Inventor · disambiguated record
Paul Mescher
Also filed as: MESCHER PAUL ALLEN · Mescher Paul
8 granted patents·1 pending application·146 citations·filing 1995–2023
86Inventor score
Technology areasH10W
Top patents by PatentIndex Score
9 records- 0193US9892990B1Semiconductor package lid thermal interface material standoffsAMKOR TECHNOLOGY INC·Filed 2014·Granted Feb 13, 2018·26 cites·19 claims
- 0288US6130476ASemiconductor chip package having chip-to-carrier mechanical/electrical connection formed via solid state diffusionIBM·Filed 1995·Granted Oct 10, 2000·85 cites·9 claims
- 0375US2024194615A1Integrated shield package and methodAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Application pending·0 cites
- 0468US6162660AMethod for joining a semiconductor chip to a chip carrier substrate and resulting chip packageIBM·Filed 1995·Granted Dec 19, 2000·28 cites·13 claims
- 0567US10109591B1Integrated shield package and methodMescher Paul·Filed 2011·Granted Oct 23, 2018·3 cites·4 claims
- 0666US11848275B2Integrated shield package and methodAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Dec 19, 2023·0 cites·14 claims
- 0755US10886235B2Integrated shield package and methodAMKOR TECHNOLOGY INC·Filed 2018·Granted Jan 5, 2021·0 cites·19 claims
- 0849US6821814B2Method for joining a semiconductor chip to a chip carrier substrate and resulting chip packageIBM·Filed 2000·Granted Nov 23, 2004·3 cites·5 claims
- 0944US6294828B1Semiconductor chip packageIBM·Filed 2000·Granted Sep 25, 2001·1 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →