Inventor · disambiguated record
Purushottam Kumar
Also filed as: KUMAR PURUSHOTTAM
53 granted patents·15 pending applications·288 citations·filing 2010–2025
98Inventor score
Top patents by PatentIndex Score
68 records- 0198US10074543B2High dry etch rate materials for semiconductor patterning applicationsLAM RES CORP·Filed 2016·Granted Sep 11, 2018·33 cites·26 claims
- 0297US10679848B2Selective atomic layer deposition with post-dose treatmentLAM RES CORP·Filed 2018·Granted Jun 9, 2020·10 cites·13 claims
- 0397US10269559B2Dielectric gapfill of high aspect ratio features utilizing a sacrificial etch cap layerLAM RES CORP·Filed 2017·Granted Apr 23, 2019·28 cites·20 claims
- 0497US10037884B2Selective atomic layer deposition for gapfill using sacrificial underlayerLAM RES CORP·Filed 2016·Granted Jul 31, 2018·30 cites·20 claims
- 0597US9997371B1Atomic layer etch methods and hardware for patterning applicationsLAM RES CORP·Filed 2017·Granted Jun 12, 2018·44 cites·16 claims
- 0696US10655224B2Conical wafer centering and holding device for semiconductor processingLAM RES CORP·Filed 2016·Granted May 19, 2020·8 cites·20 claims
- 0796US10062563B2Selective atomic layer deposition with post-dose treatmentLAM RES CORP·Filed 2016·Granted Aug 28, 2018·16 cites·18 claims
- 0896US7932534B2High light extraction efficiency solid state light sourcesSINMAT INC·Filed 2010·Granted Apr 26, 2011·20 cites·26 claims
- 0995US12354871B2Ultrathin atomic layer deposition film accuracy thickness controlLAM RES CORP·Filed 2023·Granted Jul 8, 2025·1 cites·17 claims
- 1095US10566187B2Ultrathin atomic layer deposition film accuracy thickness controlLAM RES CORP·Filed 2015·Granted Feb 18, 2020·9 cites·19 claims
- 1195US10526701B2Multi-cycle ALD process for film uniformity and thickness profile modulationLAM RES CORP·Filed 2015·Granted Jan 7, 2020·6 cites·9 claims
- 1295US10494715B2Atomic layer clean for removal of photoresist patterning scumLAM RES CORP·Filed 2017·Granted Dec 3, 2019·14 cites·20 claims
- 1394US9870917B2Variable temperature hardware and methods for reduction of wafer backside depositionLAM RES CORP·Filed 2016·Granted Jan 16, 2018·10 cites·11 claims
- 1492US10094018B2Dynamic precursor dosing for atomic layer depositionLAM RES CORP·Filed 2015·Granted Oct 9, 2018·7 cites·17 claims
- 1591US10658172B2Dielectric gapfill of high aspect ratio features utilizing a sacrificial etch cap layerLAM RES CORP·Filed 2019·Granted May 19, 2020·7 cites·21 claims
- 1691US10407773B2Methods and apparatuses for showerhead backside parasitic plasma suppression in a secondary purge enabled ALD systemLAM RES CORP·Filed 2017·Granted Sep 10, 2019·6 cites·17 claims
- 1791US9617638B2Methods and apparatuses for showerhead backside parasitic plasma suppression in a secondary purge enabled ALD systemLAM RES CORP·Filed 2014·Granted Apr 11, 2017·9 cites·24 claims
- 1890US11101129B2Ultrathin atomic layer deposition film accuracy thickness controlLAM RES CORP·Filed 2019·Granted Aug 24, 2021·3 cites·11 claims
- 1989US11970772B2Dynamic precursor dosing for atomic layer depositionLAM RES CORP·Filed 2021·Granted Apr 30, 2024·1 cites·10 claims
- 2089US11646198B2Ultrathin atomic layer deposition film accuracy thickness controlLAM RES CORP·Filed 2021·Granted May 9, 2023·1 cites·8 claims
- 2186US12077859B2Variable cycle and time RF activation method for film thickness matching in a multi-station deposition systemLAM RES CORP·Filed 2022·Granted Sep 3, 2024·1 cites·26 claims
- 2285US11180850B2Dynamic precursor dosing for atomic layer depositionLAM RES CORP·Filed 2018·Granted Nov 23, 2021·3 cites·4 claims
- 2384US11373862B2Surface modified depth controlled deposition for plasma based depositionLAM RES CORP·Filed 2020·Granted Jun 28, 2022·1 cites·20 claims
- 2483US10727046B2Surface modified depth controlled deposition for plasma based depositionLAM RES CORP·Filed 2018·Granted Jul 28, 2020·2 cites·20 claims
- 2582US10832909B2Atomic layer etch, reactive precursors and energetic sources for patterning applicationsLAM RES CORP·Filed 2018·Granted Nov 10, 2020·4 cites·18 claims
- 2681US10100407B2Hardware and process for film uniformity improvementLAM RES CORP·Filed 2014·Granted Oct 16, 2018·1 cites·29 claims
- 2781US9624578B2Method for RF compensation in plasma assisted atomic layer depositionLAM RES CORP·Filed 2014·Granted Apr 18, 2017·2 cites·13 claims
- 2881US2024395513A1Apparatus for cleaning plasma chambersLAM RES CORP·Filed 2024·Application pending·0 cites
- 2979US10847352B2Compensating chamber and process effects to improve critical dimension variation for trim processLAM RES CORP·Filed 2018·Granted Nov 24, 2020·2 cites·11 claims
- 3078US10431451B2Methods and apparatuses for increasing reactor processing batch sizeLAM RES CORP·Filed 2017·Granted Oct 1, 2019·2 cites·20 claims
- 3176US12448687B2Dynamic precursor dosing for atomic layer depositionLAM RES CORP·Filed 2024·Granted Oct 21, 2025·0 cites·12 claims
- 3276US11479856B2Multi-cycle ALD process for film uniformity and thickness profile modulationLAM RES CORP·Filed 2019·Granted Oct 25, 2022·0 cites·22 claims
- 3374US11293098B2Dielectric gapfill using atomic layer deposition (ALD), inhibitor plasma and etchingLAM RES CORP·Filed 2018·Granted Apr 5, 2022·1 cites·9 claims
- 3474US10351953B2Systems and methods for flow monitoring in a precursor vapor supply system of a substrate processing systemLAM RES CORP·Filed 2017·Granted Jul 16, 2019·2 cites·11 claims
- 3574US2024183034A1Method and apparatus for modulating film uniformityLAM RES CORP·Filed 2024·Application pending·0 cites
- 3673US2025046613A1Method for providing doped silicon using a diffusion barrier layerLAM RES CORP·Filed 2024·Application pending·0 cites
- 3772US11670503B2Method of atomic layer depositionLAM RES CORP·Filed 2020·Granted Jun 6, 2023·0 cites·15 claims
- 3872US10526700B2Hardware and process for film uniformity improvementLAM RES CORP·Filed 2018·Granted Jan 7, 2020·0 cites·28 claims
- 3972US2024347337A1Low-k ald gap-fill methods and materialLAM RES CORP·Filed 2024·Application pending·0 cites
- 4071US2022301866A1Gas feed system for surface modified depth controlled deposition for plasma based depositionLAM RES CORP·Filed 2022·Application pending·0 cites
- 4170US10311723B2Parking management system and methodINTEL CORP·Filed 2017·Granted Jun 4, 2019·3 cites·23 claims
- 4268US12049699B2Dielectric gapfill using atomic layer deposition (ALD), inhibitor plasma and etchingLAM RES CORP·Filed 2022·Granted Jul 30, 2024·0 cites·9 claims
- 4368US11651963B2Method of improving deposition induced CD imbalance using spatially selective ashing of carbon based filmLAM RES CORP·Filed 2021·Granted May 16, 2023·0 cites·12 claims
- 4468US10224235B2Systems and methods for creating airgap seals using atomic layer deposition and high density plasma chemical vapor depositionLAM RES CORP·Filed 2017·Granted Mar 5, 2019·1 cites·21 claims
- 4568US2025266274A1Dynamic process control in semiconductor manufacturingLAM RES CORP·Filed 2025·Application pending·0 cites
- 4665US12057300B2Apparatus for cleaning plasma chambersLAM RES CORP·Filed 2020·Granted Aug 6, 2024·0 cites·25 claims
- 4765US11021792B2Symmetric precursor deliveryLAM RES CORP·Filed 2018·Granted Jun 1, 2021·0 cites·20 claims
- 4865US2021238743A1Symmetric precursor deliveryLAM RES CORP·Filed 2021·Application pending·0 cites
- 4964US11255017B2Systems and methods for flow monitoring in a precursor vapor supply system of a substrate processing systemLAM RES CORP·Filed 2019·Granted Feb 22, 2022·0 cites·11 claims
- 5062US12125705B2Method for providing doped silicon using a diffusion barrier layerLAM RES CORP·Filed 2020·Granted Oct 22, 2024·0 cites·20 claims
Showing the top 50 of 68 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →