Inventor · disambiguated record
Rajiv Dunne
Also filed as: DUNNE RAJIV · DUNNE RAJIV C · DUNNE RAJIV CARL
18 granted patents·2 pending applications·210 citations·filing 2004–2015
94Inventor score
Files withTEXAS INSTRUMENTS INC11DUNNE RAJIV4LAMSON MICHAEL ANTHONY2BONIFIELD THOMAS D1DUNNE RAJIV CARL1
Top patents by PatentIndex Score
20 records- 0197US8017439B2Dual carrier for joining IC die or wafers to TSV wafersTEXAS INSTRUMENTS INC·Filed 2010·Granted Sep 13, 2011·26 cites·20 claims
- 0293US8313982B2Stacked die assemblies including TSV dieDUNNE RAJIV·Filed 2010·Granted Nov 20, 2012·24 cites·17 claims
- 0392US7915080B2Bonding IC die to TSV wafersTEXAS INSTRUMENTS INC·Filed 2009·Granted Mar 29, 2011·30 cites·16 claims
- 0491US9165873B1Semiconductor package having etched foil capacitor integrated into leadframeTEXAS INSTRUMENTS INC·Filed 2014·Granted Oct 20, 2015·10 cites·14 claims
- 0590US8178976B2IC device having low resistance TSV comprising ground connectionDUNNE RAJIV·Filed 2009·Granted May 15, 2012·18 cites·14 claims
- 0688US9030216B2Coaxial four-point probe for low resistance measurementsLAMSON MICHAEL ANTHONY·Filed 2012·Granted May 12, 2015·9 cites·10 claims
- 0788US7504283B2Stacked-flip-assembled semiconductor chips embedded in thin hybrid substrateTEXAS INSTRUMENTS INC·Filed 2006·Granted Mar 17, 2009·15 cites·9 claims
- 0887US7572677B2Arrangement in semiconductor packages for inhibiting adhesion of lid to substrate while providing compression supportTEXAS INSTRUMENTS INC·Filed 2006·Granted Aug 11, 2009·14 cites·11 claims
- 0983US7126217B2Arrangement in semiconductor packages for inhibiting adhesion of lid to substrate while providing compression supportTEXAS INSTRUMENTS INC·Filed 2004·Granted Oct 24, 2006·30 cites·15 claims
- 1082US8154134B2Packaged electronic devices with face-up die having TSV connection to leads and die padBONIFIELD THOMAS D·Filed 2009·Granted Apr 10, 2012·15 cites·14 claims
- 1179US8431481B2IC device having low resistance TSV comprising ground connectionDUNNE RAJIV·Filed 2012·Granted Apr 30, 2013·4 cites·11 claims
- 1278US9373572B2Semiconductor package having etched foil capacitor integrated into leadframeTEXAS INSTRUMENTS INC·Filed 2015·Granted Jun 21, 2016·2 cites·20 claims
- 1376US7790597B2Solder cap application process on copper bump using solder powder filmTEXAS INSTRUMENTS INC·Filed 2008·Granted Sep 7, 2010·7 cites·11 claims
- 1467US8883567B2Process of making a stacked semiconductor package having a clipWYANT MICHAEL TODD·Filed 2012·Granted Nov 11, 2014·5 cites·17 claims
- 1561US7898069B2Stacked flip-assembled semiconductor chips embedded in thin hybrid substrateTEXAS INSTRUMENTS INC·Filed 2009·Granted Mar 1, 2011·1 cites·12 claims
- 1652US8436475B2IC device having low resistance TSV comprising ground connectionDUNNE RAJIV·Filed 2012·Granted May 7, 2013·0 cites·10 claims
- 1747US9142496B1Semiconductor package having etched foil capacitor integrated into leadframeTEXAS INSTRUMENTS INC·Filed 2014·Granted Sep 22, 2015·0 cites·4 claims
- 1846US2010159644A1Low-cost flip-chip interconnect with an integrated wafer-applied photo-sensitive adhesive and metal-loaded epoxy paste systemDUNNE RAJIV CARL·Filed 2009·Application pending·0 cites
- 1946US2009297879A1Structure and Method for Reliable Solder JointsTEXAS INSTRUMENTS INC·Filed 2009·Application pending·0 cites
- 2044US8174276B2Coaxial four-point probe for low resistance measurementsLAMSON MICHAEL ANTHONY·Filed 2009·Granted May 8, 2012·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →