Inventor · disambiguated record
Peng Suo
Also filed as: SUO PENG
7 granted patents·7 pending applications·5 citations·filing 2017–2023
75Inventor score
Files withAPPLIED MATERIALS INC14
Top patents by PatentIndex Score
14 records- 0193US11854886B2Methods of TSV formation for advanced packagingAPPLIED MATERIALS INC·Filed 2022·Granted Dec 26, 2023·2 cites·6 claims
- 0289US11404318B2Methods of forming through-silicon vias in substrates for advanced packagingAPPLIED MATERIALS INC·Filed 2020·Granted Aug 2, 2022·2 cites·20 claims
- 0380US12374586B2Methods of TSV formation for advanced packagingAPPLIED MATERIALS INC·Filed 2023·Granted Jul 29, 2025·0 cites·20 claims
- 0469US11373803B2Method of forming a magnetic core on a substrateAPPLIED MATERIALS INC·Filed 2018·Granted Jun 28, 2022·1 cites·17 claims
- 0567US11791094B2Semiconductor substrate having magnetic core inductorAPPLIED MATERIALS INC·Filed 2021·Granted Oct 17, 2023·0 cites·19 claims
- 0656US2024110284A1Selective Deposition of Thin Films with Improved StabilityAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 0750US10636696B1Methods for forming vias in polymer layersAPPLIED MATERIALS INC·Filed 2019·Granted Apr 28, 2020·0 cites·20 claims
- 0843US2024330671A1Automation method for defect characterization for hybrid bonding applicationAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 0941US2019287898A1Methods and apparatus for embedded antifusesAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
- 1040US2021202334A1Methods and apparatus for wafer-level packaging using direct writingAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
- 1139US2024331131A1Pre-bonding automatic optical inspection defect classificationAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1237US10475735B2Methods and apparatus for 3D MIM capacitor package processingAPPLIED MATERIALS INC·Filed 2017·Granted Nov 12, 2019·0 cites·20 claims
- 1337US2019051596A1Method of increasing embedded 3d metal-insulator-metal (mim) capacitor capacitance density for wafer level packagingAPPLIED MATERIALS INC·Filed 2017·Application pending·0 cites
- 1436US2020306931A1Methods and apparatus for removing abrasive particlesAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →