Inventor · disambiguated record
Raehyung Do
Also filed as: DO RAEHYUNG
2 granted patents·2 pending applications·0 citations·filing 2012–2023
25Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0152US12456711B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Oct 28, 2025·0 cites·20 claims
- 0245US12300668B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted May 13, 2025·0 cites·20 claims
- 0341US2022093673A1Image sensor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2021·Application pending·0 cites
- 0429US2012315726A1Method of manufacturing a semiconductor chip packageBYUN HAK-KYOON·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →