Inventor · disambiguated record
Ping-Pang Hsieh
Also filed as: HSIEH PING-PANG
23 granted patents·4 pending applications·28 citations·filing 2004–2025
92Inventor score
Top patents by PatentIndex Score
27 records- 0193US11527543B2Polysilicon removal in word line contact region of memory devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 13, 2022·4 cites·20 claims
- 0290US10699960B2Methods for improving interlayer dielectric layer topographyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 30, 2020·6 cites·20 claims
- 0383US2025324589A1Polysilicon Removal In Word Line Contact Region Of Memory DevicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0482US2025366169A1Semiconductor device structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0579US12376297B2Polysilicon removal in word line contact region of memory devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 29, 2025·0 cites·20 claims
- 0678US10141401B2Method for forming semiconductor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 27, 2018·2 cites·20 claims
- 0775US10164073B2Apparatus and method for memory deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 25, 2018·2 cites·20 claims
- 0875US9263316B2Method for forming a semiconductor device with void-free shallow trench isolationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Feb 16, 2016·3 cites·18 claims
- 0974US12041771B2Polysilicon removal in word line contact region of memory devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 16, 2024·0 cites·20 claims
- 1071US9263556B2Silicide process using OD spacersHSIEH PING-PANG·Filed 2012·Granted Feb 16, 2016·3 cites·20 claims
- 1171US2025089350A1Semiconductor device structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1263US11581441B2Floating gate isolationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 14, 2023·0 cites·20 claims
- 1362US11257719B2Methods for improving interlayer dielectric layer topographyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 22, 2022·0 cites·20 claims
- 1456US7126189B2Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2004·Granted Oct 24, 2006·5 cites·9 claims
- 1554US10103235B2Gate structure with multiple spacersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 16, 2018·0 cites·20 claims
- 1653US9349785B2Formation of semiconductor device with resistorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted May 24, 2016·0 cites·20 claims
- 1751US7320907B2Method for controlling lattice defects at junction and method for forming LDD or S/D regions of CMOS deviceUNITED MICROELECTRONICS CORP·Filed 2004·Granted Jan 22, 2008·3 cites·19 claims
- 1850US10818804B2Floating gate isolation and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 27, 2020·0 cites·20 claims
- 1950US9711657B2Silicide process using OD spacersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 18, 2017·0 cites·20 claims
- 2050US9666668B2Semiconductor device structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 30, 2017·0 cites·20 claims
- 2149US10629593B2Formation of semiconductor device with resistors having different resistancesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 21, 2020·0 cites·12 claims
- 2249US9653302B2Gate structure with multiple spacer and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 16, 2017·0 cites·20 claims
- 2348US8980711B2Memory device structure and methodHSIEH PING-PANG·Filed 2012·Granted Mar 17, 2015·0 cites·20 claims
- 2447US9406519B2Memory device structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 2, 2016·0 cites·20 claims
- 2545US7638400B2Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2006·Granted Dec 29, 2009·0 cites·23 claims
- 2643US2014015031A1Apparatus and Method for Memory DeviceHSIEH PING-PANG·Filed 2012·Application pending·0 cites
- 2741US7157343B2Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2005·Granted Jan 2, 2007·0 cites·8 claims
Join the waitlist — get patent alerts
Get an alert when Ping-Pang Hsieh files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →