Inventor · disambiguated record
Rodney Kistler
Also filed as: KISTLER RODNEY · KISTLER RODNEY C
44 granted patents·3 pending applications·2,456 citations·filing 1989–2009
99Inventor score
Files withLAM RES CORP26CABOT MICROELECTRONICS CORP10CABOT CORP3MICRON TECHNOLOGY INC3AT & T BELL LAB2
Top patents by PatentIndex Score
47 records- 0199US5954997AChemical mechanical polishing slurry useful for copper substratesCABOT CORP·Filed 1996·Granted Sep 21, 1999·480 cites·25 claims
- 0297US6063306AChemical mechanical polishing slurry useful for copper/tantalum substrateCABOT CORP·Filed 1998·Granted May 16, 2000·372 cites·34 claims
- 0396US6217416B1Chemical mechanical polishing slurry useful for copper/tantalum substratesCABOT MICROELECTRONICS CORP·Filed 1998·Granted Apr 17, 2001·202 cites·11 claims
- 0496US5858813AChemical mechanical polishing slurry for metal layers and filmsCABOT CORP·Filed 1996·Granted Jan 12, 1999·320 cites·55 claims
- 0594US4923271AOptical multiplexer/demultiplexer using focusing Bragg reflectorsAMERICAN TELEPHONE & TELEGRAPH·Filed 1989·Granted May 8, 1990·132 cites·26 claims
- 0693US6126853AChemical mechanical polishing slurry useful for copper substratesCABOT MICROELECTRONICS CORP·Filed 1997·Granted Oct 3, 2000·116 cites·20 claims
- 0793US5195161AOptical waveguide comprising Bragg grating coupling meansAT & T BELL LAB·Filed 1991·Granted Mar 16, 1993·127 cites·10 claims
- 0892US6620037B2Chemical mechanical polishing slurry useful for copper substratesCABOT MICROELECTRONICS CORP·Filed 2002·Granted Sep 16, 2003·80 cites·28 claims
- 0990US7010468B2Method and apparatus for slope to threshold conversion for process state monitoring and endpoint detectionLAM RES CORP·Filed 2005·Granted Mar 7, 2006·16 cites·23 claims
- 1090US6447371B2Chemical mechanical polishing slurry useful for copper/tantalum substratesCABOT MICROELECTRONICS CORP·Filed 2001·Granted Sep 10, 2002·58 cites·25 claims
- 1187US6808590B1Method and apparatus of arrayed sensors for metrological controlLAM RES CORP·Filed 2002·Granted Oct 26, 2004·31 cites·18 claims
- 1285US6432828B2Chemical mechanical polishing slurry useful for copper substratesCABOT MICROELECTRONICS CORP·Filed 1998·Granted Aug 13, 2002·58 cites·19 claims
- 1385US6362106B1Chemical mechanical polishing method useful for copper substratesCABOT MICROELECTRONICS CORP·Filed 2000·Granted Mar 26, 2002·25 cites·12 claims
- 1484US6569350B2Chemical mechanical polishing slurry useful for copper substratesCABOT MICROELECTRONICS CORP·Filed 2002·Granted May 27, 2003·23 cites·41 claims
- 1583US7537511B2Embedded fiber acoustic sensor for CMP process endpointMICRON TECHNOLOGY INC·Filed 2006·Granted May 26, 2009·9 cites·23 claims
- 1683US7128803B2Integration of sensor based metrology into semiconductor processing toolsLAM RES CORP·Filed 2002·Granted Oct 31, 2006·28 cites·11 claims
- 1783US6593239B2Chemical mechanical polishing method useful for copper substratesCABOT MICROELECTRONICS CORP·Filed 1999·Granted Jul 15, 2003·56 cites·21 claims
- 1882US6579157B1Polishing pad ironing system and method for implementing the sameLAM RES CORP·Filed 2001·Granted Jun 17, 2003·19 cites·10 claims
- 1980US6984892B2Semiconductor structure implementing low-K dielectric materials and supporting stubsLAM RES CORP·Filed 2001·Granted Jan 10, 2006·23 cites·8 claims
- 2080US6929531B2System and method for metal residue detection and mapping within a multi-step sequenceLAM RES CORP·Filed 2002·Granted Aug 16, 2005·23 cites·24 claims
- 2180US6769961B1Chemical mechanical planarization (CMP) apparatusLAM RES CORP·Filed 2003·Granted Aug 3, 2004·20 cites·37 claims
- 2276US7425501B2Semiconductor structure implementing sacrificial material and methods for making and implementing the sameLAM RES CORP·Filed 2005·Granted Sep 16, 2008·5 cites·6 claims
- 2374US6653224B1Methods for fabricating interconnect structures having Low K dielectric propertiesLAM RES CORP·Filed 2001·Granted Nov 25, 2003·26 cites·19 claims
- 2473US7084621B2Enhancement of eddy current based measurement capabilitiesLAM RES CORP·Filed 2002·Granted Aug 1, 2006·10 cites·27 claims
- 2573US6752693B1Afferent-based polishing media for chemical mechanical planarizationLAM RES CORP·Filed 2002·Granted Jun 22, 2004·14 cites·12 claims
- 2673US6540587B1Infrared end-point detection systemLAM RES CORP·Filed 2000·Granted Apr 1, 2003·15 cites·25 claims
- 2773US6309560B1Chemical mechanical polishing slurry useful for copper substratesCABOT MICROELECTRONICS CORP·Filed 1997·Granted Oct 30, 2001·41 cites·19 claims
- 2873US5039190AApparatus comprising an optical gain device, and method of producing the deviceAT & T BELL LAB·Filed 1990·Granted Aug 13, 1991·32 cites·12 claims
- 2971US7294049B2Method and apparatus for removing material from microfeature workpiecesMICRON TECHNOLOGY INC·Filed 2005·Granted Nov 13, 2007·3 cites·48 claims
- 3070US7628680B2Method and apparatus for removing material from microfeature workpiecesMICRON TECHNOLOGY INC·Filed 2007·Granted Dec 8, 2009·3 cites·24 claims
- 3170US6937915B1Apparatus and methods for detecting transitions of wafer surface properties in chemical mechanical polishing for process status and controlLAM RES CORP·Filed 2002·Granted Aug 30, 2005·11 cites·16 claims
- 3268US6875322B1Electrochemical assisted CMPLAM RES CORP·Filed 2003·Granted Apr 5, 2005·11 cites·8 claims
- 3367US7309618B2Method and apparatus for real time metal film thickness measurementLAM RES CORP·Filed 2003·Granted Dec 18, 2007·10 cites·16 claims
- 3467US6925348B2Methods for detecting transitions of wafer surface properties in chemical mechanical polishing for process status and controlLAM RES CORP·Filed 2004·Granted Aug 2, 2005·9 cites·17 claims
- 3565US7381648B2Chemical mechanical polishing slurry useful for copper substratesCABOT MICROELECTRONICS CORP·Filed 2003·Granted Jun 3, 2008·7 cites·18 claims
- 3663US6890245B1Byproduct control in linear chemical mechanical planarization systemLAM RES CORP·Filed 2002·Granted May 10, 2005·9 cites·4 claims
- 3762US6859765B2Method and apparatus for slope to threshold conversion for process state monitoring and endpoint detectionLAM RES CORP·Filed 2002·Granted Feb 22, 2005·7 cites·23 claims
- 3861US7875548B2Method for making semiconductor structures implementing sacrificial materialLAM RES CORP·Filed 2008·Granted Jan 25, 2011·1 cites·12 claims
- 3957US7205166B2Method and apparatus of arrayed, clustered or coupled eddy current sensor configuration for measuring conductive film propertiesLAM RES CORP·Filed 2003·Granted Apr 17, 2007·8 cites·8 claims
- 4057US6896596B2Polishing pad ironing systemLAM RES CORP·Filed 2003·Granted May 24, 2005·5 cites·17 claims
- 4156US6894491B2Method and apparatus for metrological process control implementing complementary sensorsLAM RES CORP·Filed 2002·Granted May 17, 2005·4 cites·21 claims
- 4255US6951624B2Method and apparatus of arrayed sensors for metrological controlLAM RES CORP·Filed 2004·Granted Oct 4, 2005·5 cites·10 claims
- 4351US6922053B2Complementary sensors metrological process and method and apparatus for implementing the sameLAM RES CORP·Filed 2004·Granted Jul 26, 2005·2 cites·28 claims
- 4449US8105131B2Method and apparatus for removing material from microfeature workpiecesKISTLER RODNEY C·Filed 2009·Granted Jan 31, 2012·0 cites·20 claims
- 4539US2004011462A1Method and apparatus for applying differential removal rates to a surface of a substrateLAM RES CORP·Filed 2003·Application pending·0 cites
- 4638US2005066739A1Method and apparatus for wafer mechanical stress monitoring and wafer thermal stress monitoringLAM RES CORP·Filed 2003·Application pending·0 cites
- 4736US2007163712A1Method and apparatus of arrayed, clustered or coupled eddy current sensor configuration for measuring conductive film propertiesGOTKIS YEHIEL·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →