Inventor · disambiguated record
Richard J. Harries
Also filed as: HARRIES RICHARD · HARRIES RICHARD J
14 granted patents·5 pending applications·48 citations·filing 2003–2016
89Inventor score
Top patents by PatentIndex Score
19 records- 0178US9414484B2Thermal expansion compensators for controlling microelectronic package warpageMALATKAR PRAMOD·Filed 2011·Granted Aug 9, 2016·4 cites·20 claims
- 0273US7294533B2Mold compound cap in a flip chip multi-matrix array package and process of making sameINTEL CORP·Filed 2003·Granted Nov 13, 2007·24 cites·10 claims
- 0368US7387827B2Interconnection designs and materials having improved strength and fatigue lifeINTEL CORP·Filed 2003·Granted Jun 17, 2008·9 cites·6 claims
- 0467US8664771B2Apparatuses and methods to enhance passivation and ILD reliabilityHARRIES RICHARD J·Filed 2012·Granted Mar 4, 2014·2 cites·7 claims
- 0564US8941236B2Using collapse limiter structures between elements to reduce solder bump bridgingLIMAYE AMEYA·Filed 2012·Granted Jan 27, 2015·3 cites·16 claims
- 0662US8642462B2Interconnection designs and materials having improved strength and fatigue lifeSTERRETT TERRY LEE·Filed 2008·Granted Feb 4, 2014·3 cites·16 claims
- 0761US9136239B2Interconnection designs and materials having improved strength and fatigue lifeMICRON TECHNOLOGY INC·Filed 2014·Granted Sep 15, 2015·0 cites·14 claims
- 0861US8198185B2Apparatuses and methods to enhance passivation and ILD reliabilityHARRIES RICHARD J·Filed 2009·Granted Jun 12, 2012·2 cites·9 claims
- 0957US7514300B2Mold compound cap in a flip chip multi-matrix array package and process of making sameINTEL CORP·Filed 2007·Granted Apr 7, 2009·1 cites·19 claims
- 1054US10002814B2Apparatuses and methods to enhance passivation and ILD reliabilityINTEL CORP·Filed 2014·Granted Jun 19, 2018·0 cites·16 claims
- 1150US9793225B2Thermal expansion compensators for controlling microelectronic package warpageINTEL CORP·Filed 2016·Granted Oct 17, 2017·0 cites·10 claims
- 1247US2011122592A1First-level interconnects with slender columns, and processes of forming sameGANESAN SANKA·Filed 2009·Application pending·0 cites
- 1346US7719109B2Embedded capacitors for reducing package crackingINTEL CORP·Filed 2006·Granted May 18, 2010·0 cites·12 claims
- 1446US2009065931A1Packaged integrated circuit and method of forming thereofINTEL CORP·Filed 2007·Application pending·0 cites
- 1544US2007238222A1Apparatuses and methods to enhance passivation and ILD reliabilityHARRIES RICHARD J·Filed 2006·Application pending·0 cites
- 1642US7692307B2Compliant structure for an electronic device, method of manufacturing same, and system containing sameINTEL CORP·Filed 2006·Granted Apr 6, 2010·0 cites·12 claims
- 1738US2008001282A1Microelectronic assembly having a periphery seal around a thermal interface materialMODI MITUL·Filed 2006·Application pending·0 cites
- 1837US10985080B2Electronic package that includes lamination layerINTEL CORP·Filed 2015·Granted Apr 20, 2021·0 cites·18 claims
- 1935US2019043747A1Flexible circuit interconnect structure and method of making sameINTEL CORP·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →