Inventor · disambiguated record
Prithwish Chatterjee
Also filed as: CHATTERJEE PRITHWISH
20 granted patents·10 pending applications·18 citations·filing 2017–2023
90Inventor score
Top patents by PatentIndex Score
30 records- 0191US11443885B2Thin film barrier seed metallization in magnetic-plugged through hole inductorINTEL CORP·Filed 2018·Granted Sep 13, 2022·4 cites·12 claims
- 0284US10700021B2Coreless organic packages with embedded die and magnetic inductor structuresINTEL CORP·Filed 2018·Granted Jun 30, 2020·3 cites·11 claims
- 0383US11552008B2Asymmetric cored integrated circuit package supportsINTEL CORP·Filed 2018·Granted Jan 10, 2023·3 cites·24 claims
- 0480US12494443B2Substrate integrated thin film capacitors using amorphous high-k dielectricsINTEL CORP·Filed 2023·Granted Dec 9, 2025·0 cites·26 claims
- 0577US11804455B1Substrate integrated thin film capacitors using amorphous high-k dielectricsINTEL CORP·Filed 2022·Granted Oct 31, 2023·0 cites·25 claims
- 0677US11270959B2Enabling magnetic films in inductors integrated into semiconductor packagesINTEL CORP·Filed 2018·Granted Mar 8, 2022·3 cites·26 claims
- 0777US11251113B2Methods of embedding magnetic structures in substratesINTEL CORP·Filed 2017·Granted Feb 15, 2022·2 cites·16 claims
- 0877US11189409B2Electronic substrates having embedded dielectric magnetic material to form inductorsINTEL CORP·Filed 2017·Granted Nov 30, 2021·2 cites·16 claims
- 0972US11881463B2Coreless organic packages with embedded die and magnetic inductor structuresINTEL CORP·Filed 2021·Granted Jan 23, 2024·0 cites·13 claims
- 1070US11862552B2Methods of embedding magnetic structures in substratesINTEL CORP·Filed 2022·Granted Jan 2, 2024·0 cites·7 claims
- 1170US11335632B2Magnetic inductor structures for package devicesINTEL CORP·Filed 2017·Granted May 17, 2022·1 cites·15 claims
- 1267US11205626B2Coreless organic packages with embedded die and magnetic inductor structuresINTEL CORP·Filed 2020·Granted Dec 21, 2021·0 cites·30 claims
- 1364US12272484B2Coreless electronic substrates having embedded inductorsINTEL CORP·Filed 2021·Granted Apr 8, 2025·0 cites·21 claims
- 1464US2022230951A1Magnetic inductor structures for package devicesINTEL CORP·Filed 2022·Application pending·0 cites
- 1561US2022013265A1Electronic substrates having embedded dielectric magnetic material to form inductorsINTEL CORP·Filed 2021·Application pending·0 cites
- 1659US11495552B2Substrate integrated thin film capacitors using amorphous high-k dielectricsINTEL CORP·Filed 2018·Granted Nov 8, 2022·0 cites·25 claims
- 1753US2025218911A1Electrolytic cobalt-iron-palladium-gold as a surface finish for embedded die attachmentsINTEL CORP·Filed 2023·Application pending·0 cites
- 1853US2025219002A1Electrolytic indium-palladium-gold as a surface finish for embedded die attachmentsINTEL CORP·Filed 2023·Application pending·0 cites
- 1952US2025218910A1Immersion gold-electroless palladium-immersion gold (igepig) as a surface finish for embedded die attachmentsINTEL CORP·Filed 2023·Application pending·0 cites
- 2052US2025218925A1Electroless nickel-electroless palladium-immersion gold (enepig) with thin nickel layer as a surface finish for embedded die attachmentsINTEL CORP·Filed 2023·Application pending·0 cites
- 2152US2025218924A1Electroless nickel-electroless palladium-immersion gold (enepig) as a surface finish for embedded die attachmentsINTEL CORP·Filed 2023·Application pending·0 cites
- 2247US11432405B2Methods for attaching large components in a package substrate for advanced power deliveryINTEL CORP·Filed 2018·Granted Aug 30, 2022·0 cites·17 claims
- 2347US11289263B2Electronic substrates having embedded magnetic material using photo-imagable dielectric layersINTEL CORP·Filed 2017·Granted Mar 29, 2022·0 cites·20 claims
- 2446US12336197B2In-plane inductors in IC packagesINTEL CORP·Filed 2020·Granted Jun 17, 2025·0 cites·19 claims
- 2546US11610706B2Release layer-assisted selective embedding of magnetic material in cored and coreless organic substratesINTEL CORP·Filed 2018·Granted Mar 21, 2023·0 cites·12 claims
- 2646US11574874B2Package architecture utilizing photoimageable dielectric (PID) for reduced bump pitchINTEL CORP·Filed 2017·Granted Feb 7, 2023·0 cites·20 claims
- 2745US11651902B2Patterning of thin film capacitors in organic substrate packagesINTEL CORP·Filed 2018·Granted May 16, 2023·0 cites·17 claims
- 2841US2020176355A1Substrate embedded heat pipeINTEL CORP·Filed 2018·Application pending·0 cites
- 2941US2020411413A1Substrate for an electronic deviceALUR AMRUTHAVALLI PALLAVI·Filed 2019·Application pending·0 cites
- 3038US2020006211A1Substrate assembly region with ceramic or boron fiberINTEL CORP·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →