Inventor · disambiguated record
Ramakanth Alapati
Also filed as: ALAPATI RAMAKANTH
47 granted patents·10 pending applications·977 citations·filing 2006–2025
98Inventor score
Files withPSIQUANTUM CORP11MICRON TECHNOLOGY INC9AMKOR TECH SINGAPORE HOLDING PTE LTD7GLOBALFOUNDRIES INC5ALAPATI RAMAKANTH4
Top patents by PatentIndex Score
57 records- 0199US7732343B2Simplified pitch doubling process flowMICRON TECHNOLOGY INC·Filed 2007·Granted Jun 8, 2010·572 cites·13 claims
- 0298US11493714B1Quantum computing die assembly with thru-silicon vias and connected logic circuitPSIQUANTUM CORP·Filed 2021·Granted Nov 8, 2022·51 cites·20 claims
- 0398US11107799B1Hybrid system including photonic and electronic integrated circuits and cooling platePSIQUANTUM CORP·Filed 2019·Granted Aug 31, 2021·25 cites·31 claims
- 0497US11670627B1Hybrid system including photonic and electronic integrated circuits and cooling platePSIQUANTUM CORP·Filed 2021·Granted Jun 6, 2023·4 cites·18 claims
- 0597US7790360B2Methods of forming multiple linesMICRON TECHNOLOGY INC·Filed 2007·Granted Sep 7, 2010·60 cites·30 claims
- 0697US7651951B2Pitch reduced patterns relative to photolithography featuresMICRON TECHNOLOGY INC·Filed 2007·Granted Jan 26, 2010·46 cites·28 claims
- 0796US11892693B1Photonic quantum computer assemblyPSIQUANTUM CORP·Filed 2022·Granted Feb 6, 2024·2 cites·11 claims
- 0896US11550108B1Quantum computing die assembly with thru-silicon viasPSIQUANTUM CORP·Filed 2021·Granted Jan 10, 2023·3 cites·20 claims
- 0996US11493713B1Photonic quantum computer assembly having dies with specific contact configuration and matched CTEPSIQUANTUM CORP·Filed 2019·Granted Nov 8, 2022·11 cites·16 claims
- 1096US7902074B2Simplified pitch doubling process flowMICRON TECHNOLOGY INC·Filed 2006·Granted Mar 8, 2011·26 cites·19 claims
- 1195US7718540B2Pitch reduced patterns relative to photolithography featuresROUND ROCK RES LLC·Filed 2007·Granted May 18, 2010·22 cites·5 claims
- 1294US12242123B1Photonic quantum computer assembly with a quantum computing die facing an electronic circuit diePSIQUANTUM CORP·Filed 2023·Granted Mar 4, 2025·1 cites·18 claims
- 1394US12100701B1Hybrid system including photonic and electronic integrated circuits and cooling platePSIQUANTUM CORP·Filed 2023·Granted Sep 24, 2024·1 cites·20 claims
- 1494US8048812B2Pitch reduced patterns relative to photolithography featuresROUND ROCK RES LLC·Filed 2010·Granted Nov 1, 2011·11 cites·20 claims
- 1593US11035752B1Active alignment of optical die to optical substratesPSIQUANTUM CORP·Filed 2020·Granted Jun 15, 2021·6 cites·7 claims
- 1693US9553080B1Method and process for integration of TSV-middle in 3D IC stacksGLOBALFOUNDRIES INC·Filed 2015·Granted Jan 24, 2017·12 cites·9 claims
- 1793US8207576B2Pitch reduced patterns relative to photolithography featuresTRAN LUAN·Filed 2007·Granted Jun 26, 2012·18 cites·25 claims
- 1892US8598632B2Integrated circuit having pitch reduced patterns relative to photoithography featuresTRAN LUAN·Filed 2012·Granted Dec 3, 2013·10 cites·6 claims
- 1992US8431456B2Methods of forming high density structures and low density structures with a single photomaskALAPATI RAMAKANTH·Filed 2012·Granted Apr 30, 2013·11 cites·11 claims
- 2092US8207570B2Semiconductor constructionsALAPATI RAMAKANTH·Filed 2010·Granted Jun 26, 2012·12 cites·20 claims
- 2191US12087623B1Dielectric liners on through glass viasYIELD ENG SYSTEMS INC·Filed 2024·Granted Sep 10, 2024·1 cites·18 claims
- 2291US9184159B2Simplified pitch doubling process flowMICRON TECHNOLOGY INC·Filed 2012·Granted Nov 10, 2015·7 cites·20 claims
- 2390US7799694B2Methods of forming semiconductor constructionsMICRON TECHNOLOGY INC·Filed 2006·Granted Sep 21, 2010·14 cites·35 claims
- 2488US11024604B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECHNOLOGY INC·Filed 2019·Granted Jun 1, 2021·5 cites·17 claims
- 2588US8119535B2Pitch reduced patterns relative to photolithography featuresTRAN LUAN·Filed 2009·Granted Feb 21, 2012·8 cites·19 claims
- 2687US8598043B2Methods of forming semiconductor constructionsALAPATI RAMAKANTH·Filed 2010·Granted Dec 3, 2013·7 cites·20 claims
- 2787US8030217B2Simplified pitch doubling process flowMICRON TECHNOLOGY INC·Filed 2010·Granted Oct 4, 2011·5 cites·25 claims
- 2885US10644479B1Semiconductor device and method of manufacturing a semiconductor deviceAMKOR TECHNOLOGY INC·Filed 2019·Granted May 5, 2020·5 cites·18 claims
- 2981US12221339B2Semiconductor device and method of manufacturing semiconductor deviceAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Granted Feb 11, 2025·0 cites·19 claims
- 3079US9711662B1Integrated circuits with optical modulators and photodetectors and methods for producing the sameGLOBALFOUNDRIES SG PTE LTD·Filed 2016·Granted Jul 18, 2017·3 cites·20 claims
- 3178US8669166B1Methods of thinning and/or dicing semiconducting substrates having integrated circuit products formed thereonAGARWAL RAHUL·Filed 2012·Granted Mar 11, 2014·4 cites·17 claims
- 3278US8637993B23D integrated circuit system with connecting via structure and method for forming the sameWONG CHUN YU·Filed 2012·Granted Jan 28, 2014·7 cites·19 claims
- 3378US2025093230A1Active alignment of optical die to optical substratesPSIQUANTUM CORP·Filed 2024·Application pending·0 cites
- 3473US11897761B2Semiconductor device and method of manufacturing semiconductor deviceAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Feb 13, 2024·0 cites·15 claims
- 3573US2025153999A1Semiconductor device and method of manufacturing semiconductor deviceAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2025·Application pending·0 cites
- 3673US2025246483A1Method for forming dielectric liners on through glass viasYIELD ENG SYSTEMS INC·Filed 2024·Application pending·0 cites
- 3769US2023197769A1Semiconductor device and method of manufacturing a semiconductor deviceAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Application pending·0 cites
- 3868US12130195B2Active alignment of optical die to optical substratesPSIQUANTUM CORP·Filed 2021·Granted Oct 29, 2024·0 cites·15 claims
- 3968US7659210B2Nano-crystal etch processMICRON TECHNOLOGY INC·Filed 2007·Granted Feb 9, 2010·2 cites·20 claims
- 4065US11784457B2Semiconductor device and method of manufacturing a semiconductor deviceAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Oct 10, 2023·0 cites·18 claims
- 4164US8338959B2Simplified pitch doubling process flowNIROOMAND ARDAVAN·Filed 2011·Granted Dec 25, 2012·1 cites·19 claims
- 4262US11742327B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Aug 29, 2023·0 cites·20 claims
- 4361US11133642B2Semiconductor device and method of manufacturing a semiconductor deviceAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Sep 28, 2021·0 cites·19 claims
- 4460US9123787B2Through-silicon via unit cell with keep out zones and center point aligned probe pad, and method of formingGLOBALFOUNDRIES INC·Filed 2013·Granted Sep 1, 2015·2 cites·11 claims
- 4559US11352252B2Semiconductor device and method of manufacturing semiconductor deviceAMKOR TECHNOLOGY INC·Filed 2019·Granted Jun 7, 2022·0 cites·12 claims
- 4658US8809198B2Nano-crystal etch processALAPATI RAMAKANTH·Filed 2009·Granted Aug 19, 2014·0 cites·25 claims
- 4757US8143167B2Fabrication processes for forming dual depth trenches using a dry etch that deposits a polymerFANG XIAOLONG·Filed 2009·Granted Mar 27, 2012·1 cites·29 claims
- 4857US7737031B2Insitu formation of inverse floating gate poly structuresINTEL CORP·Filed 2007·Granted Jun 15, 2010·1 cites·8 claims
- 4956US2025379184A1Self-alignment for bonding of semiconductor devicesYIELD ENG SYSTEMS INC·Filed 2025·Application pending·0 cites
- 5053US11588009B2Semiconductor device having a lid configured as an enclosure and a capacitive structure and method of manufacturing a semiconductor deviceAMKOR TECHNOLOGY INC·Filed 2018·Granted Feb 21, 2023·0 cites·20 claims
Showing the top 50 of 57 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →