Inventor · disambiguated record
Philip R. Osborn
Also filed as: OSBORN PHILIP · OSBORN PHILIP R
20 granted patents·8 pending applications·514 citations·filing 1999–2023
95Inventor score
Files withTESSERA INC20ADEIA SEMICONDUCTOR SOLUTIONS LLC2TESSERA RESEARCH LLC2HABA BELGACEM1MOHAMMED ILYAS1
Top patents by PatentIndex Score
28 records- 0198US9224717B2Package-on-package assembly with wire bonds to encapsulation surfaceTESSERA INC·Filed 2014·Granted Dec 29, 2015·76 cites·20 claims
- 0298US9093435B2Package-on-package assembly with wire bonds to encapsulation surfaceTESSERA INC·Filed 2013·Granted Jul 28, 2015·68 cites·23 claims
- 0398US8618659B2Package-on-package assembly with wire bonds to encapsulation surfaceSATO HIROAKI·Filed 2012·Granted Dec 31, 2013·147 cites·38 claims
- 0497US11830845B2Package-on-package assembly with wire bonds to encapsulation surfaceADEIA SEMICONDUCTOR SOLUTIONS LLC·Filed 2022·Granted Nov 28, 2023·4 cites·19 claims
- 0596US7994622B2Microelectronic packages having cavities for receiving microelectric elementsTESSERA INC·Filed 2008·Granted Aug 9, 2011·37 cites·18 claims
- 0691US10062661B2Package-on-package assembly with wire bonds to encapsulation surfaceTESSERA INC·Filed 2017·Granted Aug 28, 2018·5 cites·14 claims
- 0790US7061122B2Components, methods and assemblies for multi-chip packagesTESSERA INC·Filed 2003·Granted Jun 13, 2006·44 cites·27 claims
- 0888US6214640B1Method of manufacturing a plurality of semiconductor packagesTESSERA INC·Filed 1999·Granted Apr 10, 2001·119 cites·26 claims
- 0985US11424211B2Package-on-package assembly with wire bonds to encapsulation surfaceTESSERA LLC·Filed 2020·Granted Aug 23, 2022·1 cites·29 claims
- 1082US8008785B2Microelectronic assembly with joined bond elements having lowered inductanceTESSERA RESEARCH LLC·Filed 2010·Granted Aug 30, 2011·5 cites·37 claims
- 1178US8410618B2Microelectronic assembly with joined bond elements having lowered inductanceHABA BELGACEM·Filed 2011·Granted Apr 2, 2013·3 cites·22 claims
- 1277US10593643B2Package-on-package assembly with wire bonds to encapsulation surfaceTESSERA INC·Filed 2018·Granted Mar 17, 2020·1 cites·14 claims
- 1372US12494453B2Package-on-package assembly with wire bonds to encapsulation surfaceADEIA SEMICONDUCTOR SOLUTIONS LLC·Filed 2023·Granted Dec 9, 2025·0 cites·16 claims
- 1472US10833044B2Package-on-package assembly with wire bonds to encapsulation surfaceTESSERA INC·Filed 2020·Granted Nov 10, 2020·0 cites·18 claims
- 1570US9691731B2Package-on-package assembly with wire bonds to encapsulation surfaceTESSERA INC·Filed 2015·Granted Jun 27, 2017·1 cites·20 claims
- 1663US7268304B2Microelectronic connection components having bondable wiresTESSERA INC·Filed 2005·Granted Sep 11, 2007·3 cites·9 claims
- 1757US9105612B2Microelectronic packages having cavities for receiving microelectronic elementsTESSERA INC·Filed 2013·Granted Aug 11, 2015·0 cites·19 claims
- 1856US8816514B2Microelectronic assembly with joined bond elements having lowered inductanceTESSERA INC·Filed 2013·Granted Aug 26, 2014·0 cites·13 claims
- 1956US2014124565A1Microelectronic assembly with joined bond elements having lowered inductanceTESSERA INC·Filed 2014·Application pending·0 cites
- 2054US9633968B2Microelectronic packages having cavities for receiving microelectronic elementsTESSERA INC·Filed 2015·Granted Apr 25, 2017·0 cites·10 claims
- 2153US8541873B2Microelectronic packages having cavities for receiving microelectronic elementsMOHAMMED ILYAS·Filed 2011·Granted Sep 24, 2013·0 cites·16 claims
- 2249US2007166876A1Components, methods and assemblies for multi-chip packagesTESSERA INC·Filed 2006·Application pending·0 cites
- 2347US2011147928A1Microelectronic assembly with bond elements having lowered inductanceTESSERA RESEARCH LLC·Filed 2009·Application pending·0 cites
- 2444US2008185705A1Microelectronic packages and methods thereforTESSERA INC·Filed 2007·Application pending·0 cites
- 2543US2005189622A1Packaged acoustic and electromagnetic transducer chipsTESSERA INC·Filed 2005·Application pending·0 cites
- 2643US2005189635A1Packaged acoustic and electromagnetic transducer chipsTESSERA INC·Filed 2005·Application pending·0 cites
- 2742US2007152310A1Electrical ground method for ball stack packageTESSERA INC·Filed 2005·Application pending·0 cites
- 2838US2005150813A1Foldover packages and manufacturing and test methods thereforTESSERA INC·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →