Inventor · disambiguated record
Qinghuang Lin
Also filed as: LIN QINGHUANG
135 granted patents·19 pending applications·1,755 citations·filing 1998–2025
99Inventor score
Top patents by PatentIndex Score
154 records- 0199US7306853B2Patternable low dielectric constant materials and their use in ULSI interconnectionIBM·Filed 2005·Granted Dec 11, 2007·64 cites·10 claims
- 0299US7041748B2Patternable low dielectric constant materials and their use in ULSI interconnectionIBM·Filed 2003·Granted May 9, 2006·98 cites·13 claims
- 0398US12278125B2Integrated dry processes for patterning radiation photoresist patterningLAM RES CORP·Filed 2023·Granted Apr 15, 2025·8 cites·19 claims
- 0498US12183604B2Integrated dry processes for patterning radiation photoresist patterningLAM RES CORP·Filed 2023·Granted Dec 31, 2024·9 cites·37 claims
- 0598US8241992B2Method for air gap interconnect integration using photo-patternable low k materialCLEVENGER LAWRENCE A·Filed 2010·Granted Aug 14, 2012·422 cites·18 claims
- 0698US6087064ASilsesquioxane polymers, method of synthesis, photoresist composition, and multilayer lithographic methodIBM·Filed 1998·Granted Jul 11, 2000·234 cites·34 claims
- 0797US9647200B1Encapsulation of magnetic tunnel junction structures in organic photopatternable dielectric materialIBM·Filed 2015·Granted May 9, 2017·21 cites·12 claims
- 0896US9490202B2Self-aligned airgap interconnect structuresGLOBALFOUNDRIES INC·Filed 2014·Granted Nov 8, 2016·23 cites·10 claims
- 0996US7479306B2SiCOH dielectric material with improved toughness and improved Si-C bonding, semiconductor device containing the same, and method to make the sameIBM·Filed 2005·Granted Jan 20, 2009·26 cites·1 claims
- 1095US9705077B2Spin torque MRAM fabrication using negative tone lithography and ion beam etchingIBM·Filed 2015·Granted Jul 11, 2017·7 cites·16 claims
- 1195US8900988B2Method for forming self-aligned airgap interconnect structuresLIN QINGHUANG·Filed 2011·Granted Dec 2, 2014·18 cites·11 claims
- 1294US6210856B1Resist composition and process of forming a patterned resist layer on a substrateIBM·Filed 1999·Granted Apr 3, 2001·123 cites·26 claims
- 1393US9490164B1Techniques for forming contacts for active BEOLIBM·Filed 2015·Granted Nov 8, 2016·10 cites·20 claims
- 1493US9472450B2Graphene cap for copper interconnect structuresBONILLA GRISELDA·Filed 2012·Granted Oct 18, 2016·13 cites·5 claims
- 1592US12005255B2Adaptive electrical neurostimulation treatment to reduce pain perceptionBOSTON SCIENT NEUROMODULATION CORP·Filed 2023·Granted Jun 11, 2024·1 cites·20 claims
- 1692US8642252B2Methods for fabrication of an air gap-containing interconnect structureCLEVENGER LAWRENCE A·Filed 2010·Granted Feb 4, 2014·13 cites·17 claims
- 1792US8202783B2Patternable low-k dielectric interconnect structure with a graded cap layer and method of fabricationLIN QINGHUANG·Filed 2009·Granted Jun 19, 2012·9 cites·16 claims
- 1892US7709370B2Spin-on antireflective coating for integration of patternable dielectric materials and interconnect structuresIBM·Filed 2007·Granted May 4, 2010·22 cites·13 claims
- 1992US6344305B1Radiation sensitive silicon-containing resistsIBM·Filed 2000·Granted Feb 5, 2002·42 cites·11 claims
- 2091US9054160B2Interconnect structure and method for fabricating on-chip interconnect structures by image reversalBRUCE ROBERT L·Filed 2011·Granted Jun 9, 2015·12 cites·18 claims
- 2191US8895433B2Method of forming a graphene cap for copper interconnect structuresSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Nov 25, 2014·9 cites·17 claims
- 2291US8617941B2High-speed graphene transistor and method of fabrication by patternable hard mask materialsFARMER DAMON BROOKS·Filed 2011·Granted Dec 31, 2013·21 cites·17 claims
- 2391US8461039B2Patternable low-K dielectric interconnect structure with a graded cap layer and method of fabricationLIN QINGHUANG·Filed 2012·Granted Jun 11, 2013·5 cites·18 claims
- 2490US9245791B2Method for fabricating a contactGLOBALFOUNDRIES INC·Filed 2015·Granted Jan 26, 2016·5 cites·8 claims
- 2590US8623761B2Method of forming a graphene cap for copper interconnect structuresBONILLA GRISELDA·Filed 2012·Granted Jan 7, 2014·9 cites·10 claims
- 2690US8029971B2Photopatternable dielectric materials for BEOL applications and methods for useIBM·Filed 2008·Granted Oct 4, 2011·11 cites·24 claims
- 2789US11826570B2Adaptive chronic pain relief via implanted electrical neurostimulationBOSTON SCIENT NEUROMODULATION CORP·Filed 2022·Granted Nov 28, 2023·1 cites·20 claims
- 2889US10583282B2Neuro-stem cell stimulation and growth enhancement with implantable nanodeviceIBM·Filed 2017·Granted Mar 10, 2020·7 cites·5 claims
- 2989US8659115B2Airgap-containing interconnect structure with improved patternable low-K material and method of fabricatingLIN QINGHUANG·Filed 2009·Granted Feb 25, 2014·10 cites·23 claims
- 3089US8101236B2Method of fabricating a SiCOH dielectric material with improved toughness and improved Si-C bondingEDELSTEIN DANIEL C·Filed 2009·Granted Jan 24, 2012·8 cites·24 claims
- 3188US10008536B2Encapsulation of magnetic tunnel junction structures in organic photopatternable dielectric materialIBM·Filed 2017·Granted Jun 26, 2018·6 cites·14 claims
- 3288US7666794B2Multiple patterning using patternable low-k dielectric materialsIBM·Filed 2008·Granted Feb 23, 2010·13 cites·25 claims
- 3388US7141692B2Molecular photoresists containing nonpolymeric silsesquioxanesIBM·Filed 2003·Granted Nov 28, 2006·19 cites·69 claims
- 3487US11033740B2Adaptive electrical neurostimulation treatment to reduce pain perceptionBOSTON SCIENT NEUROMODULATION CORP·Filed 2019·Granted Jun 15, 2021·6 cites·20 claims
- 3586US11638825B2Adaptive electrical neurostimulation treatment to reduce pain perceptionBOSTON SCIENT NEUROMODULATION CORP·Filed 2021·Granted May 2, 2023·1 cites·20 claims
- 3686US10002904B2Encapsulation of magnetic tunnel junction structures in organic photopatternable dielectric materialIBM·Filed 2017·Granted Jun 19, 2018·5 cites·20 claims
- 3786US8822137B2Self-aligned fine pitch permanent on-chip interconnect structures and method of fabricationLIN QINGHUANG·Filed 2011·Granted Sep 2, 2014·7 cites·17 claims
- 3886US7709177B2Multilayered resist systems using tuned polymer films as underlayers and methods of fabrication thereofIBM·Filed 2007·Granted May 4, 2010·7 cites·18 claims
- 3986US6340734B1Silsesquioxane polymers, method of synthesis, photoresist composition, and multilayer lithographic methodIBM·Filed 1999·Granted Jan 22, 2002·73 cites·7 claims
- 4085US11389655B2Adaptive chronic pain relief via implanted electrical neurostimulationBOSTON SCIENT NEUROMODULATION CORP·Filed 2019·Granted Jul 19, 2022·5 cites·20 claims
- 4185US9196523B2Self-aligned permanent on-chip interconnect structuresLIN QINGHUANG·Filed 2012·Granted Nov 24, 2015·6 cites·13 claims
- 4285US8952539B2Methods for fabrication of an air gap-containing interconnect structureIBM·Filed 2014·Granted Feb 10, 2015·5 cites·15 claims
- 4385US7816253B2Surface treatment of inter-layer dielectricIBM·Filed 2006·Granted Oct 19, 2010·10 cites·6 claims
- 4485US7446058B2Adhesion enhancement for metal/dielectric interfaceIBM·Filed 2006·Granted Nov 4, 2008·10 cites·10 claims
- 4584US9236298B2Methods for fabrication interconnect structures with functional components and electrical conductive contact structures on a same levelGLOBALFOUNDRIES US 2 LLC·Filed 2015·Granted Jan 12, 2016·3 cites·17 claims
- 4684US6187505B1Radiation sensitive silicon-containing resistsIBM·Filed 1999·Granted Feb 13, 2001·46 cites·17 claims
- 4783US8475667B2Method of patterning photosensitive material on a substrate containing a latent acid generatorDARNON MAXIME·Filed 2010·Granted Jul 2, 2013·4 cites·20 claims
- 4883US8415248B2Self-aligned dual damascene BEOL structures with patternable low-k material and methods of forming sameCHEN SHYNG-TSONG·Filed 2012·Granted Apr 9, 2013·6 cites·16 claims
- 4982US8890318B2Middle of line structuresLIN QINGHUANG·Filed 2011·Granted Nov 18, 2014·4 cites·10 claims
- 5082US8795556B2Self-aligned permanent on-chip interconnect structure formed by pitch splittingLIN QINGHUANG·Filed 2012·Granted Aug 5, 2014·4 cites·19 claims
Showing the top 50 of 154 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →