Inventor · disambiguated record
Paul S. Mclaughlin
Also filed as: MCLAUGHLIN PAUL S · MCLAUGHLIN PAUL STEPHEN
27 granted patents·2 pending applications·587 citations·filing 1997–2017
96Inventor score
Top patents by PatentIndex Score
29 records- 0199US7397260B2Structure and method for monitoring stress-induced degradation of conductive interconnectsIBM·Filed 2005·Granted Jul 8, 2008·169 cites·12 claims
- 0296US6069068ASub-quarter-micron copper interconnections with improved electromigration resistance and reduced defect sensitivityIBM·Filed 1997·Granted May 30, 2000·224 cites·12 claims
- 0394US9472477B1Electromigration test structure for Cu barrier integrity and blech effect evaluationsIBM·Filed 2015·Granted Oct 18, 2016·6 cites·9 claims
- 0491US7301236B2Increasing electromigration lifetime and current density in IC using vertically upwardly extending dummy viaIBM·Filed 2005·Granted Nov 27, 2007·18 cites·17 claims
- 0587US7439173B2Increasing electromigration lifetime and current density in IC using vertically upwardly extending dummy viaIBM·Filed 2007·Granted Oct 21, 2008·13 cites·13 claims
- 0681US7479447B2Method of forming a crack stop void in a low-k dielectric layer between adjacent fusesIBM·Filed 2006·Granted Jan 20, 2009·10 cites·20 claims
- 0780US10191108B2On-chip sensor for monitoring active circuits on integrated circuit (IC) chipsGLOBALFOUNDRIES INC·Filed 2015·Granted Jan 29, 2019·2 cites·20 claims
- 0879US7671362B2Test structure for determining optimal seed and liner layer thicknesses for dual damascene processingIBM·Filed 2007·Granted Mar 2, 2010·6 cites·7 claims
- 0979US7388224B2Structure for determining thermal cycle reliabilityIBM·Filed 2006·Granted Jun 17, 2008·4 cites·14 claims
- 1078US8726201B2Method and system to predict a number of electromigration critical elementsBICKFORD JEANNE P·Filed 2010·Granted May 13, 2014·6 cites·21 claims
- 1176US8114768B2Electromigration resistant via-to-line interconnectLI BAOZHEN·Filed 2008·Granted Feb 14, 2012·6 cites·20 claims
- 1276US6995392B2Test structure for locating electromigration voids in dual damascene interconnectsIBM·Filed 2002·Granted Feb 7, 2006·18 cites·11 claims
- 1375US6261951B1Plasma treatment to enhance inorganic dielectric adhesion to copperIBM·Filed 1999·Granted Jul 17, 2001·34 cites·19 claims
- 1473US6258710B1Sub-quarter-micron copper interconnections with improved electromigration resistance and reduced defect sensitivityIBM·Filed 1999·Granted Jul 10, 2001·39 cites·9 claims
- 1572US7394154B2Embedded barrier for dielectric encapsulationIBM·Filed 2005·Granted Jul 1, 2008·3 cites·5 claims
- 1672US6593660B2Plasma treatment to enhance inorganic dielectric adhesion to copperIBM·Filed 2001·Granted Jul 15, 2003·11 cites·12 claims
- 1771US7701035B2Laser fuse structures for high power applicationsIBM·Filed 2005·Granted Apr 20, 2010·5 cites·14 claims
- 1870US7639032B2Structure for monitoring stress-induced degradation of conductive interconnectsIBM·Filed 2007·Granted Dec 29, 2009·2 cites·7 claims
- 1969US8053257B2Method for prediction of premature dielectric breakdown in a semiconductorIBM·Filed 2008·Granted Nov 8, 2011·5 cites·11 claims
- 2063US7968456B2Method of forming an embedded barrier layer for protection from chemical mechanical polishing processIBM·Filed 2008·Granted Jun 28, 2011·1 cites·16 claims
- 2162US7098054B2Method and structure for determining thermal cycle reliabilityIBM·Filed 2004·Granted Aug 29, 2006·5 cites·16 claims
- 2259US9759766B2Electromigration test structure for Cu barrier integrity and blech effect evaluationsIBM·Filed 2016·Granted Sep 12, 2017·0 cites·4 claims
- 2357US7692439B2Structure for modeling stress-induced degradation of conductive interconnectsIBM·Filed 2008·Granted Apr 6, 2010·0 cites·6 claims
- 2456US9443776B2Method and structure for determining thermal cycle reliabilityGLOBALFOUNDRIES INC·Filed 2015·Granted Sep 13, 2016·0 cites·10 claims
- 2551US9287186B2Method and structure for determining thermal cycle reliabilityFILIPPI RONALD GENE·Filed 2008·Granted Mar 15, 2016·0 cites·10 claims
- 2648US8922022B2Electromigration resistant via-to-line interconnectLI BAOZHEN·Filed 2012·Granted Dec 30, 2014·0 cites·18 claims
- 2745US10840174B2Metallic synapses for neuromorphic and evolvable hardwareSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Nov 17, 2020·0 cites·20 claims
- 2845US2009006014A1Non-Destructive Electrical Characterization Macro and Methodology for In-Line Interconnect Spacing MonitoringIBM·Filed 2007·Application pending·0 cites
- 2941US2006281338A1Method for prediction of premature dielectric breakdown in a semiconductorIBM·Filed 2005·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Paul S. Mclaughlin files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →