Inventor · disambiguated record
Ronald Eisele
Also filed as: EISELE RONALD · EISELE RONALD R
34 granted patents·7 pending applications·125 citations·filing 1991–2020
96Inventor score
Files withDANFOSS SILICON POWER GMBH24HERAEUS DEUTSCHLAND GMBH & CO KG6EISELE RONALD4BECKER MARTIN2KOCK MATHIAS2
Top patents by PatentIndex Score
41 records- 0194US11400514B2Sintering tool and method for sintering an electronic subassemblyDANFOSS SILICON POWER GMBH·Filed 2020·Granted Aug 2, 2022·3 cites·14 claims
- 0290US9040338B2Power semiconductor module with method for manufacturing a sintered power semiconductor moduleEISELE RONALD·Filed 2011·Granted May 26, 2015·15 cites·12 claims
- 0383US10832995B2Power moduleDANFOSS SILICON POWER GMBH·Filed 2019·Granted Nov 10, 2020·3 cites·20 claims
- 0481US7339788B2Cooling unit and flow distributing element for use in such unitDANFOSS SILICON POWER GMBH·Filed 2003·Granted Mar 4, 2008·30 cites·16 claims
- 0576US10593608B2Semiconductor module comprising an encapsulating compound that covers at least one semiconductor componentHERAEUS DEUTSCHLAND GMBH & CO KG·Filed 2018·Granted Mar 17, 2020·2 cites·11 claims
- 0672US10079219B2Power semiconductor contact structure and method for the production thereofDANFOSS SILICON POWER GMBH·Filed 2015·Granted Sep 18, 2018·2 cites·18 claims
- 0771US10483229B2Sintering deviceDANFOSS SILICON POWER GMBH·Filed 2015·Granted Nov 19, 2019·2 cites·20 claims
- 0869US5159834ADevice for optoelectronic interface measurement and refractometry in liquidsFIBRONIX SENSOREN GMBH·Filed 1991·Granted Nov 3, 1992·37 cites·10 claims
- 0968US10685894B2Semi-conductor module with an encapsulating cement mass that covers a semi-conductor componentHERAEUS DEUTSCHLAND GMBH & CO KG·Filed 2014·Granted Jun 16, 2020·2 cites·15 claims
- 1067US8490681B2Fluid cooling systemEISELE RONALD·Filed 2005·Granted Jul 23, 2013·4 cites·7 claims
- 1166US7529091B2Power semiconductor module and method for cooling a power semiconductor moduleDANFOSS SILICON POWER GMBH·Filed 2005·Granted May 5, 2009·3 cites·16 claims
- 1265US9613929B2Power semiconductor chip with a metallic moulded body for contacting thick wires or strips and method for the production thereofDANFOSS SILICON POWER GMBH·Filed 2016·Granted Apr 4, 2017·1 cites·7 claims
- 1362US10381283B2Power semiconductor moduleDANFOSS SILICON POWER GMBH·Filed 2016·Granted Aug 13, 2019·1 cites·13 claims
- 1462US8017446B2Method for manufacturing a rigid power module suited for high-voltage applicationsDANFOSS SILICON POWER GMBH·Filed 2010·Granted Sep 13, 2011·2 cites·8 claims
- 1560US11626383B2Process and device for low-temperature pressure sinteringDANFOSS SILICON POWER GMBH·Filed 2020·Granted Apr 11, 2023·0 cites·3 claims
- 1658US9786627B2Method for creating a connection between metallic moulded bodies and a power semiconductor which is used to bond to thick wires or stripsBECKER MARTIN·Filed 2012·Granted Oct 10, 2017·1 cites·22 claims
- 1755US10306800B2Cooling trough, cooler and power module assemblyDANFOSS SILICON POWER GMBH·Filed 2015·Granted May 28, 2019·1 cites·17 claims
- 1855US7040381B2Cooling deviceDANFOSS SILICON POWER GMBH·Filed 2003·Granted May 9, 2006·7 cites·15 claims
- 1954US8118211B2Method for the low-temperature pressure sintering of electronic units to heat sinksEISELE RONALD·Filed 2009·Granted Feb 21, 2012·1 cites·7 claims
- 2051US9287232B2Method for producing a high-temperature and temperature-change resistant connection between a semiconductor module and a connection partnerKOCK MATHIAS·Filed 2010·Granted Mar 15, 2016·1 cites·15 claims
- 2150US10814396B2Sintering tool and method for sintering an electronic subassemblyDANFOSS SILICON POWER GMBH·Filed 2015·Granted Oct 27, 2020·0 cites·15 claims
- 2250US10403566B2Power moduleDANFOSS SILICON POWER GMBH·Filed 2016·Granted Sep 3, 2019·0 cites·11 claims
- 2349US12133366B2Power electronics module with improved coolingDANFOSS SILICON POWER GMBH·Filed 2020·Granted Oct 29, 2024·0 cites·20 claims
- 2449US12125817B2Semiconductor module with a first substrate, a second substrate and a spacer separating the substrates from each otherDANFOSS SILICON POWER GMBH·Filed 2020·Granted Oct 22, 2024·0 cites·24 claims
- 2548US11776932B2Process and device for low-temperature pressure sinteringDANFOSS SILICON POWER GMBH·Filed 2015·Granted Oct 3, 2023·0 cites·21 claims
- 2648US9318421B2Power semiconductor chip with a metallic moulded body for contacting thick wires or strips and method for the production thereofBECKER MARTIN·Filed 2012·Granted Apr 19, 2016·0 cites·18 claims
- 2744US12136585B2Compact power electronics module with increased cooling surfaceDANFOSS SILICON POWER GMBH·Filed 2020·Granted Nov 5, 2024·0 cites·20 claims
- 2844US10607962B2Method for manufacturing semiconductor chipsDANFOSS SILICON POWER GMBH·Filed 2016·Granted Mar 31, 2020·0 cites·11 claims
- 2944US10332858B2Electronic sandwich structure with two parts joined together by means of a sintering layerDANFOSS SILICON POWER GMBH·Filed 2015·Granted Jun 25, 2019·0 cites·20 claims
- 3043US2017133291A1Semiconductor module comprising an encapsulating compound that covers at least one semiconductor componentHERAEUS DEUTSCHLAND GMBH & CO KG·Filed 2015·Application pending·0 cites
- 3142US10818633B2Sintering tool for the lower die of a sintering deviceDANFOSS SILICON POWER GMBH·Filed 2015·Granted Oct 27, 2020·0 cites·18 claims
- 3242US10438924B2Method for cohesively connecting a first component of a power semiconductor module to a second component of a power semiconductor moduleDANFOSS SILICON POWER GMBH·Filed 2017·Granted Oct 8, 2019·0 cites·20 claims
- 3342US8546923B2Rigid power module suited for high-voltage applicationsEISELE RONALD·Filed 2011·Granted Oct 1, 2013·0 cites·8 claims
- 3439US6119497AMethod for use with a lathe for forming a journal on metal stockMINCO MANUFACTURING INC·Filed 1998·Granted Sep 19, 2000·7 cites·17 claims
- 3537US2021210403A1Heat spreading plate having atleast one cooling fin method for producing a heat spreading plate having atleast one cooling fin electronic moduleHERAEUS DEUTSCHLAND GMBH & CO KG·Filed 2017·Application pending·0 cites
- 3637US2021210416A1Method for producing a substrate plate, substrate plate, method for producing a semiconductor module and semiconductor moduleHERAEUS DEUTSCHLAND GMBH & CO KG·Filed 2017·Application pending·0 cites
- 3737US2021202350A1Method for producing a heat-spreading plate, heat-spreading plate, method for producing a semiconductor module and semiconductor moduleHERAEUS DEUTSCHLAND GMBH & CO KG·Filed 2017·Application pending·0 cites
- 3836US2021210406A1Method for producing a circuit carrier, circuit carrier, method for producing a semiconductor module and semiconductor moduleHERAEUSSTRASSE DEUTSCHLAND GMBH & CO KG·Filed 2017·Application pending·0 cites
- 3935US8802564B2Method of manufacturing a semiconductor componentKOCK MATHIAS·Filed 2012·Granted Aug 12, 2014·0 cites·1 claims
- 4034US2018301354A1Method for manufacturing a circuit carrierDANFOSS SILICON POWER GMBH·Filed 2016·Application pending·0 cites
- 4132US2017338193A1Power semiconductor module with short-circuit failure modeDANFOSS SILICON POWER GMBH·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →