Inventor · disambiguated record
Pulkit Agarwal
Also filed as: AGARWAL PULKIT
32 granted patents·20 pending applications·143 citations·filing 2014–2025
95Inventor score
Top patents by PatentIndex Score
52 records- 0197US10269559B2Dielectric gapfill of high aspect ratio features utilizing a sacrificial etch cap layerLAM RES CORP·Filed 2017·Granted Apr 23, 2019·28 cites·20 claims
- 0297US9997371B1Atomic layer etch methods and hardware for patterning applicationsLAM RES CORP·Filed 2017·Granted Jun 12, 2018·44 cites·16 claims
- 0396US10655224B2Conical wafer centering and holding device for semiconductor processingLAM RES CORP·Filed 2016·Granted May 19, 2020·8 cites·20 claims
- 0495US10494715B2Atomic layer clean for removal of photoresist patterning scumLAM RES CORP·Filed 2017·Granted Dec 3, 2019·14 cites·20 claims
- 0592US9425076B2Substrate transfer robot end effectorAPPLIED MATERIALS INC·Filed 2014·Granted Aug 23, 2016·14 cites·18 claims
- 0691US10658172B2Dielectric gapfill of high aspect ratio features utilizing a sacrificial etch cap layerLAM RES CORP·Filed 2019·Granted May 19, 2020·7 cites·21 claims
- 0786US12040181B2Modulated atomic layer depositionLAM RES CORP·Filed 2019·Granted Jul 16, 2024·4 cites·20 claims
- 0881US9536329B2Method and apparatus for performing sentiment analysis based on user reactions to displayable contentADOBE SYSTEMS INC·Filed 2014·Granted Jan 3, 2017·6 cites·20 claims
- 0981US2024395513A1Apparatus for cleaning plasma chambersLAM RES CORP·Filed 2024·Application pending·0 cites
- 1080US11236422B2Multi zone substrate support for ALD film property correction and tunabilityLAM RES CORP·Filed 2018·Granted Feb 1, 2022·3 cites·8 claims
- 1179US10847352B2Compensating chamber and process effects to improve critical dimension variation for trim processLAM RES CORP·Filed 2018·Granted Nov 24, 2020·2 cites·11 claims
- 1278US10431451B2Methods and apparatuses for increasing reactor processing batch sizeLAM RES CORP·Filed 2017·Granted Oct 1, 2019·2 cites·20 claims
- 1376US10579371B2Recommendations for custom software upgrade by cognitive technologiesIBM·Filed 2017·Granted Mar 3, 2020·3 cites·14 claims
- 1476US10431489B2Substrate support apparatus having reduced substrate particle generationAPPLIED MATERIALS INC·Filed 2014·Granted Oct 1, 2019·3 cites·20 claims
- 1576US9947578B2Methods for forming low-resistance contacts through integrated process flow systemsAPPLIED MATERIALS INC·Filed 2016·Granted Apr 17, 2018·2 cites·19 claims
- 1675US2025121465A1Substrate processing aparatuses with rotating mechanisms including shafts with gas flow pathsLAM RES CORP·Filed 2024·Application pending·0 cites
- 1774US12451346B2Modulated atomic layer depositionLAM RES CORP·Filed 2024·Granted Oct 21, 2025·0 cites·20 claims
- 1874US2025279299A1Rapid tuning of critical dimension non-uniformity by modulating temperature transients of multi-zone substrate supportsLAM RES CORP·Filed 2025·Application pending·0 cites
- 1974US2024183034A1Method and apparatus for modulating film uniformityLAM RES CORP·Filed 2024·Application pending·0 cites
- 2071US9925639B2Cleaning of chamber components with solid carbon dioxide particlesAPPLIED MATERIALS INC·Filed 2014·Granted Mar 27, 2018·2 cites·19 claims
- 2170US2024392443A1Trim and deposition profile control with multi-zone heated substrate support for multi-patterning processesLAM RES CORP·Filed 2024·Application pending·0 cites
- 2269US11520828B2Methods for representing and storing data in a graph data structure using artificial intelligenceIBM·Filed 2020·Granted Dec 6, 2022·1 cites·20 claims
- 2368US12473633B2Plasma enhanced atomic layer deposition of silicon-containing filmsLAM RES CORP·Filed 2022·Granted Nov 18, 2025·0 cites·25 claims
- 2468US11651963B2Method of improving deposition induced CD imbalance using spatially selective ashing of carbon based filmLAM RES CORP·Filed 2021·Granted May 16, 2023·0 cites·12 claims
- 2568US2025266274A1Dynamic process control in semiconductor manufacturingLAM RES CORP·Filed 2025·Application pending·0 cites
- 2665US12057300B2Apparatus for cleaning plasma chambersLAM RES CORP·Filed 2020·Granted Aug 6, 2024·0 cites·25 claims
- 2764US2025171902A1Temperature control of a multi-zone pedestalLAM RES CORP·Filed 2025·Application pending·0 cites
- 2863US12209312B2Temperature control of a multi-zone pedestalLAM RES CORP·Filed 2020·Granted Jan 28, 2025·0 cites·23 claims
- 2962US2025340984A1Nonconformal oxide film deposition using carbon-containing inhibitorLAM RES CORP·Filed 2023·Application pending·0 cites
- 3061US12322619B2Dynamic process control in semiconductor manufacturingLAM RES CORP·Filed 2020·Granted Jun 3, 2025·0 cites·21 claims
- 3161US11542599B2Method and apparatus for providing station to station uniformityLAM RES CORP·Filed 2020·Granted Jan 3, 2023·0 cites·3 claims
- 3260US12186851B2Use of vacuum during transfer of substratesLAM RES CORP·Filed 2020·Granted Jan 7, 2025·0 cites·23 claims
- 3360US11322416B2Controller for controlling core critical dimension variation using flash trim sequenceLAM RES CORP·Filed 2020·Granted May 3, 2022·0 cites·20 claims
- 3459US10978302B2Method of improving deposition induced CD imbalance using spatially selective ashing of carbon based filmLAM RES CORP·Filed 2018·Granted Apr 13, 2021·0 cites·12 claims
- 3559US2021125082A1Operative enterprise application recommendation generated by cognitive services from unstructured requirementsIBM·Filed 2020·Application pending·0 cites
- 3658US12308264B2Rapid tuning of critical dimension non-uniformity by modulating temperature transients of multi-zone substrate supportsLAM RES CORP·Filed 2020·Granted May 20, 2025·0 cites·7 claims
- 3758US10801109B2Method and apparatus for providing station to station uniformityLAM RES CORP·Filed 2018·Granted Oct 13, 2020·0 cites·10 claims
- 3856US11913113B2Method and apparatus for modulating film uniformityLAM RES CORP·Filed 2018·Granted Feb 27, 2024·0 cites·20 claims
- 3956US2020230782A1Method and Apparatus for cleaning a substrateAPPLIED MATERIALS INC·Filed 2020·Application pending·0 cites
- 4054US12071689B2Trim and deposition profile control with multi-zone heated substrate support for multi-patterning processesLAM RES CORP·Filed 2020·Granted Aug 27, 2024·0 cites·22 claims
- 4154US10727143B2Method for controlling core critical dimension variation using flash trim sequenceLAM RES CORP·Filed 2018·Granted Jul 28, 2020·0 cites·19 claims
- 4253US2025179632A1Surface inhibition atomic layer depositionLAM RES CORP·Filed 2023·Application pending·0 cites
- 4351US2020356866A1Operative enterprise application recommendation generated by cognitive services from unstructured requirementsIBM·Filed 2019·Application pending·0 cites
- 4451US2025087481A1Increasing deposition rates of oxide filmsLAM RES CORP·Filed 2022·Application pending·0 cites
- 4549US2025166989A1Thermal film depositionLAM RES CORP·Filed 2023·Application pending·0 cites
- 4649US2024355624A1In-situ core protection in multi-patterningLAM RES CORP·Filed 2022·Application pending·0 cites
- 4745US11078570B2Azimuthal critical dimension non-uniformity for double patterning processLAM RES CORP·Filed 2018·Granted Aug 3, 2021·0 cites·8 claims
- 4845US2023175117A1Seam mitigation and integrated liner for gap fillLAM RES CORP·Filed 2021·Application pending·0 cites
- 4944US2016322239A1Methods and Apparatus for Cleaning a SubstrateAPPLIED MATERIALS INC·Filed 2015·Application pending·0 cites
- 5044US2022243323A1Use of rotation to correct for azimuthal non-uniformities in semiconductor substrate processingLAM RES CORP·Filed 2020·Application pending·0 cites
Showing the top 50 of 52 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Pulkit Agarwal files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →