Inventor · disambiguated record
Pu-Ju Lin
Also filed as: LIN PU-JU
37 granted patents·17 pending applications·11 citations·filing 2016–2025
94Inventor score
Files withUNIMICRON TECHNOLOGY CORP54
Top patents by PatentIndex Score
54 records- 0195US11516910B1Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Nov 29, 2022·4 cites·10 claims
- 0289US11410971B2Chip package structureUNIMICRON TECHNOLOGY CORP·Filed 2020·Granted Aug 9, 2022·2 cites·11 claims
- 0385US11943877B2Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Mar 26, 2024·1 cites·6 claims
- 0484US11460255B2Vapor chamber device and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2020·Granted Oct 4, 2022·2 cites·10 claims
- 0581US10685922B2Package structure with structure reinforcing element and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2019·Granted Jun 16, 2020·2 cites·8 claims
- 0675US12250776B2Substrate structure and cutting method thereofUNIMICRON TECHNOLOGY CORP·Filed 2023·Granted Mar 11, 2025·0 cites·13 claims
- 0775US2025393127A1Substrate structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2025·Application pending·0 cites
- 0869US11410940B2Package structure with structure reinforcing element and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Aug 9, 2022·0 cites·6 claims
- 0969US2025240887A1Circuit board and method of manufacturing the sameUNIMICRON TECHNOLOGY CORP·Filed 2025·Application pending·0 cites
- 1068US12504591B2Co-packaged structure for optics and electricsUNIMICRON TECHNOLOGY CORP·Filed 2023·Granted Dec 23, 2025·0 cites·13 claims
- 1167US12185479B2Flexible circuit board and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Dec 31, 2024·0 cites·17 claims
- 1267US11690180B2Manufacturing method of carrier structureUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Jun 27, 2023·0 cites·9 claims
- 1367US10957658B2Package structure with structure reinforcing element and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2020·Granted Mar 23, 2021·0 cites·9 claims
- 1466US11637047B2Manufacturing method of chip package structureUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Apr 25, 2023·0 cites·11 claims
- 1564US11991824B2Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted May 21, 2024·0 cites·3 claims
- 1664US2025168988A1Substrate structureUNIMICRON TECHNOLOGY CORP·Filed 2025·Application pending·0 cites
- 1764US2023067112A1Vapor chamber structureUNIMICRON TECHNOLOGY CORP·Filed 2022·Application pending·0 cites
- 1863US10925172B1Carrier structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2019·Granted Feb 16, 2021·0 cites·8 claims
- 1962US11462452B2Chip package structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Oct 4, 2022·0 cites·10 claims
- 2061US2025323232A1Package structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 2161US2025149426A1Package structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 2261US2024248264A1Package structureUNIMICRON TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 2359US2025331101A1Collapse-free circuit structure with low capacitance effectUNIMICRON TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 2458US12243838B2Circuit substrate structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Mar 4, 2025·0 cites·15 claims
- 2557US11366381B2Mask structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2019·Granted Jun 21, 2022·0 cites·4 claims
- 2657US10588214B2Stacked structure and method for manufacturing the sameUNIMICRON TECHNOLOGY CORP·Filed 2019·Granted Mar 10, 2020·0 cites·12 claims
- 2757US2024413067A1Electronic package module and method for fabrication of the sameUNIMICRON TECHNOLOGY CORP·Filed 2023·Application pending·0 cites
- 2857US2021247147A1Vapor chamber structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Application pending·0 cites
- 2956US12218017B2Glass carrier having protection structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Feb 4, 2025·0 cites·5 claims
- 3056US12160953B2Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Dec 3, 2024·0 cites·19 claims
- 3156US2025331108A1Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 3255US11424216B2Electronic device bonding structure and fabrication method thereofUNIMICRON TECHNOLOGY CORP·Filed 2020·Granted Aug 23, 2022·0 cites·8 claims
- 3354US12062742B2Package structure and manufacturing method of the sameUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Aug 13, 2024·0 cites·10 claims
- 3453US10324370B2Manufacturing method of circuit substrate and mask structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2016·Granted Jun 18, 2019·0 cites·10 claims
- 3553US2024251504A1Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2023·Application pending·0 cites
- 3652US11764344B2Package structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Sep 19, 2023·0 cites·20 claims
- 3752US11488900B2Wiring board with interposer substrate surrounded by underfill and embedded in main substrate and method of fabricating the sameUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Nov 1, 2022·0 cites·20 claims
- 3852US11410933B2Package structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Aug 9, 2022·0 cites·10 claims
- 3952US2023335419A1Etching device and etching methodUNIMICRON TECHNOLOGY CORP·Filed 2022·Application pending·0 cites
- 4051US12369250B2Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Jul 22, 2025·0 cites·16 claims
- 4151US2023163074A1Chip packaging structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2022·Application pending·0 cites
- 4250US12438060B2Chip package and method of manufacturing the sameUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Oct 7, 2025·0 cites·14 claims
- 4350US11955587B2Light emitting diode package structure and manufacturing method thereof and manufacturing method of display deviceUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Apr 9, 2024·0 cites·20 claims
- 4449US11710690B2Package structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Jul 25, 2023·0 cites·20 claims
- 4549US10950535B2Package structure and method of manufacturing the sameUNIMICRON TECHNOLOGY CORP·Filed 2020·Granted Mar 16, 2021·0 cites·13 claims
- 4648US11764120B2Chip packaging structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Sep 19, 2023·0 cites·4 claims
- 4748US11682612B2Package structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Jun 20, 2023·0 cites·8 claims
- 4848US11665832B2Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted May 30, 2023·0 cites·6 claims
- 4948US2022069489A1Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Application pending·0 cites
- 5048US2022328387A1Package carrier and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Application pending·0 cites
Showing the top 50 of 54 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →