electroplated and electroetched layersNUTOOL INC·Filed 2001·Granted Oct 12, 2004·26 cites·54 claims
- 0368US6821409B2Electroetching methods and systems using chemical and mechanical influenceASM NUTOOL INC·Filed 2002·Granted Nov 23, 2004·10 cites·40 claims
- 0463US7435323B2Method for controlling thickness uniformity of electroplated layersNOVELLUS SYSTEMS INC·Filed 2004·Granted Oct 14, 2008·7 cites·34 claims
- 0556US5882598AWafer gap conductivity cell for characterizing process vessels and semiconductor fabrication processes and method of useSCP GLOBAL TECHNOLOGIES·Filed 1996·Granted Mar 16, 1999·19 cites·21 claims
- 0654US2021221023A1Applications, Methods And Systems For Additive Manufacturing With SiOC Build MaterialsMELIOR INNOVATIONS INC·Filed 2021·Application pending·0 cites
- 0748US2019337842A1Polymer Derived Ceramic Coatings and Additives for GlassMELIOR INNOVATIONS INC·Filed 2018·Application pending·0 cites
- 0844US10500587B2Ferro-magnetic shape memory alloy microcavity fluid sensorUNIV BOISE STATE·Filed 2016·Granted Dec 10, 2019·0 cites·8 claims
- 0943US2005133380A1Electroetching methods and systems using chemical and mechanical influenceFiled 2004·Application pending·0 cites
- 1037US2004140287A1Edge and bevel cleaning process and systemFiled 2003·Application pending·0 cites
- 1134US6878213B1Process and system for rinsing of semiconductor substratesSCP GLOBAL TECHNOLOGIES INC·Filed 1999·Granted Apr 12, 2005·9 cites·36 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →