Inventor · disambiguated record
Pradeep Vukkadala
Also filed as: VUKKADALA PRADEEP
23 granted patents·91 citations·filing 2012–2023
94Inventor score
Top patents by PatentIndex Score
23 records- 0194US10788759B2Prediction based chucking and lithography control optimizationKLA TENCOR CORP·Filed 2018·Granted Sep 29, 2020·5 cites·27 claims
- 0291US11164768B2Process-induced displacement characterization during semiconductor productionKLA TENCOR CORP·Filed 2018·Granted Nov 2, 2021·6 cites·34 claims
- 0391US10401279B2Process-induced distortion prediction and feedforward and feedback correction of overlay errorsKLA TENCOR CORP·Filed 2014·Granted Sep 3, 2019·10 cites·25 claims
- 0491US10025894B2System and method to emulate finite element model based prediction of in-plane distortions due to semiconductor wafer chuckingKLA TENCOR CORP·Filed 2016·Granted Jul 17, 2018·7 cites·19 claims
- 0590US9779202B2Process-induced asymmetry detection, quantification, and control using patterned wafer geometry measurementsKLA TENCOR CORP·Filed 2015·Granted Oct 3, 2017·9 cites·17 claims
- 0690US9430593B2System and method to emulate finite element model based prediction of in-plane distortions due to semiconductor wafer chuckingKLA TENCOR CORP·Filed 2013·Granted Aug 30, 2016·10 cites·36 claims
- 0789US11966156B2Lithography mask repair by simulation of photoresist thickness evolutionKLA CORP·Filed 2023·Granted Apr 23, 2024·3 cites·31 claims
- 0889US9354526B2Overlay and semiconductor process control using a wafer geometry metricVUKKADALA PRADEEP·Filed 2012·Granted May 31, 2016·15 cites·37 claims
- 0987US11682570B2Process-induced displacement characterization during semiconductor productionKLA CORP·Filed 2021·Granted Jun 20, 2023·1 cites·27 claims
- 1085US9546862B2Systems, methods and metrics for wafer high order shape characterization and wafer classification using wafer dimensional geometry toolKLA TENCOR CORP·Filed 2012·Granted Jan 17, 2017·6 cites·14 claims
- 1183US10249523B2Overlay and semiconductor process control using a wafer geometry metricKLA TENCOR CORP·Filed 2016·Granted Apr 2, 2019·3 cites·10 claims
- 1283US9707660B2Predictive wafer modeling based focus error prediction using correlations of wafersKLA TENCOR CORP·Filed 2014·Granted Jul 18, 2017·4 cites·28 claims
- 1379US9177370B2Systems and methods of advanced site-based nanotopography for wafer surface metrologyKLA TENCOR CORP·Filed 2013·Granted Nov 3, 2015·5 cites·52 claims
- 1478US10379061B1Systems, methods and metrics for wafer high order shape characterization and wafer classification using wafer dimensional geometry toolKLA TENCOR CORP·Filed 2017·Granted Aug 13, 2019·2 cites·14 claims
- 1574US9029810B2Using wafer geometry to improve scanner correction effectiveness for overlay controlKLA TENCOR CORP·Filed 2014·Granted May 12, 2015·2 cites·20 claims
- 1667US9513565B2Using wafer geometry to improve scanner correction effectiveness for overlay controlKLA TENCOR CORP·Filed 2015·Granted Dec 6, 2016·1 cites·19 claims
- 1761US11761880B2Process-induced distortion prediction and feedforward and feedback correction of overlay errorsKLA TENCOR CORP·Filed 2019·Granted Sep 19, 2023·0 cites·20 claims
- 1861US9558545B2Predicting and controlling critical dimension issues and pattern defectivity in wafers using interferometryKLA TENCOR CORP·Filed 2015·Granted Jan 31, 2017·1 cites·22 claims
- 1961US9373165B2Enhanced patterned wafer geometry measurements based design improvements for optimal integrated chip fabrication performanceKLA TENCOR CORP·Filed 2014·Granted Jun 21, 2016·1 cites·26 claims
- 2054US12406197B2Prediction and metrology of stochastic photoresist thickness defectsKLA CORP·Filed 2021·Granted Sep 2, 2025·0 cites·19 claims
- 2152US10036964B2Prediction based chucking and lithography control optimizationKLA TENCOR CORP·Filed 2015·Granted Jul 31, 2018·0 cites·32 claims
- 2250US10576603B2Patterned wafer geometry measurements for semiconductor process controlsKLA TENCOR CORP·Filed 2014·Granted Mar 3, 2020·0 cites·27 claims
- 2347US9052190B2Bright-field differential interference contrast system with scanning beams of round and elliptical cross-sectionsKLA TENCOR CORP·Filed 2013·Granted Jun 9, 2015·0 cites·26 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →