Inventor · disambiguated record
Paul A. Morgan
Also filed as: MORGAN PAUL · MORGAN PAUL A · MORGAN PAUL ALISTAIR
54 granted patents·8 pending applications·906 citations·filing 1998–2024
99Inventor score
Top patents by PatentIndex Score
62 records- 0198US7253118B2Pitch reduced patterns relative to photolithography featuresMICRON TECHNOLOGY INC·Filed 2005·Granted Aug 7, 2007·161 cites·52 claims
- 0297US8252194B2Methods of removing silicon oxideKIEHLBAUCH MARK W·Filed 2008·Granted Aug 28, 2012·156 cites·23 claims
- 0397US7651951B2Pitch reduced patterns relative to photolithography featuresMICRON TECHNOLOGY INC·Filed 2007·Granted Jan 26, 2010·46 cites·28 claims
- 0495US9761457B2Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including sameMICRON TECHNOLOGY INC·Filed 2016·Granted Sep 12, 2017·7 cites·8 claims
- 0595US8852851B2Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including sameZHOU BAOSUO·Filed 2006·Granted Oct 7, 2014·23 cites·10 claims
- 0695US7718540B2Pitch reduced patterns relative to photolithography featuresROUND ROCK RES LLC·Filed 2007·Granted May 18, 2010·22 cites·5 claims
- 0794US10096483B2Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including sameMICRON TECHNOLOGY INC·Filed 2017·Granted Oct 9, 2018·6 cites·8 claims
- 0894US8048812B2Pitch reduced patterns relative to photolithography featuresROUND ROCK RES LLC·Filed 2010·Granted Nov 1, 2011·11 cites·20 claims
- 0993US8207576B2Pitch reduced patterns relative to photolithography featuresTRAN LUAN·Filed 2007·Granted Jun 26, 2012·18 cites·25 claims
- 1092US10607844B2Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including sameMICRON TECHNOLOGY INC·Filed 2018·Granted Mar 31, 2020·4 cites·4 claims
- 1192US8598632B2Integrated circuit having pitch reduced patterns relative to photoithography featuresTRAN LUAN·Filed 2012·Granted Dec 3, 2013·10 cites·6 claims
- 1290US12463044B2Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including sameLODESTAR LICENSING GROUP LLC·Filed 2024·Granted Nov 4, 2025·0 cites·12 claims
- 1389US7935242B2Method of selectively removing conductive materialMICRON TECHNOLOGY INC·Filed 2006·Granted May 3, 2011·13 cites·37 claims
- 1488US8119535B2Pitch reduced patterns relative to photolithography featuresTRAN LUAN·Filed 2009·Granted Feb 21, 2012·8 cites·19 claims
- 1588US6645874B1Delivery of dissolved ozoneMICRON TECHNOLOGY INC·Filed 2001·Granted Nov 11, 2003·34 cites·23 claims
- 1686US6756682B2High aspect ratio fill method and resulting structureMICRON TECHNOLOGY INC·Filed 2003·Granted Jun 29, 2004·28 cites·32 claims
- 1786US6290863B1Method and apparatus for etch of a specific subarea of a semiconductor work objectMICRON TECHNOLOGY INC·Filed 1999·Granted Sep 18, 2001·79 cites·70 claims
- 1884US8026180B2Methods of modifying oxide spacersMICRON TECHNOLOGY INC·Filed 2007·Granted Sep 27, 2011·8 cites·17 claims
- 1984US6787450B2High aspect ratio fill method and resulting structureMICRON TECHNOLOGY INC·Filed 2002·Granted Sep 7, 2004·26 cites·25 claims
- 2083US9305782B2Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including sameMICRON TECHNOLOGY INC·Filed 2014·Granted Apr 5, 2016·3 cites·10 claims
- 2183US7915735B2Selective metal deposition over dielectric layersMICRON TECHNOLOGY INC·Filed 2005·Granted Mar 29, 2011·8 cites·64 claims
- 2282US11935756B2Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including sameLODESTAR LICENSING GROUP LLC·Filed 2022·Granted Mar 19, 2024·0 cites·8 claims
- 2381US6737283B2Method to isolate device layer edges through mechanical spacingMICRON TECHNOLOGY INC·Filed 2002·Granted May 18, 2004·19 cites·27 claims
- 2481US6589882B2Copper post-etch cleaning processMICRON TECHNOLOGY INC·Filed 2001·Granted Jul 8, 2003·26 cites·17 claims
- 2578US7060631B2Methods of cleaning surfaces of copper-containing materials, and methods of forming openings to copper-containing substratesMICRON TECHNOLOGY INC·Filed 2005·Granted Jun 13, 2006·4 cites·7 claims
- 2676US6399492B1Ruthenium silicide processing methodsMICRON TECHNOLOGY INC·Filed 2001·Granted Jun 4, 2002·18 cites·44 claims
- 2774US11335563B2Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including sameMICRON TECHNOLOGY INC·Filed 2020·Granted May 17, 2022·0 cites·7 claims
- 2873US9005473B2Gaseous compositions comprising hydrogen fluoride and an alkylated ammonia derivativeKIEHLBAUCH MARK W·Filed 2012·Granted Apr 14, 2015·2 cites·10 claims
- 2972US6867148B2Removal of organic material in integrated circuit fabrication using ozonated organic acid solutionsMICRON TECHNOLOGY INC·Filed 2001·Granted Mar 15, 2005·14 cites·28 claims
- 3072US6758938B1Delivery of dissolved ozoneMICRON TECHNOLOGY INC·Filed 1999·Granted Jul 6, 2004·30 cites·31 claims
- 3172US6017827ASystem and method for mixing a gas into a solvent used in semiconductor processingMICRON TECHNOLOGY INC·Filed 1998·Granted Jan 25, 2000·41 cites·49 claims
- 3271US7585782B2Methods of forming semiconductor constructions, and methods of selectively removing metal-containing materials relative to oxideMICRON TECHNOLOGY INC·Filed 2006·Granted Sep 8, 2009·3 cites·19 claims
- 3368US7659210B2Nano-crystal etch processMICRON TECHNOLOGY INC·Filed 2007·Granted Feb 9, 2010·2 cites·20 claims
- 3468US6905974B2Methods using a peroxide-generating compound to remove group VIII metal-containing residueMICRON TECHNOLOGY INC·Filed 2002·Granted Jun 14, 2005·9 cites·30 claims
- 3568US6417016B1Structure and method for field emitter tipsMICRON TECHNOLOGY INC·Filed 1999·Granted Jul 9, 2002·15 cites·39 claims
- 3666US6541391B2Methods of cleaning surfaces of copper-containing materials, and methods of forming openings to copper-containing substratesMICRON TECHNOLOGY INC·Filed 2001·Granted Apr 1, 2003·13 cites·25 claims
- 3765US9269586B2Selective metal deposition over dielectric layersMORGAN PAUL A·Filed 2012·Granted Feb 23, 2016·1 cites·18 claims
- 3865US6952360B2Device with layer edges separated through mechanical spacingMICRON TECHNOLOGY INC·Filed 2003·Granted Oct 4, 2005·7 cites·29 claims
- 3965US6835668B2Copper post-etch cleaning processMICRON TECHNOLOGY INC·Filed 2002·Granted Dec 28, 2004·10 cites·18 claims
- 4063US8513135B2Methods of modifying oxide spacersGREELEY JOSEPH NEIL·Filed 2011·Granted Aug 20, 2013·1 cites·20 claims
- 4162US6930017B2Wafer Cleaning method and resulting waferMICRON TECHNOLOGY INC·Filed 2003·Granted Aug 16, 2005·8 cites·26 claims
- 4260US6653243B2Methods of cleaning surfaces of copper-containing materials, and methods of forming openings to copper-containing substratesMICRON TECHNOLOGY INC·Filed 2000·Granted Nov 25, 2003·5 cites·7 claims
- 4358US8809198B2Nano-crystal etch processALAPATI RAMAKANTH·Filed 2009·Granted Aug 19, 2014·0 cites·25 claims
- 4455US2005282301A1Structure and method for field emitter tipsMICRON TECHNOLOGY INC·Filed 2005·Application pending·0 cites
- 4554US6790786B2Etching processes for integrated circuit manufacturing including methods of forming capacitorsMICRON TECHNOLOGY INC·Filed 2002·Granted Sep 14, 2004·4 cites·59 claims
- 4653US8500913B2Methods for treating surfaces, and methods for removing one or more materials from surfacesKIEHLBAUCH MARK·Filed 2007·Granted Aug 6, 2013·0 cites·8 claims
- 4752US8338297B2Selective metal deposition over dielectric layersMORGAN PAUL A·Filed 2012·Granted Dec 25, 2012·0 cites·9 claims
- 4852US6933665B2Structure and method for field emitter tipsMICRON TECHNOLOGY INC·Filed 2002·Granted Aug 23, 2005·1 cites·23 claims
- 4952US2013186431A1Methods for Treating Surfaces, Methods for Removing One or More Materials from Surfaces, and Apparatuses for Treating SurfacesMICRON TECHNOLOGY INC·Filed 2013·Application pending·0 cites
- 5051US2007099397A1Microfeature dies with porous regions, and associated methods and systemsMICRON TECHNOLOGY INC·Filed 2006·Application pending·0 cites
Showing the top 50 of 62 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →