Inventor · disambiguated record
Ramasamy Chockalingam
Also filed as: CHOCKALINGAM RAMASAMY
19 granted patents·1 pending application·669 citations·filing 1998–2023
93Inventor score
Files withGLOBALFOUNDRIES SG PTE LTD13CHARTERED SEMICONDUCTOR MFG4GLOBALFOUNDRIES INC1PATTI ROBERT1TEZZARON SEMICONDUCTOR INC1
Top patents by PatentIndex Score
20 records- 0197US8183127B2Method for bonding wafers to produce stacked integrated circuitsPATTI ROBERT·Filed 2010·Granted May 22, 2012·236 cites·12 claims
- 0297US7750488B2Method for bonding wafers to produce stacked integrated circuitsTEZZARON SEMICONDUCTOR INC·Filed 2006·Granted Jul 6, 2010·222 cites·17 claims
- 0393US12094763B2Metal-insulator-metal capacitor (MIMCAP) and methods of forming the sameGLOBALFOUNDRIES SG PTE LTD·Filed 2021·Granted Sep 17, 2024·2 cites·20 claims
- 0490US10892239B1Bond pad reliability of semiconductor devicesGLOBALFOUNDRIES SG PTE LTD·Filed 2019·Granted Jan 12, 2021·8 cites·20 claims
- 0590US6380087B1CMP process utilizing dummy plugs in damascene processCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Apr 30, 2002·89 cites·29 claims
- 0689US6274499B1Method to avoid copper contamination during copper etching and CMPCHARTERED SEMICONDUCTOR MFG·Filed 1999·Granted Aug 14, 2001·98 cites·30 claims
- 0788US12034039B2Three electrode capacitor structure using spaced conductive pillarsGLOBALFOUNDRIES SG PTE LTD·Filed 2021·Granted Jul 9, 2024·2 cites·20 claims
- 0885US10170439B1Chamfering for stress reduction on passivation layerGLOBALFOUNDRIES INC·Filed 2017·Granted Jan 1, 2019·6 cites·18 claims
- 0981US11444045B2Bonding structures of semiconductor devicesGLOBALFOUNDRIES SG PTE LTD·Filed 2020·Granted Sep 13, 2022·1 cites·20 claims
- 1076US12159848B2Method of forming a sensor device having moisture sensitive dielectric layer with integrally formed projectionsGLOBALFOUNDRIES SG PTE LTD·Filed 2023·Granted Dec 3, 2024·0 cites·20 claims
- 1170US11244915B2Bond pads of semiconductor devicesGLOBALFOUNDRIES SG PTE LTD·Filed 2019·Granted Feb 8, 2022·1 cites·18 claims
- 1265US12102020B2Semiconductor memory devices having an electrode with an extensionGLOBALFOUNDRIES SG PTE LTD·Filed 2022·Granted Sep 24, 2024·0 cites·20 claims
- 1364US11855019B2Method of forming a sensor deviceGLOBALFOUNDRIES SG PTE LTD·Filed 2021·Granted Dec 26, 2023·0 cites·10 claims
- 1458US11646279B2Contact pad structures and methods for fabricating contact pad structuresGLOBALFOUNDRIES SG PTE LTD·Filed 2021·Granted May 9, 2023·0 cites·20 claims
- 1555US10658316B2Bond pad reliability of semiconductor devicesGLOBALFOUNDRIES SG PTE LTD·Filed 2018·Granted May 19, 2020·0 cites·14 claims
- 1648US12009326B2SRAM bit cells with three-dimensional integrationGLOBALFOUNDRIES SG PTE LTD·Filed 2022·Granted Jun 11, 2024·0 cites·15 claims
- 1747US11217496B2Test pad with crack stop protectionGLOBALFOUNDRIES SG PTE LTD·Filed 2019·Granted Jan 4, 2022·0 cites·20 claims
- 1844US10170437B1Via disguise to protect the security product from delayering and graphic design system (GDS) hacking and method for producing the sameGLOBALFOUNDRIES SG PTE LTD·Filed 2017·Granted Jan 1, 2019·0 cites·20 claims
- 1936US2002115283A1Planarization by selective electro-dissolutionCHARTERED SEMICONDUCTOR MFG·Filed 2001·Application pending·0 cites
- 2024US6548413B1Method to reduce microloading in metal etchingCHARTERED SEMICONDUCTOR MFG·Filed 1998·Granted Apr 15, 2003·4 cites·20 claims
Join the waitlist — get patent alerts
Get an alert when Ramasamy Chockalingam files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →