Inventor · disambiguated record

Po-Yao Lin

Also filed as: LIN PO-YAO

210 granted patents·99 pending applications·568 citations·filing 1999–2025

99Inventor score

Technology areasH10W H10P H01L H05K H10D

Files withTAIWAN SEMICONDUCTOR MFG CO LTD290 LIN WEN-YI5 TAIWAN SEMICONDUCTOR MFG5 YEW MING-CHIH3 ASUSTEK COMP INC2

Top patents by PatentIndex Score

309 records

0198US11749644B2Semiconductor device with curved conductive lines and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 5, 2023·5 cites·20 claims
0298US11557559B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 17, 2023·5 cites·20 claims
0398US11264359B2Chip bonded to a redistribution structure with curved conductive linesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 1, 2022·10 cites·20 claims
0498US8941248B2Semiconductor device package and methodTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jan 27, 2015·70 cites·20 claims
0597US11967582B2Multi-chip device and method of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 23, 2024·2 cites·20 claims
0697US11784130B2Structure and formation method of package with underfillTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 10, 2023·3 cites·20 claims
0797US11637087B2Multi-chip device and method of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 25, 2023·3 cites·20 claims
0897US11393746B2Reinforcing package using reinforcing patchesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 19, 2022·4 cites·20 claims
0996US12040267B2Organic interposer including intra-die structural reinforcement structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 16, 2024·2 cites·20 claims
1096US9653391B1Semiconductor packaging structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 16, 2017·23 cites·20 claims
1195US12300568B2High efficiency heat dissipation using discrete thermal interface material filmsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 13, 2025·2 cites·20 claims
1295US11915992B2Method for forming package structure with lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 27, 2024·2 cites·20 claims
1395US11854929B2Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·2 cites·20 claims
1495US11823991B2Frames stacked on substrate encircling devices and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 21, 2023·2 cites·20 claims
1595US11798897B2Package structure and methods of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 24, 2023·2 cites·20 claims
1695US11600575B2Method for forming chip package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 7, 2023·2 cites·20 claims
1795US11282756B2Organic interposer including stress-resistant bonding structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 22, 2022·3 cites·20 claims
1895US8624392B2Electrical connection for chip scale packagingYEW MING-CHIH·Filed 2011·Granted Jan 7, 2014·34 cites·20 claims
1995US6188578B1Integrated circuit package with multiple heat dissipation pathsIND TECH RES INST·Filed 1999·Granted Feb 13, 2001·118 cites·8 claims
2094US12261102B2Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 25, 2025·2 cites·16 claims
2194US12255156B2Semiconductor package with riveting structure between two rings and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 18, 2025·1 cites·20 claims
2294US11984378B2Semiconductor package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 14, 2024·2 cites·20 claims
2394US11915991B2Semiconductor device having first heat spreader and second heat spreader and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 27, 2024·2 cites·20 claims
2494US11908757B2Die corner removal for molding compound crack suppression in semiconductor die packaging and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 20, 2024·2 cites·20 claims
2594US11699668B2Semiconductor device package having warpage control and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 11, 2023·2 cites·20 claims
2694US11594477B2Semiconductor package and method of manufacturing semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 28, 2023·2 cites·20 claims
2794US9870975B1Chip package with thermal dissipation structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 16, 2018·12 cites·20 claims
2893US12322703B2Eccentric via structures for stress reductionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jun 3, 2025·1 cites·20 claims
2993US12218080B2Package structure with reinforced elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 4, 2025·1 cites·20 claims
3093US11854956B2Semiconductor die package with conductive line crack prevention designTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·2 cites·20 claims
3193US11830800B2Metallization structure and package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 28, 2023·2 cites·20 claims
3293US11784061B2Chip package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 10, 2023·2 cites·20 claims
3393US11574861B2Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 7, 2023·2 cites·20 claims
3493US11450622B2Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 20, 2022·2 cites·20 claims
3593US11164754B2Fan-out packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 2, 2021·9 cites·20 claims
3693US9881908B2Integrated fan-out package on package structure and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 30, 2018·11 cites·18 claims
3793US2025357432A1Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
3892US11456257B2Semiconductor package with dual sides of metal routingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 27, 2022·6 cites·20 claims
3992US10867924B2Semiconductor package with redistribution structure and pre-made substrate on opposing sides for dual-side metal routingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 15, 2020·6 cites·20 claims
4091US11610835B2Organic interposer including intra-die structural reinforcement structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 21, 2023·2 cites·20 claims
4191US10685920B2Semiconductor device package with warpage control structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 16, 2020·5 cites·20 claims
4291US10269602B1Wafer warpage inspection system and method using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 23, 2019·6 cites·20 claims
4391US9721868B2Three dimensional integrated circuit (3DIC) having a thermally enhanced heat spreader embedded in a substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 1, 2017·9 cites·20 claims
4491US9583474B2Package on packaging structure and methods of making sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 28, 2017·7 cites·20 claims
4591US8970029B2Thermally enhanced heat spreader for flip chip packagingLIN PO-YAO·Filed 2010·Granted Mar 3, 2015·17 cites·20 claims
4691US8901732B2Semiconductor device package and methodTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Dec 2, 2014·12 cites·20 claims
4791US2025364488A1Multi-chip device and method of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
4890US11328971B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 10, 2022·2 cites·20 claims
4990US11011447B2Semiconductor package and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 18, 2021·4 cites·20 claims
5089US9831190B2Semiconductor device package with warpage control structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 28, 2017·7 cites·20 claims

Showing the top 50 of 309 patent records by PatentIndex Score.

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →