Inventor · disambiguated record
Poh Leng Eu
Also filed as: EU POH LENG
13 granted patents·13 pending applications·51 citations·filing 2007–2018
89Inventor score
Top patents by PatentIndex Score
26 records- 0192US8501517B1Method of assembling pressure sensor deviceYOW KAI YUN·Filed 2012·Granted Aug 6, 2013·21 cites·17 claims
- 0279US9165855B1Semiconductor device with die attached heat spreaderYOW KAI YUN·Filed 2014·Granted Oct 20, 2015·5 cites·7 claims
- 0379US9030000B2Mold cap for semiconductor deviceEU POH LENG·Filed 2013·Granted May 12, 2015·6 cites·8 claims
- 0479US7956471B2Mold and substrate for use with moldFREESCALE SEMICONDUCTOR INC·Filed 2008·Granted Jun 7, 2011·4 cites·5 claims
- 0577US8198143B2Mold and substrate for use with moldEU POH LENG·Filed 2011·Granted Jun 12, 2012·3 cites·5 claims
- 0675US11056457B2Semiconductor device with bond wire reinforcement structureNXP USA INC·Filed 2018·Granted Jul 6, 2021·2 cites·15 claims
- 0770US8643169B2Semiconductor sensor device with over-molded lidYOW KAI YUN·Filed 2011·Granted Feb 4, 2014·3 cites·6 claims
- 0864US8078353B2Self monitoring braking system for vehiclesYOW KAI YUN·Filed 2009·Granted Dec 13, 2011·3 cites·20 claims
- 0961US7868449B2Semiconductor substrate and method of connecting semiconductor die to substrateFREESCALE SEMICONDUCTOR INC·Filed 2009·Granted Jan 11, 2011·2 cites·14 claims
- 1059US9196576B2Semiconductor package with stress relief and heat spreaderYOW KAI YUN·Filed 2014·Granted Nov 24, 2015·1 cites·7 claims
- 1157US7759753B2Integrated circuit die, integrated circuit package, and packaging methodFREESCALE SEMICONDUCTOR INC·Filed 2008·Granted Jul 20, 2010·1 cites·8 claims
- 1247US2011084411A1Semiconductor dieFREESCALE SEMICONDUCTOR INC·Filed 2009·Application pending·0 cites
- 1347US2011059579A1Method of forming tape ball grid array packageFREESCALE SEMICONDUCTOR INC·Filed 2009·Application pending·0 cites
- 1446US7985672B2Solder ball attachment ring and method of useFREESCALE SEMICONDUCTOR INC·Filed 2007·Granted Jul 26, 2011·0 cites·7 claims
- 1546US2011084375A1Semiconductor device package with integrated stand-offFREESCALE SEMICONDUCTOR INC·Filed 2009·Application pending·0 cites
- 1646US2011062569A1Semiconductor device package with down-set leadsFREESCALE SEMICONDUCTOR INC·Filed 2009·Application pending·0 cites
- 1745US2011012257A1Heat spreader for semiconductor packageFREESCALE SEMICONDUCTOR INC·Filed 2009·Application pending·0 cites
- 1844US2011068469A1Semiconductor package with pre-formed ball bondsFREESCALE SEMICONDUCTOR INC·Filed 2010·Application pending·0 cites
- 1942US2015054099A1Pressure sensor device and assembly methodYOW KAI YUN·Filed 2013·Application pending·0 cites
- 2041US2015235981A1Wire bonding method with two step free air ball formationEU POH LENG·Filed 2014·Application pending·0 cites
- 2141US2015014793A1Pressure sensor having down-set flagYOW KAI YUN·Filed 2013·Application pending·0 cites
- 2238US9646853B1IC device having patterned, non-conductive substrateFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted May 9, 2017·0 cites·10 claims
- 2336US2012074549A1Semiconductor device with exposed padYOW KAI YUN·Filed 2010·Application pending·0 cites
- 2433US2014110461A1System and method for cleaning bond wireIBRAHIM MOHD RUSLI·Filed 2012·Application pending·0 cites
- 2530US2014263584A1Wire bonding apparatus and methodYAP JIA LIN·Filed 2013·Application pending·0 cites
- 2628US2014374151A1Wire bonding method for flexible substratesYAP JIA LIN·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →