Inventor · disambiguated record
Peter A. Moschak
Also filed as: MOSCHAK PETER A
9 granted patents·1 pending application·162 citations·filing 1986–2011
89Inventor score
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10 records- 0187US6156221ACopper etching compositions, processes and products derived therefromIBM·Filed 1998·Granted Dec 5, 2000·48 cites·20 claims
- 0280US7977034B1Method for making circuitized substrates having photo-imageable dielectric layers in a continuous mannerENDICOTT INTERCONNECT TECH INC·Filed 2010·Granted Jul 12, 2011·4 cites·11 claims
- 0377US6830627B1Copper cleaning compositions, processes and products derived therefromIBM·Filed 1999·Granted Dec 14, 2004·34 cites·20 claims
- 0477US6521844B1Through hole in a photoimageable dielectric structure with wired and uncured dielectricIBM·Filed 1999·Granted Feb 18, 2003·33 cites·11 claims
- 0565US7827682B2Apparatus for making circuitized substrates having photo-imageable dielectric layers in a continuous mannerENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Nov 9, 2010·2 cites·10 claims
- 0655US4786528AProcess for treating reinforced polymer compositeIBM·Filed 1986·Granted Nov 22, 1988·16 cites·16 claims
- 0753US6521328B1Copper etching compositions and products derived therefromIBM·Filed 2000·Granted Feb 18, 2003·9 cites·5 claims
- 0851US6830875B2Forming a through hole in a photoimageable dielectric structureIBM·Filed 2002·Granted Dec 14, 2004·3 cites·17 claims
- 0946US6291776B1Thermal deformation management for chip carriersIBM·Filed 1998·Granted Sep 18, 2001·13 cites·12 claims
- 1044US2012228014A1Circuitized substrate with internal thin film capacitor and method of making sameDAS RABINDRA N·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →