Inventor · disambiguated record
Ron Huemoeller
Also filed as: HUEMOELLER RON
18 granted patents·4 pending applications·48 citations·filing 2015–2024
91Inventor score
Top patents by PatentIndex Score
22 records- 0196US9559075B1Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted Jan 31, 2017·20 cites·20 claims
- 0295US10410999B2Semiconductor device with integrated heat distribution and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2017·Granted Sep 10, 2019·14 cites·18 claims
- 0391US10504827B2Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted Dec 10, 2019·6 cites·7 claims
- 0488US11574890B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Feb 7, 2023·2 cites·16 claims
- 0585US11901343B2Semiconductor device with integrated heat distribution and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Feb 13, 2024·1 cites·20 claims
- 0683US11444013B2Semiconductor device and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2019·Granted Sep 13, 2022·2 cites·20 claims
- 0780US2024290761A1Semiconductor device with integrated heat distribution and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 0879US10438910B2Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted Oct 8, 2019·2 cites·20 claims
- 0978US2024421127A1Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 1077US2025174612A1Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 1176US12080682B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Granted Sep 3, 2024·0 cites·20 claims
- 1275US12159863B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Granted Dec 3, 2024·0 cites·16 claims
- 1375US2024355744A1Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 1472US12015000B2Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Jun 18, 2024·0 cites·20 claims
- 1571US12033946B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Jul 9, 2024·0 cites·19 claims
- 1669US9741617B2Encapsulated semiconductor package and method of manufacturing thereofAMKOR TECHNOLOGY INC·Filed 2015·Granted Aug 22, 2017·1 cites·20 claims
- 1766US11830860B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Nov 28, 2023·0 cites·18 claims
- 1864US11342268B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted May 24, 2022·0 cites·11 claims
- 1962US11018102B2Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2019·Granted May 25, 2021·0 cites·20 claims
- 2062US10985146B2Semiconductor device with integrated heat distribution and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2019·Granted Apr 20, 2021·0 cites·20 claims
- 2156US11145638B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2019·Granted Oct 12, 2021·0 cites·20 claims
- 2256US10062611B2Encapsulated semiconductor package and method of manufacturing thereofAMKOR TECHNOLOGY INC·Filed 2017·Granted Aug 28, 2018·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →