Inventor · disambiguated record
Robert Lanzone
Also filed as: LANZONE ROBERT
10 granted patents·2 pending applications·82 citations·filing 2010–2024
88Inventor score
Technology areasH10W
Files withAMKOR TECH SINGAPORE HOLDING PTE LTD4AMKOR TECHNOLOGY INC4LANZONE ROBERT2NANGALIA SUNDEEP NAND2
Top patents by PatentIndex Score
12 records- 0197US11488934B2Semiconductor package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Nov 1, 2022·5 cites·20 claims
- 0294US10872879B2Semiconductor package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2018·Granted Dec 22, 2020·9 cites·20 claims
- 0394US10163867B2Semiconductor package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2018·Granted Dec 25, 2018·15 cites·20 claims
- 0491US8564114B1Semiconductor package thermal tape window frame for heat sink attachmentLANZONE ROBERT·Filed 2010·Granted Oct 22, 2013·26 cites·19 claims
- 0584US9245862B1Electronic component package fabrication method and structureAMKOR TECHNOLOGY INC·Filed 2013·Granted Jan 26, 2016·10 cites·20 claims
- 0683US9875980B2Copper pillar sidewall protectionAMKOR TECHNOLOGY INC·Filed 2014·Granted Jan 23, 2018·6 cites·15 claims
- 0782US2024395771A1Semiconductor package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 0879US8664090B1Electronic component package fabrication methodNANGALIA SUNDEEP NAND·Filed 2012·Granted Mar 4, 2014·6 cites·19 claims
- 0977US12057434B2Semiconductor package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Aug 6, 2024·0 cites·20 claims
- 1076US8552557B1Electronic component package fabrication method and structureNANGALIA SUNDEEP NAND·Filed 2011·Granted Oct 8, 2013·5 cites·27 claims
- 1144US2015221570A1Thin sandwich embedded packageAMKOR TECHNOLOGY INC·Filed 2014·Application pending·0 cites
- 1241US8969192B1Low stress substrate and formation methodLANZONE ROBERT·Filed 2010·Granted Mar 3, 2015·0 cites·22 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →