Inventor · disambiguated record
Qwan Ho Chung
Also filed as: CHUNG QWAN HO
31 granted patents·11 pending applications·99 citations·filing 2003–2014
95Inventor score
Top patents by PatentIndex Score
42 records- 0196US8053879B2Stacked semiconductor package and method for fabricating the sameHYNIX SEMICONDUCTOR INC·Filed 2008·Granted Nov 8, 2011·53 cites·5 claims
- 0284US9209146B2Electronic device packages having bumps and methods of manufacturing the sameSK HYNIX INC·Filed 2014·Granted Dec 8, 2015·6 cites·15 claims
- 0384US7847379B2Lightweight and compact through-silicon via stack package with excellent electrical connections and method for manufacturing the sameHYNIX SEMICONDUCTOR INC·Filed 2007·Granted Dec 7, 2010·10 cites·8 claims
- 0475US8343803B2Lightweight and compact through-silicon via stack package with excellent electrical connections and method for manufacturing the sameHYNIX SEMICONDUCTOR INC·Filed 2010·Granted Jan 1, 2013·3 cites·8 claims
- 0574US8441116B2Semiconductor package having substrate for high speed semiconductor packageLEE WOONG SUN·Filed 2012·Granted May 14, 2013·4 cites·17 claims
- 0668US8710652B2Embedded package and method for manufacturing the sameCHUNG QWAN HO·Filed 2011·Granted Apr 29, 2014·2 cites·11 claims
- 0767US8030739B2Semiconductor package having chip selection through electrodes and stacked semiconductor package having the sameHYNIX SEMICONDUCTOR INC·Filed 2008·Granted Oct 4, 2011·3 cites·20 claims
- 0866US9305895B2Substrates having ball lands, semiconductor packages including the same, and methods of fabricating semiconductor packages including the sameSK HYNIX INC·Filed 2014·Granted Apr 5, 2016·2 cites·19 claims
- 0966US8907487B2Electronic device packages having bumps and methods of manufacturing the sameKIM SEUNG JEE·Filed 2012·Granted Dec 9, 2014·2 cites·5 claims
- 1066US7629682B2Wafer level package configured to compensate size difference in different types of packagesHYNIX SEMICONDUCTOR INC·Filed 2006·Granted Dec 8, 2009·3 cites·7 claims
- 1165US8264087B2Semiconductor package for discharging heat and method for fabricating the sameCHUNG QWAN HO·Filed 2009·Granted Sep 11, 2012·3 cites·12 claims
- 1264US8823183B2Bump for semiconductor package, semiconductor package having bump, and stacked semiconductor packageKIM KI YOUNG·Filed 2010·Granted Sep 2, 2014·2 cites·17 claims
- 1363US9209150B2Embedded packages, methods of fabricating the same, electronic systems including the same, and memory cards including the sameSK HYNIX INC·Filed 2013·Granted Dec 8, 2015·1 cites·16 claims
- 1461US9368456B2Semiconductor package having EMI shielding and method of fabricating the sameSK HYNIX INC·Filed 2014·Granted Jun 14, 2016·1 cites·12 claims
- 1560US7855437B2Semiconductor device and semiconductor package having the sameHYNIX SEMICONDUCTOR INC·Filed 2010·Granted Dec 21, 2010·1 cites·10 claims
- 1659US9609742B2Electrical characteristics of package substrates and semiconductor packages including the sameSK HYNIX INC·Filed 2013·Granted Mar 28, 2017·1 cites·8 claims
- 1753US9111820B2Embedded package and method for manufacturing the sameSK HYNIX INC·Filed 2014·Granted Aug 18, 2015·0 cites·16 claims
- 1853US2009261469A1Semiconductor package and method for manufacturing the sameCHUNG QWAN HO·Filed 2008·Application pending·0 cites
- 1952US7445961B2Semiconductor chip package and method for fabricating the sameHYNIX SEMICONDUCTOR INC·Filed 2008·Granted Nov 4, 2008·0 cites·4 claims
- 2051US8129627B2Circuit board having semiconductor chipLEE WOONG SUN·Filed 2009·Granted Mar 6, 2012·0 cites·20 claims
- 2151US2013087919A1Lightweight and compact through-silicon via stack package with excellent electrical connections and method for manufacturing the sameHYNIX SEMICONDUCTOR INC·Filed 2012·Application pending·0 cites
- 2251US2013236993A1Method of fabricating semiconductor packageSK HYNIX INC·Filed 2013·Application pending·0 cites
- 2350US7786590B2Semiconductor package with improved size, reliability, warpage prevention, and heat dissipation and method for manufacturing the sameHYNIX SEMICONDUCTOR INC·Filed 2007·Granted Aug 31, 2010·0 cites·17 claims
- 2449US8399294B2Semiconductor package for discharging heat and method for fabricating the sameCHUNG QWAN HO·Filed 2012·Granted Mar 19, 2013·0 cites·4 claims
- 2549US7755170B2Semiconductor device and semiconductor package having the sameHYNIX SEMICONDUCTOR INC·Filed 2007·Granted Jul 13, 2010·0 cites·4 claims
- 2648US9252136B2Package stacked deviceSK HYNIX INC·Filed 2014·Granted Feb 2, 2016·0 cites·20 claims
- 2748US8461696B2Substrate for semiconductor package, semiconductor package including the same, and stack package using the semiconductor packageLEE KYU WON·Filed 2009·Granted Jun 11, 2013·0 cites·18 claims
- 2848US8445322B2Method of fabricating semiconductor packageLEE WOONG SUN·Filed 2011·Granted May 21, 2013·0 cites·20 claims
- 2948US2009001602A1Stack package that prevents warping and cracking of a wafer and semiconductor chip and method for manufacturing the sameCHUNG QWAN HO·Filed 2007·Application pending·0 cites
- 3047US7928535B2Semiconductor device and semiconductor package having the sameHYNIX SEMICONDUCTOR INC·Filed 2010·Granted Apr 19, 2011·0 cites·3 claims
- 3147US7595552B2Stacked semiconductor package in which semiconductor packages are connected using a connectorHYNIX SEMICONDUCTOR INC·Filed 2007·Granted Sep 29, 2009·0 cites·11 claims
- 3247US7355287B2Semiconductor chip package and method for fabricating the sameHYNIX SEMICONDUCTOR INC·Filed 2004·Granted Apr 8, 2008·2 cites·6 claims
- 3347US2009152708A1Substrate for high speed semiconductor package and semiconductor package having the sameLEE WOONG SUN·Filed 2008·Application pending·0 cites
- 3447US2012208325A1Semiconductor package and method for manufacturing the sameCHUNG QWAN HO·Filed 2012·Application pending·0 cites
- 3545US7858520B2Semiconductor package with improved size, reliability, warpage prevention, and heat dissipation and method for manufacturing the sameHYNIX SEMICONDUCTOR INC·Filed 2010·Granted Dec 28, 2010·0 cites·19 claims
- 3645US2011033980A1Stack package that prevents warping and cracking of a wafer and semiconductor chip and method for manufacturing the sameHYNIX SEMICONDUCTOR INC·Filed 2010·Application pending·0 cites
- 3744US9412716B2Semiconductor package and method for manufacturing the sameSK HYNIX INC·Filed 2014·Granted Aug 9, 2016·0 cites·13 claims
- 3843US2009057870A1Stacked semiconductor package with a reduced volumeCHUNG QWAN HO·Filed 2007·Application pending·0 cites
- 3941US2013334685A1Embedded packages and methods of manufacturing the sameKIM SI HAN·Filed 2012·Application pending·0 cites
- 4039US8796834B2Stack type semiconductor packageBAE JIN HO·Filed 2011·Granted Aug 5, 2014·0 cites·10 claims
- 4136US2004262773A1Chip-stacked packageFiled 2003·Application pending·0 cites
- 4233US2012112342A1Semiconductor device and stacked semiconductor packageHYUN SUNG HO·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →