Inventor · disambiguated record
Po-Han Lee
Also filed as: LEE PO-HAN
27 granted patents·18 pending applications·41 citations·filing 2007–2025
93Inventor score
Files withXINTEC INC36LIN CHIA-SHENG2TSAI CHIA-LUN2CORETRONIC CORP1DYNAPACK INTERNATIONAL TECH CORPORATION1
Top patents by PatentIndex Score
45 records- 0188US8872196B2Chip packageXINTEC INC·Filed 2012·Granted Oct 28, 2014·5 cites·20 claims
- 0287US8952519B2Chip package and fabrication method thereofLIN CHIA-SHENG·Filed 2010·Granted Feb 10, 2015·8 cites·18 claims
- 0384US10446504B2Chip package and method for forming the sameXINTEC INC·Filed 2018·Granted Oct 15, 2019·5 cites·20 claims
- 0478US9196571B2Chip device packages and fabrication methods thereofXINTEC INC·Filed 2015·Granted Nov 24, 2015·3 cites·29 claims
- 0575US10879530B2Anode material of nano-silicon having multilayer-graphene as carrier and coated with silicon suboxide and with amorphous carbon layer and method for fabricating the sameNAT CHUNG SHAN INST SCIENCE & TECH·Filed 2018·Granted Dec 29, 2020·1 cites·4 claims
- 0675US10424540B2Chip package and method for forming the sameXINTEC INC·Filed 2017·Granted Sep 24, 2019·2 cites·13 claims
- 0775US9947716B2Chip package and manufacturing method thereofXINTEC INC·Filed 2016·Granted Apr 17, 2018·2 cites·10 claims
- 0875US8823179B2Electronic device package and method for fabricating the sameTSAI CHIA-LUN·Filed 2008·Granted Sep 2, 2014·5 cites·24 claims
- 0971US8432032B2Chip package and fabrication method thereofLIN CHIA-SHENG·Filed 2010·Granted Apr 30, 2013·3 cites·24 claims
- 1068US11340679B1Uninterruptible power system testing methodDYNAPACK INTERNATIONAL TECH CORPORATION·Filed 2021·Granted May 24, 2022·1 cites·7 claims
- 1167US10153237B2Chip package and method for forming the sameXINTEC INC·Filed 2017·Granted Dec 11, 2018·1 cites·22 claims
- 1267US8319347B2Electronic device package and fabrication method thereofTSAI CHIA-LUN·Filed 2009·Granted Nov 27, 2012·3 cites·28 claims
- 1363US9640683B2Electrical contact structure with a redistribution layer connected to a studXINTEC INC·Filed 2015·Granted May 2, 2017·1 cites·10 claims
- 1462US11476293B2Manufacturing method of chip packageXINTEC INC·Filed 2020·Granted Oct 18, 2022·0 cites·9 claims
- 1562US10096635B2Semiconductor structure and manufacturing method thereofXINTEC INC·Filed 2015·Granted Oct 9, 2018·1 cites·16 claims
- 1660US2024304582A1Circuit substrate in chip package and method for forming the sameXINTEC INC·Filed 2024·Application pending·0 cites
- 1759US2025174574A1Chip package with electrical shielding structure and mesh pad structureXINTEC INC·Filed 2024·Application pending·0 cites
- 1857US11355659B2Chip package and manufacturing method thereofXINTEC INC·Filed 2020·Granted Jun 7, 2022·0 cites·15 claims
- 1957US2023361144A1Chip package and manufacturing method thereofXINTEC INC·Filed 2023·Application pending·0 cites
- 2056US2023369362A1Chip package and manufacturing method thereofXINTEC INC·Filed 2023·Application pending·0 cites
- 2154US12500141B2Semiconductor device structure and semiconductor package assemblyXINTEC INC·Filed 2021·Granted Dec 16, 2025·0 cites·20 claims
- 2252US11387201B2Chip package and manufacturing method thereofXINTEC INC·Filed 2020·Granted Jul 12, 2022·0 cites·34 claims
- 2351US11310904B2Chip package and power moduleXINTEC INC·Filed 2019·Granted Apr 19, 2022·0 cites·14 claims
- 2451US2018358398A1Chip package and manufacturing method thereofXINTEC INC·Filed 2018·Application pending·0 cites
- 2551US2025316548A1Chip package and manufacturing method thereofXINTEC INC·Filed 2025·Application pending·0 cites
- 2650US9780251B2Semiconductor structure and manufacturing method thereofXINTEC INC·Filed 2017·Granted Oct 3, 2017·0 cites·9 claims
- 2749US11038077B2Chip package and manufacturing method thereofXINTEC INC·Filed 2019·Granted Jun 15, 2021·0 cites·20 claims
- 2849US9305842B2Fabrication methods of chip device packagesXINTEC INC·Filed 2015·Granted Apr 5, 2016·0 cites·19 claims
- 2949US9269837B2Chip package and method of manufacturing the sameXINTEC INC·Filed 2015·Granted Feb 23, 2016·0 cites·8 claims
- 3048US9406818B2Chip package and method of manufacturing the sameXINTEC INC·Filed 2015·Granted Aug 2, 2016·0 cites·9 claims
- 3146US9214579B2Electrical contact structure with a redistribution layer connected to a studXINTEC INC·Filed 2014·Granted Dec 15, 2015·0 cites·14 claims
- 3246US2021328264A1Composite electrolyte, method for manufacturing the same and batteryUNIV NAT CHENG KUNG·Filed 2020·Application pending·0 cites
- 3344US2008303110A1Integrated circuit package and method for operating and fabricating thereofXINTEC INC·Filed 2007·Application pending·0 cites
- 3442US9613919B2Chip package and method for forming the sameXINTEC INC·Filed 2015·Granted Apr 4, 2017·0 cites·20 claims
- 3542US2010201568A1Method for implementing gps surveying field work planning using 3d topographic informaiton and method for analyzing 3d topographic informationUNIV NAT TAIWAN·Filed 2009·Application pending·0 cites
- 3640US9875912B2Chip package and manufacturing method thereofXINTEC INC·Filed 2016·Granted Jan 23, 2018·0 cites·16 claims
- 3738US2023221627A1Heat dissipation module and projection apparatusCORETRONIC CORP·Filed 2022·Application pending·0 cites
- 3837US2017148752A1Chip package and manufacturing method thereofXINTEC INC·Filed 2016·Application pending·0 cites
- 3936US2017117242A1Chip package and method for forming the sameXINTEC INC·Filed 2016·Application pending·0 cites
- 4035US2017092607A1Chip package and method for forming the sameXINTEC INC·Filed 2016·Application pending·0 cites
- 4135US2016284751A1Chip scale sensing chip package and a manufacturing method thereofXINTEC INC·Filed 2016·Application pending·0 cites
- 4235US2016355393A1Chip package and manufacturing method thereofXINTEC INC·Filed 2016·Application pending·0 cites
- 4334US2015206916A1Semiconductor device and manufacturing method thereofXINTEC INC·Filed 2015·Application pending·0 cites
- 4434US2015255499A1Chip package and method of fabricating the sameXINTEC INC·Filed 2015·Application pending·0 cites
- 4533US2017110495A1Chip package and manufacturing method thereofXINTEC INC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →