Inventor · disambiguated record
Raman K. Nurani
Also filed as: NURANI RAMAN K · NURANI RAMAN KRISHNAN
11 granted patents·3 pending applications·79 citations·filing 2002–2024
85Inventor score
Top patents by PatentIndex Score
14 records- 0189US10579041B2Semiconductor process control methodAPPLIED MATERIALS INC·Filed 2017·Granted Mar 3, 2020·7 cites·20 claims
- 0288US6918101B1Apparatus and methods for determining critical area of semiconductor design dataKLA TENCOR TECH CORP·Filed 2002·Granted Jul 12, 2005·67 cites·8 claims
- 0382US11842910B2Detecting outliers at a manufacturing system using machine learningAPPLIED MATERIALS INC·Filed 2021·Granted Dec 12, 2023·2 cites·20 claims
- 0474US10481199B2Data analytics and computational analytics for semiconductor process controlAPPLIED MATERIALS INC·Filed 2017·Granted Nov 19, 2019·2 cites·21 claims
- 0572US12468873B2Systems and methods for predicting film thickness using virtual metrologyAPPLIED MATERIALS INC·Filed 2024·Granted Nov 11, 2025·0 cites·20 claims
- 0668US10579769B2Using design proximity index and effect-to-design proximity ratio to control semiconductor processes and achieve enhanced yieldAPPLIED MATERIALS INC·Filed 2017·Granted Mar 3, 2020·1 cites·19 claims
- 0760US2024086597A1Generation and utilization of virtual features for process modelingAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 0859US11989495B2Systems and methods for predicting film thickness using virtual metrologyAPPLIED MATERIALS INC·Filed 2020·Granted May 21, 2024·0 cites·23 claims
- 0956US2025021832A1Interactive data labeling for substrate generation processesAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1048US11187992B2Predictive modeling of metrology in semiconductor processesAPPLIED MATERIALS INC·Filed 2018·Granted Nov 30, 2021·0 cites·18 claims
- 1146US2024054333A1Piecewise functional fitting of substrate profiles for process learningAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 1244US11862520B2Systems and methods for predicting film thickness of individual layers using virtual metrologyAPPLIED MATERIALS INC·Filed 2021·Granted Jan 2, 2024·0 cites·20 claims
- 1343US10614262B2Method of predicting areas of vulnerable yield in a semiconductor substrateAPPLIED MATERIALS INC·Filed 2017·Granted Apr 7, 2020·0 cites·19 claims
- 1441US11088039B2Data management and mining to correlate wafer alignment, design, defect, process, tool, and metrology dataAPPLIED MATERIALS INC·Filed 2018·Granted Aug 10, 2021·0 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →