Inventor · disambiguated record
Po-Chao Tsao
Also filed as: TSAO PO-CHAO
74 granted patents·22 pending applications·365 citations·filing 2001–2025
99Inventor score
Top patents by PatentIndex Score
96 records- 0198US11532617B2Semiconductor structure and method of forming the sameMEDIATEK INC·Filed 2020·Granted Dec 20, 2022·5 cites·19 claims
- 0296US10049929B2Method of making semiconductor structure having contact plugUNITED MICROELECTRONICS CORP·Filed 2016·Granted Aug 14, 2018·11 cites·12 claims
- 0396US9455176B2Manufacturing method for forming semiconductor structure with sub-fin structuresUNITED MICROELECTRONICS CORP·Filed 2016·Granted Sep 27, 2016·14 cites·11 claims
- 0496US9263287B2Method of forming fin-shaped structureUNITED MICROELECTRONICS CORP·Filed 2013·Granted Feb 16, 2016·24 cites·14 claims
- 0596US9006804B2Semiconductor device and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2013·Granted Apr 14, 2015·22 cites·9 claims
- 0696US8836129B1Plug structureUNITED MICROELECTRONICS CORP·Filed 2013·Granted Sep 16, 2014·29 cites·7 claims
- 0794US8823132B2Two-portion shallow-trench isolationUNITED MICROELECTRONICS CORP·Filed 2013·Granted Sep 2, 2014·16 cites·6 claims
- 0893US11094594B2Semiconductor structure with buried power rail, integrated circuit and method for manufacturing the semiconductor structureMEDIATEK INC·Filed 2018·Granted Aug 17, 2021·7 cites·17 claims
- 0992US9306032B2Method of forming self-aligned metal gate structure in a replacement gate process using tapered interlayer dielectricUNITED MICROELECTRONICS CORP·Filed 2013·Granted Apr 5, 2016·14 cites·13 claims
- 1091US9129985B2Semiconductor device having metal gate and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2013·Granted Sep 8, 2015·8 cites·5 claims
- 1191US9123810B2Semiconductor integrated device including FinFET device and protecting structureUNITED MICROELECTRONICS CORP·Filed 2013·Granted Sep 1, 2015·11 cites·19 claims
- 1290US9330980B2Semiconductor processUNITED MICROELECTRONICS CORP·Filed 2015·Granted May 3, 2016·6 cites·13 claims
- 1389US9064931B2Semiconductor structure having contact plug and metal gate transistor and method of making the sameUNITED MICROELECTRONICS CORP·Filed 2012·Granted Jun 23, 2015·10 cites·20 claims
- 1489US9013003B2Semiconductor structure and process thereofUNITED MICROELECTRONICS CORP·Filed 2012·Granted Apr 21, 2015·8 cites·12 claims
- 1588US9337260B2Shallow trench isolation in bulk substrateUNITED MICROELECTRONICS CORP·Filed 2014·Granted May 10, 2016·6 cites·10 claims
- 1687US9054172B2Semiconductor structure having contact plug and method of making the sameUNITED MICROELECTRNICS CORP·Filed 2012·Granted Jun 9, 2015·9 cites·10 claims
- 1787US8951918B2Method for fabricating patterned structure of semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2013·Granted Feb 10, 2015·9 cites·20 claims
- 1886US9196542B2Method for manufacturing semiconductor devicesUNITED MICROELECTRONICS CORP·Filed 2013·Granted Nov 24, 2015·8 cites·15 claims
- 1986US9147612B2Method for forming a semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2013·Granted Sep 29, 2015·7 cites·9 claims
- 2086US8981487B2Fin-shaped field-effect transistor (FinFET)UNITED MICROELECTRONICS CORP·Filed 2013·Granted Mar 17, 2015·7 cites·8 claims
- 2186US8129235B2Method of fabricating two-step self-aligned contactCHOU LING-CHUN·Filed 2007·Granted Mar 6, 2012·16 cites·15 claims
- 2285US9006072B2Method of forming metal silicide layerUNITED MICROELECTRONICS CORP·Filed 2013·Granted Apr 14, 2015·7 cites·20 claims
- 2385US8860181B2Thin film resistor structureWEI MING-TE·Filed 2012·Granted Oct 14, 2014·8 cites·15 claims
- 2484US9035425B2Semiconductor integrated circuitUNITED MICROELECTRONICS CORP·Filed 2013·Granted May 19, 2015·5 cites·7 claims
- 2583US9240403B2Embedded resistorUNITED MICROELECTRONICS CORP·Filed 2013·Granted Jan 19, 2016·6 cites·17 claims
- 2681US9349695B2Semiconductor integrated device including FinFET device and protecting structureUNITED MICROELECTRONICS CORP·Filed 2015·Granted May 24, 2016·3 cites·4 claims
- 2781US7384853B2Method of performing salicide processes on MOS transistorsUNITED MICROELECTRONICS CORP·Filed 2005·Granted Jun 10, 2008·8 cites·7 claims
- 2881US7214988B2Metal oxide semiconductor transistorUNITED MICROELECTRONICS CORP·Filed 2005·Granted May 8, 2007·8 cites·9 claims
- 2981US2025098283A1Semiconductor structureMEDIATEK INC·Filed 2024·Application pending·0 cites
- 3080US9847331B2Semiconductor integrated circuitUNITED MICROELECTRONICS CORP·Filed 2016·Granted Dec 19, 2017·2 cites·4 claims
- 3179US9000483B2Semiconductor device with fin structure and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2013·Granted Apr 7, 2015·4 cites·18 claims
- 3279US8912074B2Method of forming shallow trench isolationsUNITED MICROELECTRONICS CORP·Filed 2014·Granted Dec 16, 2014·3 cites·7 claims
- 3379US7817265B2Alignment mark and defect inspection methodUNITED MICROELECTRONICS CORP·Filed 2008·Granted Oct 19, 2010·6 cites·10 claims
- 3478US9449964B2Semiconductor processUNITED MICROELECTRONICS CORP·Filed 2015·Granted Sep 20, 2016·2 cites·9 claims
- 3578US7825034B2Method of fabricating openings and contact holesUNITED MICROELECTRONICS CORP·Filed 2005·Granted Nov 2, 2010·8 cites·18 claims
- 3675US8236702B2Method of fabricating openings and contact holesCHANG FENG-YI·Filed 2008·Granted Aug 7, 2012·6 cites·10 claims
- 3774US9136348B2Semiconductor structure and fabrication method thereofWEI MING-TE·Filed 2012·Granted Sep 15, 2015·3 cites·13 claims
- 3873US9299843B2Semiconductor structure and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2013·Granted Mar 29, 2016·3 cites·9 claims
- 3973US9208276B1Method for generating layout patternUNITED MICROELECTRONICS CORP·Filed 2015·Granted Dec 8, 2015·1 cites·9 claims
- 4073US9117925B2Epitaxial processUNITED MICROELECTRONICS CORP·Filed 2013·Granted Aug 25, 2015·3 cites·9 claims
- 4173US8921226B2Method of forming semiconductor structure having contact plugUNITED MICROELECTRONICS CORP·Filed 2013·Granted Dec 30, 2014·3 cites·17 claims
- 4272US12480987B2Dynamic voltage stress condition optimization method and dynamic voltage stress condition optimization system capable of performing block-based dynamic voltage stress wafer testing processMEDIATEK INC·Filed 2024·Granted Nov 25, 2025·0 cites·20 claims
- 4372US9318571B2Gate structure and method for trimming spacersWANG I-CHANG·Filed 2009·Granted Apr 19, 2016·6 cites·8 claims
- 4472US7759742B2Metal oxide semiconductor transistorUNITED MICROELECTRONICS CORP·Filed 2007·Granted Jul 20, 2010·4 cites·7 claims
- 4571US12165927B2Semiconductor structure with buried power rail, integrated circuit and method for manufacturing the semiconductor structureMEDIATEK INC·Filed 2021·Granted Dec 10, 2024·0 cites·6 claims
- 4671US8569127B2Semiconductor device and method for fabricating the sameCHEN CHIEN-YANG·Filed 2012·Granted Oct 29, 2013·3 cites·12 claims
- 4770US11978734B2Semiconductor structure and method of forming the sameMEDIATEK INC·Filed 2022·Granted May 7, 2024·0 cites·14 claims
- 4870US9196500B2Method for manufacturing semiconductor structuresUNITED MICROELECTRONICS CORP·Filed 2013·Granted Nov 24, 2015·2 cites·19 claims
- 4969US9093473B2Method for fabricating metal-oxide semiconductor transistorUNITED MICROELECTRONICS CORP·Filed 2014·Granted Jul 28, 2015·2 cites·10 claims
- 5068US9548302B2Semiconductor integrated circuitUNITED MICROELECTRONICS CORP·Filed 2015·Granted Jan 17, 2017·1 cites·3 claims
Showing the top 50 of 96 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Po-Chao Tsao files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →