Inventor · disambiguated record
Robert Ewald
Also filed as: EWALD ROBERT · EWALD ROBERT A
3 granted patents·8 pending applications·75 citations·filing 2000–2009
69Inventor score
Top patents by PatentIndex Score
11 records- 0189US6143080AWafer processing reactor having a gas flow control system and methodSILICON VALLEY GROUP THERMAL·Filed 2000·Granted Nov 7, 2000·70 cites·21 claims
- 0271US8012000B2Extended pad life for ECMP and barrier removalAPPLIED MATERIALS INC·Filed 2007·Granted Sep 6, 2011·2 cites·20 claims
- 0366US7344432B2Conductive pad with ion exchange membrane for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2006·Granted Mar 18, 2008·3 cites·30 claims
- 0451US2008108288A1Conductive Polishing Article for Electrochemical Mechanical PolishingHU YONGQI·Filed 2007·Application pending·0 cites
- 0547US2009264053A1Apparatus and methods for using a polishing tape cassetteAPPLIED MATERIALS INC·Filed 2009·Application pending·0 cites
- 0644US2006249395A1Process and composition for electrochemical mechanical polishingAPPLIED MATERIAL INC·Filed 2006·Application pending·0 cites
- 0743US2006169597A1Method and composition for polishing a substrateAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 0843US2007144915A1Process and composition for passivating a substrate during electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 0943US2007218587A1Soft conductive polymer processing pad and method for fabricating the sameAPPLIED MATERIALS INC·Filed 2007·Application pending·0 cites
- 1041US2004020789A1Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2003·Application pending·0 cites
- 1140US2006276111A1Conditioning element for electrochemical mechanical processingAPPLIED MATERIALS INC·Filed 2005·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Robert Ewald files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →