Inventor · disambiguated record
Robert M. Geffken
Also filed as: GEFFKEN ROBERT M · GEFFKEN ROBERT MICHAEL
44 granted patents·6 pending applications·2,506 citations·filing 1977–2009
99Inventor score
Top patents by PatentIndex Score
50 records- 0199US7071532B2Adjustable self-aligned air gap dielectric for low capacitance wiringIBM·Filed 2003·Granted Jul 4, 2006·243 cites·15 claims
- 0298US5883435APersonalization structure for semiconductor devicesIBM·Filed 1996·Granted Mar 16, 1999·316 cites·11 claims
- 0397US5985762AMethod of forming a self-aligned copper diffusion barrier in viasIBM·Filed 1997·Granted Nov 16, 1999·284 cites·12 claims
- 0496US5126006APlural level chip maskingIBM·Filed 1991·Granted Jun 30, 1992·133 cites·35 claims
- 0596US4423547AMethod for forming dense multilevel interconnection metallurgy for semiconductor devicesIBM·Filed 1981·Granted Jan 3, 1984·245 cites·8 claims
- 0691US6680514B1Contact capping local interconnectIBM·Filed 2000·Granted Jan 20, 2004·48 cites·28 claims
- 0791US6495917B1Method and structure of column interconnectIBM·Filed 2000·Granted Dec 17, 2002·71 cites·13 claims
- 0891US6426249B1Buried metal dual damascene plate capacitorIBM·Filed 2000·Granted Jul 30, 2002·64 cites·15 claims
- 0990US7291558B2Copper interconnect wiring and method of forming thereofTEL EPION INC·Filed 2005·Granted Nov 6, 2007·17 cites·60 claims
- 1090US6452251B1Damascene metal capacitorIBM·Filed 2000·Granted Sep 17, 2002·61 cites·22 claims
- 1189US6236103B1Integrated high-performance decoupling capacitor and heat sinkIBM·Filed 1999·Granted May 22, 2001·93 cites·13 claims
- 1288US7358148B2Adjustable self-aligned air gap dielectric for low capacitance wiringIBM·Filed 2006·Granted Apr 15, 2008·14 cites·4 claims
- 1388US6846741B2Sacrificial metal spacer damascene processIBM·Filed 2002·Granted Jan 25, 2005·38 cites·11 claims
- 1486US7799683B2Copper interconnect wiring and method and apparatus for forming thereofTEL EPION INC·Filed 2007·Granted Sep 21, 2010·9 cites·24 claims
- 1586US6548338B2Integrated high-performance decoupling capacitor and heat sinkIBM·Filed 2001·Granted Apr 15, 2003·39 cites·7 claims
- 1686US6498385B1Post-fuse blow corrosion prevention structure for copper fusesIBM·Filed 1999·Granted Dec 24, 2002·68 cites·11 claims
- 1786US6150723ACopper stud structure with refractory metal linerIBM·Filed 1997·Granted Nov 21, 2000·71 cites·20 claims
- 1886US4109372AMethod for making an insulated gate field effect transistor utilizing a silicon gate and silicide interconnection viasIBM·Filed 1977·Granted Aug 29, 1978·31 cites·9 claims
- 1984US6503827B1Method of reducing planarization defectsIBM·Filed 2000·Granted Jan 7, 2003·42 cites·24 claims
- 2084US6300236B1Copper stud structure with refractory metal linerIBM·Filed 2000·Granted Oct 9, 2001·33 cites·8 claims
- 2183US7759251B2Dual damascene integration structure and method for forming improved dual damascene integration structureTEL EPION CORP·Filed 2005·Granted Jul 20, 2010·11 cites·37 claims
- 2283US6888251B2Metal spacer in single and dual damascene processingIBM·Filed 2002·Granted May 3, 2005·26 cites·25 claims
- 2380US7838423B2Method of forming capping structures on one or more material layer surfacesTEL EPION INC·Filed 2009·Granted Nov 23, 2010·5 cites·32 claims
- 2480US5811870AAntifuse structureIBM·Filed 1997·Granted Sep 22, 1998·49 cites·20 claims
- 2580US5457345AMetallization composite having nickle intermediate/interfaceIBM·Filed 1994·Granted Oct 10, 1995·56 cites·11 claims
- 2679US6426558B1Metallurgy for semiconductor devicesIBM·Filed 2001·Granted Jul 30, 2002·28 cites·8 claims
- 2779US5795819AIntegrated pad and fuse structure for planar copper metallurgyIBM·Filed 1997·Granted Aug 18, 1998·49 cites·2 claims
- 2878US6939791B2Contact capping local interconnectIBM·Filed 2003·Granted Sep 6, 2005·18 cites·26 claims
- 2978US6344373B1Antifuse structure and processIBM·Filed 1998·Granted Feb 5, 2002·45 cites·26 claims
- 3078US5719070AMetallization composite having nickel intermediate/interfaceIBM·Filed 1996·Granted Feb 17, 1998·49 cites·20 claims
- 3176US6746947B2Post-fuse blow corrosion prevention structure for copper fusesIBM·Filed 2002·Granted Jun 8, 2004·20 cites·5 claims
- 3275US7381637B2Metal spacer in single and dual damascence processingIBM·Filed 2005·Granted Jun 3, 2008·5 cites·17 claims
- 3372US6674168B1Single and multilevel reworkIBM·Filed 2003·Granted Jan 6, 2004·17 cites·20 claims
- 3472US6093630ASemi-conductor personalization structure and methodIBM·Filed 1998·Granted Jul 25, 2000·36 cites·11 claims
- 3572US5731624AIntegrated pad and fuse structure for planar copper metallurgyIBM·Filed 1996·Granted Mar 24, 1998·37 cites·10 claims
- 3671US6982227B2Single and multilevel reworkIBM·Filed 2003·Granted Jan 3, 2006·16 cites·6 claims
- 3771US5898227AAlignment targets having enhanced contrastIBM·Filed 1997·Granted Apr 27, 1999·32 cites·13 claims
- 3866US7655547B2Metal spacer in single and dual damascene processingIBM·Filed 2008·Granted Feb 2, 2010·2 cites·15 claims
- 3963US7393777B2Sacrificial metal spacer damascene processIBM·Filed 2004·Granted Jul 1, 2008·8 cites·20 claims
- 4063US6180498B1Alignment targets having enhanced contrastIBM·Filed 1998·Granted Jan 30, 2001·24 cites·18 claims
- 4153US2008203579A1Sacrificial metal spacer dual damasceneIBM·Filed 2008·Application pending·0 cites
- 4251US5585674ATransverse diffusion barrier interconnect structureIBM·Filed 1995·Granted Dec 17, 1996·14 cites·15 claims
- 4350US5488013AMethod of forming transverse diffusion barrier interconnect structureIBM·Filed 1995·Granted Jan 30, 1996·14 cites·5 claims
- 4450US5339212ASidewall decoupling capacitorIBM·Filed 1992·Granted Aug 16, 1994·23 cites·13 claims
- 4550US2007275565A1Full removal of dual damascene metal levelCOONEY EDWARD C III·Filed 2007·Application pending·0 cites
- 4647US6420263B1Method for controlling extrusions in aluminum metal lines and the device formed therefromIBM·Filed 2000·Granted Jul 16, 2002·2 cites·14 claims
- 4744US2007184656A1GCIB Cluster Tool Apparatus and Method of OperationTEL EPION INC·Filed 2007·Application pending·0 cites
- 4841US2004245636A1Full removal of dual damascene metal levelIBM·Filed 2003·Application pending·0 cites
- 4937US2004152295A1Sacrificial metal liner for copperIBM·Filed 2003·Application pending·0 cites
- 5037US2004150103A1Sacrificial Metal Liner For CopperIBM·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →